TW202335433A - 包括串擾減少層的堆疊式聲波（ａｗ）濾波器封裝以及相關的製造方法 - Google Patents
包括串擾減少層的堆疊式聲波（ａｗ）濾波器封裝以及相關的製造方法 Download PDFInfo
- Publication number
- TW202335433A TW202335433A TW112101985A TW112101985A TW202335433A TW 202335433 A TW202335433 A TW 202335433A TW 112101985 A TW112101985 A TW 112101985A TW 112101985 A TW112101985 A TW 112101985A TW 202335433 A TW202335433 A TW 202335433A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- layer
- filter
- metal layer
- filter circuit
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 40
- 238000004519 manufacturing process Methods 0.000 title claims description 34
- 230000009467 reduction Effects 0.000 title description 3
- 239000000758 substrate Substances 0.000 claims abstract description 236
- 229910052751 metal Inorganic materials 0.000 claims abstract description 215
- 239000002184 metal Substances 0.000 claims abstract description 215
- 238000001465 metallisation Methods 0.000 claims abstract description 21
- 238000004891 communication Methods 0.000 claims description 18
- 239000010936 titanium Substances 0.000 claims description 16
- 229910052719 titanium Inorganic materials 0.000 claims description 14
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 230000008878 coupling Effects 0.000 claims description 8
- 238000010168 coupling process Methods 0.000 claims description 8
- 238000005859 coupling reaction Methods 0.000 claims description 8
- 230000001413 cellular effect Effects 0.000 claims description 5
- 238000000059 patterning Methods 0.000 claims description 3
- 230000000977 initiatory effect Effects 0.000 claims 1
- 238000002955 isolation Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 18
- 230000008569 process Effects 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 8
- 238000012545 processing Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000003491 array Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 229910003327 LiNbO3 Inorganic materials 0.000 description 1
- 229910012463 LiTaO3 Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 150000003608 titanium Chemical class 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02913—Measures for shielding against electromagnetic fields
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/105—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the BAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
- H03H9/6489—Compensation of undesirable effects
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/72—Networks using surface acoustic waves
- H03H9/725—Duplexers
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/649,965 US12261583B2 (en) | 2022-02-04 | 2022-02-04 | Stacked acoustic wave (AW) filter packages, including cross-talk reduction layers, and related fabrication methods |
| US17/649,965 | 2022-02-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202335433A true TW202335433A (zh) | 2023-09-01 |
Family
ID=85278566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112101985A TW202335433A (zh) | 2022-02-04 | 2023-01-17 | 包括串擾減少層的堆疊式聲波（ａｗ）濾波器封裝以及相關的製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12261583B2 (https=) |
| EP (1) | EP4473660A1 (https=) |
| JP (1) | JP2025507454A (https=) |
| KR (1) | KR20240142413A (https=) |
| CN (1) | CN118511431A (https=) |
| TW (1) | TW202335433A (https=) |
| WO (1) | WO2023150436A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7596849B1 (en) | 2003-06-11 | 2009-10-06 | Triquint Semiconductor, Inc. | Method of assembling a wafer-level package filter |
| DE102007058951B4 (de) | 2007-12-07 | 2020-03-26 | Snaptrack, Inc. | MEMS Package |
| CN107431478B (zh) * | 2015-04-01 | 2020-10-13 | 株式会社村田制作所 | 双工器 |
| WO2017110308A1 (ja) | 2015-12-21 | 2017-06-29 | 株式会社村田製作所 | 弾性波装置 |
| JP6547617B2 (ja) | 2015-12-22 | 2019-07-24 | 株式会社村田製作所 | 電子部品 |
| JP6556663B2 (ja) * | 2016-05-26 | 2019-08-07 | 太陽誘電株式会社 | 弾性波デバイス |
| WO2019130943A1 (ja) | 2017-12-26 | 2019-07-04 | 株式会社村田製作所 | 弾性波装置および弾性波モジュール |
-
2022
- 2022-02-04 US US17/649,965 patent/US12261583B2/en active Active
-
2023
- 2023-01-17 TW TW112101985A patent/TW202335433A/zh unknown
- 2023-01-20 CN CN202380015942.4A patent/CN118511431A/zh active Pending
- 2023-01-20 WO PCT/US2023/060987 patent/WO2023150436A1/en not_active Ceased
- 2023-01-20 JP JP2024541258A patent/JP2025507454A/ja active Pending
- 2023-01-20 KR KR1020247022293A patent/KR20240142413A/ko active Pending
- 2023-01-20 EP EP23705920.9A patent/EP4473660A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023150436A1 (en) | 2023-08-10 |
| JP2025507454A (ja) | 2025-03-19 |
| EP4473660A1 (en) | 2024-12-11 |
| US12261583B2 (en) | 2025-03-25 |
| KR20240142413A (ko) | 2024-09-30 |
| CN118511431A (zh) | 2024-08-16 |
| US20230253950A1 (en) | 2023-08-10 |
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