KR20240047379A - 열 소산을 위해 향상된 열 전도성 공동 프레임을 이용한 표면 탄성파(saw) 필터 패키지들 및 관련 제작 방법들 - Google Patents

열 소산을 위해 향상된 열 전도성 공동 프레임을 이용한 표면 탄성파(saw) 필터 패키지들 및 관련 제작 방법들 Download PDF

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Publication number
KR20240047379A
KR20240047379A KR1020247005296A KR20247005296A KR20240047379A KR 20240047379 A KR20240047379 A KR 20240047379A KR 1020247005296 A KR1020247005296 A KR 1020247005296A KR 20247005296 A KR20247005296 A KR 20247005296A KR 20240047379 A KR20240047379 A KR 20240047379A
Authority
KR
South Korea
Prior art keywords
frame
substrate
cap substrate
cavity
saw filter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247005296A
Other languages
English (en)
Korean (ko)
Inventor
라나딥 두타
종해 김
저-시웅 란
Original Assignee
퀄컴 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 퀄컴 인코포레이티드 filed Critical 퀄컴 인코포레이티드
Publication of KR20240047379A publication Critical patent/KR20240047379A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H03H9/6406—Filters characterised by a particular frequency characteristic
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H03H3/10—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves for obtaining desired frequency or temperature coefficient
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02834—Means for compensation or elimination of undesirable effects of temperature influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/058—Holders or supports for surface acoustic wave devices
    • H03H9/059—Holders or supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020247005296A 2021-08-23 2022-07-01 열 소산을 위해 향상된 열 전도성 공동 프레임을 이용한 표면 탄성파(saw) 필터 패키지들 및 관련 제작 방법들 Pending KR20240047379A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/409,282 US11984874B2 (en) 2021-08-23 2021-08-23 Surface acoustic wave (SAW) filter packages employing an enhanced thermally conductive cavity frame for heat dissipation, and related fabrication methods
US17/409,282 2021-08-23
PCT/US2022/073354 WO2023028392A1 (en) 2021-08-23 2022-07-01 Surface acoustic wave (saw) filter packages employing an enhanced thermally conductive cavity frame for heat dissipation, and related fabrication methods

Publications (1)

Publication Number Publication Date
KR20240047379A true KR20240047379A (ko) 2024-04-12

Family

ID=82748204

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247005296A Pending KR20240047379A (ko) 2021-08-23 2022-07-01 열 소산을 위해 향상된 열 전도성 공동 프레임을 이용한 표면 탄성파(saw) 필터 패키지들 및 관련 제작 방법들

Country Status (7)

Country Link
US (1) US11984874B2 (https=)
EP (1) EP4393060A1 (https=)
JP (1) JP2024532100A (https=)
KR (1) KR20240047379A (https=)
CN (1) CN117795849A (https=)
TW (1) TW202322557A (https=)
WO (1) WO2023028392A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12562711B2 (en) * 2021-07-15 2026-02-24 Skyworks Solutions, Inc. Wafer level package having enhanced thermal dissipation

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004129223A (ja) 2002-07-31 2004-04-22 Murata Mfg Co Ltd 圧電部品およびその製造方法
DE102005026243B4 (de) 2005-06-07 2018-04-05 Snaptrack, Inc. Elektrisches Bauelement und Herstellungsverfahren
JP2007158989A (ja) * 2005-12-08 2007-06-21 Matsushita Electric Ind Co Ltd 電子部品
DE102007058951B4 (de) * 2007-12-07 2020-03-26 Snaptrack, Inc. MEMS Package
JP6242597B2 (ja) 2013-06-03 2017-12-06 太陽誘電株式会社 弾性波デバイス及びその製造方法
US11764750B2 (en) * 2018-07-20 2023-09-19 Global Communication Semiconductors, Llc Support structure for bulk acoustic wave resonator
US11588465B2 (en) 2019-11-26 2023-02-21 Skyworks Solutions, Inc. Stacked temperature compensated acoustic wave device with high thermal conductivity
CN111654259A (zh) * 2020-05-13 2020-09-11 深圳市信维通信股份有限公司 一种体声波谐振装置、一种滤波装置及一种射频前端装置
US12329035B2 (en) * 2021-06-29 2025-06-10 Global Communication Semiconductors, Llc Bulk acoustic wave resonator with improved structures

Also Published As

Publication number Publication date
TW202322557A (zh) 2023-06-01
EP4393060A1 (en) 2024-07-03
US20230054636A1 (en) 2023-02-23
JP2024532100A (ja) 2024-09-05
CN117795849A (zh) 2024-03-29
WO2023028392A1 (en) 2023-03-02
US11984874B2 (en) 2024-05-14

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Date Code Title Description
PA0105 International application

Patent event date: 20240215

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20250613

Comment text: Request for Examination of Application