JP2023547063A5 - - Google Patents
Info
- Publication number
- JP2023547063A5 JP2023547063A5 JP2023523111A JP2023523111A JP2023547063A5 JP 2023547063 A5 JP2023547063 A5 JP 2023547063A5 JP 2023523111 A JP2023523111 A JP 2023523111A JP 2023523111 A JP2023523111 A JP 2023523111A JP 2023547063 A5 JP2023547063 A5 JP 2023547063A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- electroacoustic device
- lower electrode
- disposed
- electrode layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202063106727P | 2020-10-28 | 2020-10-28 | |
| US63/106,727 | 2020-10-28 | ||
| US17/459,325 US11916537B2 (en) | 2020-10-28 | 2021-08-27 | Electroacoustic device with conductive acoustic mirrors |
| US17/459,325 | 2021-08-27 | ||
| PCT/EP2021/074323 WO2022089816A1 (en) | 2020-10-28 | 2021-09-03 | Electroacoustic device with conductive acoustic mirrors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2023547063A JP2023547063A (ja) | 2023-11-09 |
| JP2023547063A5 true JP2023547063A5 (https=) | 2024-08-14 |
Family
ID=81257195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023523111A Pending JP2023547063A (ja) | 2020-10-28 | 2021-09-03 | 導電性音響ミラーを有する電気音響デバイス |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11916537B2 (https=) |
| EP (1) | EP4238215A1 (https=) |
| JP (1) | JP2023547063A (https=) |
| KR (1) | KR20230093261A (https=) |
| CN (1) | CN116325497B (https=) |
| WO (1) | WO2022089816A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102023203143A1 (de) * | 2023-04-05 | 2024-10-10 | Robert Bosch Gesellschaft mit beschränkter Haftung | Akustischer Wellenresonator |
| US12597909B2 (en) | 2023-12-27 | 2026-04-07 | Rf360 Singapore Pte. Ltd. | Bulk acoustic wave device including patterned acoustic mirror layers to reduce effective thickness and related methods |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7466213B2 (en) * | 2003-10-06 | 2008-12-16 | Nxp B.V. | Resonator structure and method of producing it |
| JP4791181B2 (ja) * | 2005-12-28 | 2011-10-12 | 京セラ株式会社 | 薄膜バルク音響波共振子、それを備えるフィルタおよび通信装置ならびに薄膜バルク音響波共振子の製造方法 |
| JP4924993B2 (ja) * | 2006-08-25 | 2012-04-25 | 宇部興産株式会社 | 薄膜圧電共振器とその製造方法 |
| JPWO2009013938A1 (ja) * | 2007-07-20 | 2010-09-30 | 株式会社村田製作所 | 圧電共振子及び圧電フィルタ装置 |
| US7869187B2 (en) | 2007-09-04 | 2011-01-11 | Paratek Microwave, Inc. | Acoustic bandgap structures adapted to suppress parasitic resonances in tunable ferroelectric capacitors and method of operation and fabrication therefore |
| KR100881276B1 (ko) * | 2007-09-07 | 2009-02-05 | 주식회사 동부하이텍 | 이미지 센서 및 그 제조방법 |
| DE102008029378B4 (de) * | 2008-06-20 | 2010-04-15 | Siemens Aktiengesellschaft | Anordnung eines piezoakustischen Resonators auf einem akustischen Spiegel eines Substrats, Verfahren zum Herstellen der Anordnung und Verwendung der Anordnung |
| DE102009011639B4 (de) * | 2009-03-04 | 2013-08-29 | Epcos Ag | Reaktanzfilter mit steiler Flanke und dessen Verwendung als Sendefilter in einem Duplexer |
| CN104979468A (zh) * | 2014-04-10 | 2015-10-14 | 中芯国际集成电路制造(上海)有限公司 | 一种半导体器件及其制造方法 |
| US11736177B2 (en) * | 2016-03-11 | 2023-08-22 | Akoustis Inc. | Front end modules for 5.6 GHz and 6.6 GHz Wi-Fi acoustic wave resonator RF filter circuits |
| WO2018009156A1 (en) * | 2016-07-02 | 2018-01-11 | Intel Corporation | Rram devices and their methods of fabrication |
| DE102016124236B4 (de) | 2016-12-13 | 2018-07-26 | Snaptrack, Inc. | BAW-Resonator |
| US10636776B2 (en) | 2018-02-28 | 2020-04-28 | Globalfoundries Inc. | Methods of manufacturing RF filters |
| US11770979B2 (en) * | 2018-06-29 | 2023-09-26 | Intel Corporation | Conductive alloy layer in magnetic memory devices and methods of fabrication |
| US12155368B2 (en) * | 2018-07-20 | 2024-11-26 | Global Communication Semiconductors, Llc | Support structure for bulk acoustic wave resonator |
| US10971684B2 (en) * | 2018-10-30 | 2021-04-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Intercalated metal/dielectric structure for nonvolatile memory devices |
| CN111030631B (zh) * | 2019-12-26 | 2023-10-27 | 武汉衍熙微器件有限公司 | 声波器件的制作方法及声波器件 |
| CN111049490B (zh) * | 2019-12-31 | 2020-09-15 | 诺思(天津)微系统有限责任公司 | 带电学隔离层的体声波谐振器及其制造方法、滤波器及电子设备 |
| CN111245387B (zh) * | 2020-02-14 | 2021-05-25 | 见闻录(浙江)半导体有限公司 | 一种固态装配谐振器的结构及制作工艺 |
| US11646715B2 (en) * | 2020-06-22 | 2023-05-09 | Shenzhen Sunway Communication Co., Ltd. | Filter device, RF front-end device and wireless communication device |
-
2021
- 2021-08-27 US US17/459,325 patent/US11916537B2/en active Active
- 2021-09-03 CN CN202180068590.XA patent/CN116325497B/zh active Active
- 2021-09-03 WO PCT/EP2021/074323 patent/WO2022089816A1/en not_active Ceased
- 2021-09-03 JP JP2023523111A patent/JP2023547063A/ja active Pending
- 2021-09-03 KR KR1020237013437A patent/KR20230093261A/ko active Pending
- 2021-09-03 EP EP21772780.9A patent/EP4238215A1/en active Pending
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