JP2024532100A5 - - Google Patents
Info
- Publication number
- JP2024532100A5 JP2024532100A5 JP2024508487A JP2024508487A JP2024532100A5 JP 2024532100 A5 JP2024532100 A5 JP 2024532100A5 JP 2024508487 A JP2024508487 A JP 2024508487A JP 2024508487 A JP2024508487 A JP 2024508487A JP 2024532100 A5 JP2024532100 A5 JP 2024532100A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- frame
- cap substrate
- cavity
- cavity frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/409,282 US11984874B2 (en) | 2021-08-23 | 2021-08-23 | Surface acoustic wave (SAW) filter packages employing an enhanced thermally conductive cavity frame for heat dissipation, and related fabrication methods |
| US17/409,282 | 2021-08-23 | ||
| PCT/US2022/073354 WO2023028392A1 (en) | 2021-08-23 | 2022-07-01 | Surface acoustic wave (saw) filter packages employing an enhanced thermally conductive cavity frame for heat dissipation, and related fabrication methods |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024532100A JP2024532100A (ja) | 2024-09-05 |
| JP2024532100A5 true JP2024532100A5 (https=) | 2025-06-11 |
Family
ID=82748204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024508487A Pending JP2024532100A (ja) | 2021-08-23 | 2022-07-01 | 放熱のための強化熱伝導性キャビティフレームを採用する表面弾性波（ｓａｗ）フィルタパッケージ、及び関連する製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11984874B2 (https=) |
| EP (1) | EP4393060A1 (https=) |
| JP (1) | JP2024532100A (https=) |
| KR (1) | KR20240047379A (https=) |
| CN (1) | CN117795849A (https=) |
| TW (1) | TW202322557A (https=) |
| WO (1) | WO2023028392A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12562711B2 (en) * | 2021-07-15 | 2026-02-24 | Skyworks Solutions, Inc. | Wafer level package having enhanced thermal dissipation |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004129223A (ja) | 2002-07-31 | 2004-04-22 | Murata Mfg Co Ltd | 圧電部品およびその製造方法 |
| DE102005026243B4 (de) | 2005-06-07 | 2018-04-05 | Snaptrack, Inc. | Elektrisches Bauelement und Herstellungsverfahren |
| JP2007158989A (ja) * | 2005-12-08 | 2007-06-21 | Matsushita Electric Ind Co Ltd | 電子部品 |
| DE102007058951B4 (de) * | 2007-12-07 | 2020-03-26 | Snaptrack, Inc. | MEMS Package |
| JP6242597B2 (ja) | 2013-06-03 | 2017-12-06 | 太陽誘電株式会社 | 弾性波デバイス及びその製造方法 |
| US11764750B2 (en) * | 2018-07-20 | 2023-09-19 | Global Communication Semiconductors, Llc | Support structure for bulk acoustic wave resonator |
| US11588465B2 (en) | 2019-11-26 | 2023-02-21 | Skyworks Solutions, Inc. | Stacked temperature compensated acoustic wave device with high thermal conductivity |
| CN111654259A (zh) * | 2020-05-13 | 2020-09-11 | 深圳市信维通信股份有限公司 | 一种体声波谐振装置、一种滤波装置及一种射频前端装置 |
| US12329035B2 (en) * | 2021-06-29 | 2025-06-10 | Global Communication Semiconductors, Llc | Bulk acoustic wave resonator with improved structures |
-
2021
- 2021-08-23 US US17/409,282 patent/US11984874B2/en active Active
-
2022
- 2022-07-01 WO PCT/US2022/073354 patent/WO2023028392A1/en not_active Ceased
- 2022-07-01 TW TW111124668A patent/TW202322557A/zh unknown
- 2022-07-01 EP EP22748693.3A patent/EP4393060A1/en active Pending
- 2022-07-01 JP JP2024508487A patent/JP2024532100A/ja active Pending
- 2022-07-01 CN CN202280054931.2A patent/CN117795849A/zh active Pending
- 2022-07-01 KR KR1020247005296A patent/KR20240047379A/ko active Pending
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