JP2025507454A5 - - Google Patents
Info
- Publication number
- JP2025507454A5 JP2025507454A5 JP2024541258A JP2024541258A JP2025507454A5 JP 2025507454 A5 JP2025507454 A5 JP 2025507454A5 JP 2024541258 A JP2024541258 A JP 2024541258A JP 2024541258 A JP2024541258 A JP 2024541258A JP 2025507454 A5 JP2025507454 A5 JP 2025507454A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- layer
- metal layer
- forming
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/649,965 US12261583B2 (en) | 2022-02-04 | 2022-02-04 | Stacked acoustic wave (AW) filter packages, including cross-talk reduction layers, and related fabrication methods |
| US17/649,965 | 2022-02-04 | ||
| PCT/US2023/060987 WO2023150436A1 (en) | 2022-02-04 | 2023-01-20 | Stacked acoustic wave (aw) filter packages, including cross-talk reduction layers, and related fabrication methods |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2025507454A JP2025507454A (ja) | 2025-03-19 |
| JP2025507454A5 true JP2025507454A5 (https=) | 2026-01-09 |
Family
ID=85278566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024541258A Pending JP2025507454A (ja) | 2022-02-04 | 2023-01-20 | クロストーク低減層を含む積層弾性波（ａｗ）フィルタパッケージ及び関連する製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12261583B2 (https=) |
| EP (1) | EP4473660A1 (https=) |
| JP (1) | JP2025507454A (https=) |
| KR (1) | KR20240142413A (https=) |
| CN (1) | CN118511431A (https=) |
| TW (1) | TW202335433A (https=) |
| WO (1) | WO2023150436A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7596849B1 (en) | 2003-06-11 | 2009-10-06 | Triquint Semiconductor, Inc. | Method of assembling a wafer-level package filter |
| DE102007058951B4 (de) | 2007-12-07 | 2020-03-26 | Snaptrack, Inc. | MEMS Package |
| CN107431478B (zh) * | 2015-04-01 | 2020-10-13 | 株式会社村田制作所 | 双工器 |
| WO2017110308A1 (ja) | 2015-12-21 | 2017-06-29 | 株式会社村田製作所 | 弾性波装置 |
| JP6547617B2 (ja) | 2015-12-22 | 2019-07-24 | 株式会社村田製作所 | 電子部品 |
| JP6556663B2 (ja) * | 2016-05-26 | 2019-08-07 | 太陽誘電株式会社 | 弾性波デバイス |
| WO2019130943A1 (ja) | 2017-12-26 | 2019-07-04 | 株式会社村田製作所 | 弾性波装置および弾性波モジュール |
-
2022
- 2022-02-04 US US17/649,965 patent/US12261583B2/en active Active
-
2023
- 2023-01-17 TW TW112101985A patent/TW202335433A/zh unknown
- 2023-01-20 CN CN202380015942.4A patent/CN118511431A/zh active Pending
- 2023-01-20 WO PCT/US2023/060987 patent/WO2023150436A1/en not_active Ceased
- 2023-01-20 JP JP2024541258A patent/JP2025507454A/ja active Pending
- 2023-01-20 KR KR1020247022293A patent/KR20240142413A/ko active Pending
- 2023-01-20 EP EP23705920.9A patent/EP4473660A1/en active Pending
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