JP2501668Y2 - 表面実装用電気部品 - Google Patents

表面実装用電気部品

Info

Publication number
JP2501668Y2
JP2501668Y2 JP1989062312U JP6231289U JP2501668Y2 JP 2501668 Y2 JP2501668 Y2 JP 2501668Y2 JP 1989062312 U JP1989062312 U JP 1989062312U JP 6231289 U JP6231289 U JP 6231289U JP 2501668 Y2 JP2501668 Y2 JP 2501668Y2
Authority
JP
Japan
Prior art keywords
lead frame
solder
lead
electric component
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989062312U
Other languages
English (en)
Japanese (ja)
Other versions
JPH032655U (US07534539-20090519-C00280.png
Inventor
富雄 佐久間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1989062312U priority Critical patent/JP2501668Y2/ja
Publication of JPH032655U publication Critical patent/JPH032655U/ja
Application granted granted Critical
Publication of JP2501668Y2 publication Critical patent/JP2501668Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1989062312U 1989-05-29 1989-05-29 表面実装用電気部品 Expired - Lifetime JP2501668Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989062312U JP2501668Y2 (ja) 1989-05-29 1989-05-29 表面実装用電気部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989062312U JP2501668Y2 (ja) 1989-05-29 1989-05-29 表面実装用電気部品

Publications (2)

Publication Number Publication Date
JPH032655U JPH032655U (US07534539-20090519-C00280.png) 1991-01-11
JP2501668Y2 true JP2501668Y2 (ja) 1996-06-19

Family

ID=31591345

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989062312U Expired - Lifetime JP2501668Y2 (ja) 1989-05-29 1989-05-29 表面実装用電気部品

Country Status (1)

Country Link
JP (1) JP2501668Y2 (US07534539-20090519-C00280.png)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5784575U (US07534539-20090519-C00280.png) * 1980-11-10 1982-05-25
JP4836738B2 (ja) 2006-10-04 2011-12-14 三洋電機株式会社 固体電解コンデンサの製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6367261U (US07534539-20090519-C00280.png) * 1986-10-23 1988-05-06
JPS6452249U (US07534539-20090519-C00280.png) * 1987-09-28 1989-03-31

Also Published As

Publication number Publication date
JPH032655U (US07534539-20090519-C00280.png) 1991-01-11

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