KR20240142413A - 크로스-토크 감소 층들을 포함하는 적층형 음향파(aw) 필터 패키지 및 관련 제조 방법 - Google Patents

크로스-토크 감소 층들을 포함하는 적층형 음향파(aw) 필터 패키지 및 관련 제조 방법 Download PDF

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Publication number
KR20240142413A
KR20240142413A KR1020247022293A KR20247022293A KR20240142413A KR 20240142413 A KR20240142413 A KR 20240142413A KR 1020247022293 A KR1020247022293 A KR 1020247022293A KR 20247022293 A KR20247022293 A KR 20247022293A KR 20240142413 A KR20240142413 A KR 20240142413A
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KR
South Korea
Prior art keywords
substrate
filter
metal layer
layer
filter circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247022293A
Other languages
English (en)
Korean (ko)
Inventor
시모네 콜라산티
나디네 에르하르트-에겔러
슈테판 레오폴트 하츨
마누엘 호퍼
페터 키르히호퍼
폴커 슐츠
Original Assignee
알에프360 싱가포르 피티이 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 알에프360 싱가포르 피티이 리미티드 filed Critical 알에프360 싱가포르 피티이 리미티드
Publication of KR20240142413A publication Critical patent/KR20240142413A/ko
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02913—Measures for shielding against electromagnetic fields
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/105—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the BAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H03H9/6489—Compensation of undesirable effects
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
    • H03H9/72—Networks using surface acoustic waves
    • H03H9/725—Duplexers

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
KR1020247022293A 2022-02-04 2023-01-20 크로스-토크 감소 층들을 포함하는 적층형 음향파(aw) 필터 패키지 및 관련 제조 방법 Pending KR20240142413A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/649,965 US12261583B2 (en) 2022-02-04 2022-02-04 Stacked acoustic wave (AW) filter packages, including cross-talk reduction layers, and related fabrication methods
US17/649,965 2022-02-04
PCT/US2023/060987 WO2023150436A1 (en) 2022-02-04 2023-01-20 Stacked acoustic wave (aw) filter packages, including cross-talk reduction layers, and related fabrication methods

Publications (1)

Publication Number Publication Date
KR20240142413A true KR20240142413A (ko) 2024-09-30

Family

ID=85278566

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247022293A Pending KR20240142413A (ko) 2022-02-04 2023-01-20 크로스-토크 감소 층들을 포함하는 적층형 음향파(aw) 필터 패키지 및 관련 제조 방법

Country Status (7)

Country Link
US (1) US12261583B2 (https=)
EP (1) EP4473660A1 (https=)
JP (1) JP2025507454A (https=)
KR (1) KR20240142413A (https=)
CN (1) CN118511431A (https=)
TW (1) TW202335433A (https=)
WO (1) WO2023150436A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7596849B1 (en) 2003-06-11 2009-10-06 Triquint Semiconductor, Inc. Method of assembling a wafer-level package filter
DE102007058951B4 (de) 2007-12-07 2020-03-26 Snaptrack, Inc. MEMS Package
CN107431478B (zh) * 2015-04-01 2020-10-13 株式会社村田制作所 双工器
WO2017110308A1 (ja) 2015-12-21 2017-06-29 株式会社村田製作所 弾性波装置
JP6547617B2 (ja) 2015-12-22 2019-07-24 株式会社村田製作所 電子部品
JP6556663B2 (ja) * 2016-05-26 2019-08-07 太陽誘電株式会社 弾性波デバイス
WO2019130943A1 (ja) 2017-12-26 2019-07-04 株式会社村田製作所 弾性波装置および弾性波モジュール

Also Published As

Publication number Publication date
WO2023150436A1 (en) 2023-08-10
TW202335433A (zh) 2023-09-01
JP2025507454A (ja) 2025-03-19
EP4473660A1 (en) 2024-12-11
US12261583B2 (en) 2025-03-25
CN118511431A (zh) 2024-08-16
US20230253950A1 (en) 2023-08-10

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St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

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D18 Deferred examination requested

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D18-EXM-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

D18-X000 Deferred examination requested

St.27 status event code: A-1-2-D10-D18-exm-X000