CN117795849A - 采用用于散热的增强型导热腔框架的表面声波（saw）滤波器封装及相关制造方法 - Google Patents

采用用于散热的增强型导热腔框架的表面声波（saw）滤波器封装及相关制造方法 Download PDF

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Publication number
CN117795849A
CN117795849A CN202280054931.2A CN202280054931A CN117795849A CN 117795849 A CN117795849 A CN 117795849A CN 202280054931 A CN202280054931 A CN 202280054931A CN 117795849 A CN117795849 A CN 117795849A
Authority
CN
China
Prior art keywords
frame
substrate
cover substrate
cavity
saw filter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280054931.2A
Other languages
English (en)
Chinese (zh)
Inventor
R·达塔
金钟海
J-H·兰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qualcomm Inc
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of CN117795849A publication Critical patent/CN117795849A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H03H9/6406—Filters characterised by a particular frequency characteristic
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H03H3/10—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves for obtaining desired frequency or temperature coefficient
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02834—Means for compensation or elimination of undesirable effects of temperature influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/058—Holders or supports for surface acoustic wave devices
    • H03H9/059—Holders or supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202280054931.2A 2021-08-23 2022-07-01 采用用于散热的增强型导热腔框架的表面声波（saw）滤波器封装及相关制造方法 Pending CN117795849A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/409,282 US11984874B2 (en) 2021-08-23 2021-08-23 Surface acoustic wave (SAW) filter packages employing an enhanced thermally conductive cavity frame for heat dissipation, and related fabrication methods
US17/409,282 2021-08-23
PCT/US2022/073354 WO2023028392A1 (en) 2021-08-23 2022-07-01 Surface acoustic wave (saw) filter packages employing an enhanced thermally conductive cavity frame for heat dissipation, and related fabrication methods

Publications (1)

Publication Number Publication Date
CN117795849A true CN117795849A (zh) 2024-03-29

Family

ID=82748204

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280054931.2A Pending CN117795849A (zh) 2021-08-23 2022-07-01 采用用于散热的增强型导热腔框架的表面声波（saw）滤波器封装及相关制造方法

Country Status (7)

Country Link
US (1) US11984874B2 (https=)
EP (1) EP4393060A1 (https=)
JP (1) JP2024532100A (https=)
KR (1) KR20240047379A (https=)
CN (1) CN117795849A (https=)
TW (1) TW202322557A (https=)
WO (1) WO2023028392A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12562711B2 (en) * 2021-07-15 2026-02-24 Skyworks Solutions, Inc. Wafer level package having enhanced thermal dissipation

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004129223A (ja) 2002-07-31 2004-04-22 Murata Mfg Co Ltd 圧電部品およびその製造方法
DE102005026243B4 (de) 2005-06-07 2018-04-05 Snaptrack, Inc. Elektrisches Bauelement und Herstellungsverfahren
JP2007158989A (ja) * 2005-12-08 2007-06-21 Matsushita Electric Ind Co Ltd 電子部品
DE102007058951B4 (de) * 2007-12-07 2020-03-26 Snaptrack, Inc. MEMS Package
JP6242597B2 (ja) 2013-06-03 2017-12-06 太陽誘電株式会社 弾性波デバイス及びその製造方法
US11764750B2 (en) * 2018-07-20 2023-09-19 Global Communication Semiconductors, Llc Support structure for bulk acoustic wave resonator
US11588465B2 (en) 2019-11-26 2023-02-21 Skyworks Solutions, Inc. Stacked temperature compensated acoustic wave device with high thermal conductivity
CN111654259A (zh) * 2020-05-13 2020-09-11 深圳市信维通信股份有限公司 一种体声波谐振装置、一种滤波装置及一种射频前端装置
US12329035B2 (en) * 2021-06-29 2025-06-10 Global Communication Semiconductors, Llc Bulk acoustic wave resonator with improved structures

Also Published As

Publication number Publication date
TW202322557A (zh) 2023-06-01
EP4393060A1 (en) 2024-07-03
US20230054636A1 (en) 2023-02-23
JP2024532100A (ja) 2024-09-05
KR20240047379A (ko) 2024-04-12
WO2023028392A1 (en) 2023-03-02
US11984874B2 (en) 2024-05-14

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