JPS4940864A - - Google Patents

Info

Publication number
JPS4940864A
JPS4940864A JP47084571A JP8457172A JPS4940864A JP S4940864 A JPS4940864 A JP S4940864A JP 47084571 A JP47084571 A JP 47084571A JP 8457172 A JP8457172 A JP 8457172A JP S4940864 A JPS4940864 A JP S4940864A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP47084571A
Other languages
Japanese (ja)
Other versions
JPS5648970B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8457172A priority Critical patent/JPS5648970B2/ja
Publication of JPS4940864A publication Critical patent/JPS4940864A/ja
Publication of JPS5648970B2 publication Critical patent/JPS5648970B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
JP8457172A 1972-08-25 1972-08-25 Expired JPS5648970B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8457172A JPS5648970B2 (en) 1972-08-25 1972-08-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8457172A JPS5648970B2 (en) 1972-08-25 1972-08-25

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP13883680A Division JPS5717140A (en) 1980-10-06 1980-10-06 Wire bonding device

Publications (2)

Publication Number Publication Date
JPS4940864A true JPS4940864A (en) 1974-04-17
JPS5648970B2 JPS5648970B2 (en) 1981-11-19

Family

ID=13834342

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8457172A Expired JPS5648970B2 (en) 1972-08-25 1972-08-25

Country Status (1)

Country Link
JP (1) JPS5648970B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5022574A (en) * 1973-06-26 1975-03-11
JPS52117380A (en) * 1976-03-29 1977-10-01 Toyo Ink Mfg Co Process for manufacturing laminated object
JPS5399288A (en) * 1977-02-10 1978-08-30 Nitto Electric Ind Co Ltd Flexible printed circuit board
JPS5420088A (en) * 1977-07-15 1979-02-15 Osaka Soda Co Ltd Manufacture of composite article
JPH0390442U (en) * 1989-12-28 1991-09-13

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5022574A (en) * 1973-06-26 1975-03-11
JPS5647697B2 (en) * 1973-06-26 1981-11-11
JPS52117380A (en) * 1976-03-29 1977-10-01 Toyo Ink Mfg Co Process for manufacturing laminated object
JPS5399288A (en) * 1977-02-10 1978-08-30 Nitto Electric Ind Co Ltd Flexible printed circuit board
JPS5420088A (en) * 1977-07-15 1979-02-15 Osaka Soda Co Ltd Manufacture of composite article
JPS6050587B2 (en) * 1977-07-15 1985-11-09 大阪曹達株式会社 Lining method
JPH0390442U (en) * 1989-12-28 1991-09-13

Also Published As

Publication number Publication date
JPS5648970B2 (en) 1981-11-19

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Legal Events

Date Code Title Description
A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 19821221