JP2506933Y2 - 樹脂密封型半導体装置 - Google Patents

樹脂密封型半導体装置

Info

Publication number
JP2506933Y2
JP2506933Y2 JP1833590U JP1833590U JP2506933Y2 JP 2506933 Y2 JP2506933 Y2 JP 2506933Y2 JP 1833590 U JP1833590 U JP 1833590U JP 1833590 U JP1833590 U JP 1833590U JP 2506933 Y2 JP2506933 Y2 JP 2506933Y2
Authority
JP
Japan
Prior art keywords
resin
radiator
lead wire
semiconductor device
heat radiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1833590U
Other languages
English (en)
Japanese (ja)
Other versions
JPH03110853U (enrdf_load_stackoverflow
Inventor
昭夫 朝生
一夫 小林
薫 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co Ltd filed Critical Shindengen Electric Manufacturing Co Ltd
Priority to JP1833590U priority Critical patent/JP2506933Y2/ja
Publication of JPH03110853U publication Critical patent/JPH03110853U/ja
Application granted granted Critical
Publication of JP2506933Y2 publication Critical patent/JP2506933Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1833590U 1990-02-27 1990-02-27 樹脂密封型半導体装置 Expired - Lifetime JP2506933Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1833590U JP2506933Y2 (ja) 1990-02-27 1990-02-27 樹脂密封型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1833590U JP2506933Y2 (ja) 1990-02-27 1990-02-27 樹脂密封型半導体装置

Publications (2)

Publication Number Publication Date
JPH03110853U JPH03110853U (enrdf_load_stackoverflow) 1991-11-13
JP2506933Y2 true JP2506933Y2 (ja) 1996-08-14

Family

ID=31521498

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1833590U Expired - Lifetime JP2506933Y2 (ja) 1990-02-27 1990-02-27 樹脂密封型半導体装置

Country Status (1)

Country Link
JP (1) JP2506933Y2 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH03110853U (enrdf_load_stackoverflow) 1991-11-13

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term