JPS5648970B2 - - Google Patents
Info
- Publication number
- JPS5648970B2 JPS5648970B2 JP8457172A JP8457172A JPS5648970B2 JP S5648970 B2 JPS5648970 B2 JP S5648970B2 JP 8457172 A JP8457172 A JP 8457172A JP 8457172 A JP8457172 A JP 8457172A JP S5648970 B2 JPS5648970 B2 JP S5648970B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8457172A JPS5648970B2 (en) | 1972-08-25 | 1972-08-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8457172A JPS5648970B2 (en) | 1972-08-25 | 1972-08-25 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13883680A Division JPS5717140A (en) | 1980-10-06 | 1980-10-06 | Wire bonding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4940864A JPS4940864A (en) | 1974-04-17 |
| JPS5648970B2 true JPS5648970B2 (en) | 1981-11-19 |
Family
ID=13834342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8457172A Expired JPS5648970B2 (en) | 1972-08-25 | 1972-08-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5648970B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5647697B2 (en) * | 1973-06-26 | 1981-11-11 | ||
| JPS52117380A (en) * | 1976-03-29 | 1977-10-01 | Toyo Ink Mfg Co | Process for manufacturing laminated object |
| JPS5399288A (en) * | 1977-02-10 | 1978-08-30 | Nitto Electric Ind Co Ltd | Flexible printed circuit board |
| JPS6050587B2 (en) * | 1977-07-15 | 1985-11-09 | 大阪曹達株式会社 | Lining method |
| JP2507013Y2 (en) * | 1989-12-28 | 1996-08-14 | 日本電気株式会社 | Wire-bonding equipment |
-
1972
- 1972-08-25 JP JP8457172A patent/JPS5648970B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4940864A (en) | 1974-04-17 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 19821221 |