JP2502851Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JP2502851Y2
JP2502851Y2 JP1989098981U JP9898189U JP2502851Y2 JP 2502851 Y2 JP2502851 Y2 JP 2502851Y2 JP 1989098981 U JP1989098981 U JP 1989098981U JP 9898189 U JP9898189 U JP 9898189U JP 2502851 Y2 JP2502851 Y2 JP 2502851Y2
Authority
JP
Japan
Prior art keywords
semiconductor device
wiring conductor
high resistance
substrate
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989098981U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0338649U (enExample
Inventor
篤 丸山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP1989098981U priority Critical patent/JP2502851Y2/ja
Publication of JPH0338649U publication Critical patent/JPH0338649U/ja
Application granted granted Critical
Publication of JP2502851Y2 publication Critical patent/JP2502851Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W72/5363—

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
JP1989098981U 1989-08-24 1989-08-24 半導体装置 Expired - Lifetime JP2502851Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989098981U JP2502851Y2 (ja) 1989-08-24 1989-08-24 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989098981U JP2502851Y2 (ja) 1989-08-24 1989-08-24 半導体装置

Publications (2)

Publication Number Publication Date
JPH0338649U JPH0338649U (enExample) 1991-04-15
JP2502851Y2 true JP2502851Y2 (ja) 1996-06-26

Family

ID=31648056

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989098981U Expired - Lifetime JP2502851Y2 (ja) 1989-08-24 1989-08-24 半導体装置

Country Status (1)

Country Link
JP (1) JP2502851Y2 (enExample)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5919361A (ja) * 1982-07-24 1984-01-31 Mitsubishi Electric Corp 半導体装置

Also Published As

Publication number Publication date
JPH0338649U (enExample) 1991-04-15

Similar Documents

Publication Publication Date Title
US8013431B2 (en) Semiconductor power module package with temperature sensor mounted thereon and method of fabricating the same
US7508295B2 (en) Protection circuit
US5057811A (en) Electrothermal sensor
US7504925B2 (en) Electric component with a protected current feeding terminal
JPWO2018211735A1 (ja) 半導体装置
US6667461B1 (en) Multiple load protection and control device
JP2677735B2 (ja) 混成集積回路装置
US5652562A (en) Thermally fused resistor having a portion of a solder loop thermally connected to an electrically insulated portion of an outer surface of the resistor
US5274350A (en) Shunt apparatus for current sensing and power hybrid circuits
JP2502851Y2 (ja) 半導体装置
JP3352820B2 (ja) パワートランジスタの異常発熱保護装置
JPH0476943A (ja) 半導体素子
JP3477002B2 (ja) 半導体装置
KR920000829B1 (ko) 반도체 장치
JPH04344120A (ja) 過熱保護装置
JP2564370Y2 (ja) 電力半導体装置
JP2500773Y2 (ja) 半導体装置
JP3203157B2 (ja) 混成集積回路装置
JP5662109B2 (ja) 発熱素子の実装構造ならびに発熱素子を有する電子部品
JPH033262A (ja) 半導体装置
JPH0883880A (ja) 温度センサ付き半導体パッケージ
JPH04102365A (ja) ダイオード
JPS5873145A (ja) 半導体パツケ−ジ
JPH07220597A (ja) 回路保護素子
JP2002082134A (ja) 電流センサ、電流測定方法、及びスイッチ回路