JP2024532100A - 放熱のための強化熱伝導性キャビティフレームを採用する表面弾性波（ｓａｗ）フィルタパッケージ、及び関連する製造方法 - Google Patents

放熱のための強化熱伝導性キャビティフレームを採用する表面弾性波（ｓａｗ）フィルタパッケージ、及び関連する製造方法 Download PDF

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Publication number
JP2024532100A
JP2024532100A JP2024508487A JP2024508487A JP2024532100A JP 2024532100 A JP2024532100 A JP 2024532100A JP 2024508487 A JP2024508487 A JP 2024508487A JP 2024508487 A JP2024508487 A JP 2024508487A JP 2024532100 A JP2024532100 A JP 2024532100A
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JP
Japan
Prior art keywords
substrate
frame
cap substrate
cavity
cavity frame
Prior art date
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Pending
Application number
JP2024508487A
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English (en)
Japanese (ja)
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JP2024532100A5 (https=
Inventor
ドゥッタ、ラナディープ
キム、ジョンヘ
ラン、ジェ－ション
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Qualcomm Inc
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Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of JP2024532100A publication Critical patent/JP2024532100A/ja
Publication of JP2024532100A5 publication Critical patent/JP2024532100A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H03H9/6406—Filters characterised by a particular frequency characteristic
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H03H3/10—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves for obtaining desired frequency or temperature coefficient
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02834—Means for compensation or elimination of undesirable effects of temperature influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/058—Holders or supports for surface acoustic wave devices
    • H03H9/059—Holders or supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2024508487A 2021-08-23 2022-07-01 放熱のための強化熱伝導性キャビティフレームを採用する表面弾性波（ｓａｗ）フィルタパッケージ、及び関連する製造方法 Pending JP2024532100A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/409,282 US11984874B2 (en) 2021-08-23 2021-08-23 Surface acoustic wave (SAW) filter packages employing an enhanced thermally conductive cavity frame for heat dissipation, and related fabrication methods
US17/409,282 2021-08-23
PCT/US2022/073354 WO2023028392A1 (en) 2021-08-23 2022-07-01 Surface acoustic wave (saw) filter packages employing an enhanced thermally conductive cavity frame for heat dissipation, and related fabrication methods

Publications (2)

Publication Number Publication Date
JP2024532100A true JP2024532100A (ja) 2024-09-05
JP2024532100A5 JP2024532100A5 (https=) 2025-06-11

Family

ID=82748204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024508487A Pending JP2024532100A (ja) 2021-08-23 2022-07-01 放熱のための強化熱伝導性キャビティフレームを採用する表面弾性波（ｓａｗ）フィルタパッケージ、及び関連する製造方法

Country Status (7)

Country Link
US (1) US11984874B2 (https=)
EP (1) EP4393060A1 (https=)
JP (1) JP2024532100A (https=)
KR (1) KR20240047379A (https=)
CN (1) CN117795849A (https=)
TW (1) TW202322557A (https=)
WO (1) WO2023028392A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12562711B2 (en) * 2021-07-15 2026-02-24 Skyworks Solutions, Inc. Wafer level package having enhanced thermal dissipation

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007158989A (ja) * 2005-12-08 2007-06-21 Matsushita Electric Ind Co Ltd 電子部品
JP2011506106A (ja) * 2007-12-07 2011-03-03 エプコス アクチエンゲゼルシャフト Ｍｅｍｓパッケージおよび該ｍｅｍｓパッケージの製造方法
US20210159877A1 (en) * 2019-11-26 2021-05-27 Skyworks Solutions, Inc. Stacked temperature compensated acoustic wave device with high thermal conductivity

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004129223A (ja) 2002-07-31 2004-04-22 Murata Mfg Co Ltd 圧電部品およびその製造方法
DE102005026243B4 (de) 2005-06-07 2018-04-05 Snaptrack, Inc. Elektrisches Bauelement und Herstellungsverfahren
JP6242597B2 (ja) 2013-06-03 2017-12-06 太陽誘電株式会社 弾性波デバイス及びその製造方法
US11764750B2 (en) * 2018-07-20 2023-09-19 Global Communication Semiconductors, Llc Support structure for bulk acoustic wave resonator
CN111654259A (zh) * 2020-05-13 2020-09-11 深圳市信维通信股份有限公司 一种体声波谐振装置、一种滤波装置及一种射频前端装置
US12329035B2 (en) * 2021-06-29 2025-06-10 Global Communication Semiconductors, Llc Bulk acoustic wave resonator with improved structures

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007158989A (ja) * 2005-12-08 2007-06-21 Matsushita Electric Ind Co Ltd 電子部品
JP2011506106A (ja) * 2007-12-07 2011-03-03 エプコス アクチエンゲゼルシャフト Ｍｅｍｓパッケージおよび該ｍｅｍｓパッケージの製造方法
US20210159877A1 (en) * 2019-11-26 2021-05-27 Skyworks Solutions, Inc. Stacked temperature compensated acoustic wave device with high thermal conductivity

Also Published As

Publication number Publication date
TW202322557A (zh) 2023-06-01
EP4393060A1 (en) 2024-07-03
US20230054636A1 (en) 2023-02-23
CN117795849A (zh) 2024-03-29
KR20240047379A (ko) 2024-04-12
WO2023028392A1 (en) 2023-03-02
US11984874B2 (en) 2024-05-14

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