JP2023547063A - 導電性音響ミラーを有する電気音響デバイス - Google Patents
導電性音響ミラーを有する電気音響デバイス Download PDFInfo
- Publication number
- JP2023547063A JP2023547063A JP2023523111A JP2023523111A JP2023547063A JP 2023547063 A JP2023547063 A JP 2023547063A JP 2023523111 A JP2023523111 A JP 2023523111A JP 2023523111 A JP2023523111 A JP 2023523111A JP 2023547063 A JP2023547063 A JP 2023547063A
- Authority
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- Japan
- Prior art keywords
- layer
- electroacoustic device
- disposed
- electrode layer
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/175—Acoustic mirrors
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02102—Means for compensation or elimination of undesirable effects of temperature influence
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
- H03H9/131—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials consisting of a multilayered structure
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/56—Monolithic crystal filters
- H03H9/566—Electric coupling means therefor
- H03H9/568—Electric coupling means therefor consisting of a ladder configuration
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H2003/025—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks comprising an acoustic mirror
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202063106727P | 2020-10-28 | 2020-10-28 | |
| US63/106,727 | 2020-10-28 | ||
| US17/459,325 US11916537B2 (en) | 2020-10-28 | 2021-08-27 | Electroacoustic device with conductive acoustic mirrors |
| US17/459,325 | 2021-08-27 | ||
| PCT/EP2021/074323 WO2022089816A1 (en) | 2020-10-28 | 2021-09-03 | Electroacoustic device with conductive acoustic mirrors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2023547063A true JP2023547063A (ja) | 2023-11-09 |
| JP2023547063A5 JP2023547063A5 (https=) | 2024-08-14 |
Family
ID=81257195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023523111A Pending JP2023547063A (ja) | 2020-10-28 | 2021-09-03 | 導電性音響ミラーを有する電気音響デバイス |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11916537B2 (https=) |
| EP (1) | EP4238215A1 (https=) |
| JP (1) | JP2023547063A (https=) |
| KR (1) | KR20230093261A (https=) |
| CN (1) | CN116325497B (https=) |
| WO (1) | WO2022089816A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102023203143A1 (de) * | 2023-04-05 | 2024-10-10 | Robert Bosch Gesellschaft mit beschränkter Haftung | Akustischer Wellenresonator |
| US12597909B2 (en) | 2023-12-27 | 2026-04-07 | Rf360 Singapore Pte. Ltd. | Bulk acoustic wave device including patterned acoustic mirror layers to reduce effective thickness and related methods |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007181147A (ja) * | 2005-12-28 | 2007-07-12 | Kyocera Corp | 薄膜バルク音響波共振子、それを備えるフィルタおよび通信装置ならびに薄膜バルク音響波共振子の製造方法 |
| US20090059464A1 (en) * | 2007-09-04 | 2009-03-05 | Mckinzie Iii William E | Acoustic bandgap structures adapted to suppress parasitic resonances in tunable ferroelectric capacitors and method of operation and fabrication therefore |
| JPWO2008032543A1 (ja) * | 2006-08-25 | 2010-01-21 | 宇部興産株式会社 | 薄膜圧電共振器とその製造方法 |
| JPWO2009013938A1 (ja) * | 2007-07-20 | 2010-09-30 | 株式会社村田製作所 | 圧電共振子及び圧電フィルタ装置 |
| JP2012519447A (ja) * | 2009-03-04 | 2012-08-23 | エプコス アクチエンゲゼルシャフト | 急峻なエッジを有するリアクタンスフィルタ |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7466213B2 (en) * | 2003-10-06 | 2008-12-16 | Nxp B.V. | Resonator structure and method of producing it |
| KR100881276B1 (ko) * | 2007-09-07 | 2009-02-05 | 주식회사 동부하이텍 | 이미지 센서 및 그 제조방법 |
| DE102008029378B4 (de) * | 2008-06-20 | 2010-04-15 | Siemens Aktiengesellschaft | Anordnung eines piezoakustischen Resonators auf einem akustischen Spiegel eines Substrats, Verfahren zum Herstellen der Anordnung und Verwendung der Anordnung |
| CN104979468A (zh) * | 2014-04-10 | 2015-10-14 | 中芯国际集成电路制造(上海)有限公司 | 一种半导体器件及其制造方法 |
| US11736177B2 (en) * | 2016-03-11 | 2023-08-22 | Akoustis Inc. | Front end modules for 5.6 GHz and 6.6 GHz Wi-Fi acoustic wave resonator RF filter circuits |
| WO2018009156A1 (en) * | 2016-07-02 | 2018-01-11 | Intel Corporation | Rram devices and their methods of fabrication |
| DE102016124236B4 (de) | 2016-12-13 | 2018-07-26 | Snaptrack, Inc. | BAW-Resonator |
| US10636776B2 (en) | 2018-02-28 | 2020-04-28 | Globalfoundries Inc. | Methods of manufacturing RF filters |
| US11770979B2 (en) * | 2018-06-29 | 2023-09-26 | Intel Corporation | Conductive alloy layer in magnetic memory devices and methods of fabrication |
| US12155368B2 (en) * | 2018-07-20 | 2024-11-26 | Global Communication Semiconductors, Llc | Support structure for bulk acoustic wave resonator |
| US10971684B2 (en) * | 2018-10-30 | 2021-04-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Intercalated metal/dielectric structure for nonvolatile memory devices |
| CN111030631B (zh) * | 2019-12-26 | 2023-10-27 | 武汉衍熙微器件有限公司 | 声波器件的制作方法及声波器件 |
| CN111049490B (zh) * | 2019-12-31 | 2020-09-15 | 诺思(天津)微系统有限责任公司 | 带电学隔离层的体声波谐振器及其制造方法、滤波器及电子设备 |
| CN111245387B (zh) * | 2020-02-14 | 2021-05-25 | 见闻录(浙江)半导体有限公司 | 一种固态装配谐振器的结构及制作工艺 |
| US11646715B2 (en) * | 2020-06-22 | 2023-05-09 | Shenzhen Sunway Communication Co., Ltd. | Filter device, RF front-end device and wireless communication device |
-
2021
- 2021-08-27 US US17/459,325 patent/US11916537B2/en active Active
- 2021-09-03 CN CN202180068590.XA patent/CN116325497B/zh active Active
- 2021-09-03 WO PCT/EP2021/074323 patent/WO2022089816A1/en not_active Ceased
- 2021-09-03 JP JP2023523111A patent/JP2023547063A/ja active Pending
- 2021-09-03 KR KR1020237013437A patent/KR20230093261A/ko active Pending
- 2021-09-03 EP EP21772780.9A patent/EP4238215A1/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007181147A (ja) * | 2005-12-28 | 2007-07-12 | Kyocera Corp | 薄膜バルク音響波共振子、それを備えるフィルタおよび通信装置ならびに薄膜バルク音響波共振子の製造方法 |
| JPWO2008032543A1 (ja) * | 2006-08-25 | 2010-01-21 | 宇部興産株式会社 | 薄膜圧電共振器とその製造方法 |
| JPWO2009013938A1 (ja) * | 2007-07-20 | 2010-09-30 | 株式会社村田製作所 | 圧電共振子及び圧電フィルタ装置 |
| US20090059464A1 (en) * | 2007-09-04 | 2009-03-05 | Mckinzie Iii William E | Acoustic bandgap structures adapted to suppress parasitic resonances in tunable ferroelectric capacitors and method of operation and fabrication therefore |
| JP2012519447A (ja) * | 2009-03-04 | 2012-08-23 | エプコス アクチエンゲゼルシャフト | 急峻なエッジを有するリアクタンスフィルタ |
Also Published As
| Publication number | Publication date |
|---|---|
| US20220131523A1 (en) | 2022-04-28 |
| CN116325497B (zh) | 2026-01-09 |
| WO2022089816A1 (en) | 2022-05-05 |
| KR20230093261A (ko) | 2023-06-27 |
| EP4238215A1 (en) | 2023-09-06 |
| CN116325497A (zh) | 2023-06-23 |
| US11916537B2 (en) | 2024-02-27 |
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