JP2024539171A - スパッタリングによって高硬度かつ超平滑なａ－Ｃを形成するための方法 - Google Patents

スパッタリングによって高硬度かつ超平滑なａ－Ｃを形成するための方法 Download PDF

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Publication number
JP2024539171A
JP2024539171A JP2024523716A JP2024523716A JP2024539171A JP 2024539171 A JP2024539171 A JP 2024539171A JP 2024523716 A JP2024523716 A JP 2024523716A JP 2024523716 A JP2024523716 A JP 2024523716A JP 2024539171 A JP2024539171 A JP 2024539171A
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JP
Japan
Prior art keywords
coating
substrate
carbon
ions
deposition
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Pending
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JP2024523716A
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English (en)
Japanese (ja)
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JP2024539171A5 (https=
Inventor
ケローディ，ジュリアン
ギモン，セバスチャン
クラスニッツァー，ジークフリート
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Oerlikon Surface Solutions AG Pfaeffikon
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Oerlikon Surface Solutions AG Pfaeffikon
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Publication of JP2024539171A publication Critical patent/JP2024539171A/ja
Publication of JP2024539171A5 publication Critical patent/JP2024539171A5/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0605—Carbon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3485—Sputtering using pulsed power to the target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/354—Introduction of auxiliary energy into the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32055—Arc discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3464—Operating strategies
    • H01J37/3467—Pulsed operation, e.g. HIPIMS

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP2024523716A 2021-10-22 2022-10-04 スパッタリングによって高硬度かつ超平滑なａ－Ｃを形成するための方法 Pending JP2024539171A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102021005266.8 2021-10-22
DE102021005266 2021-10-22
PCT/EP2022/000088 WO2023066510A1 (en) 2021-10-22 2022-10-04 Method for forming hard and ultra-smooth a-c by sputtering

Publications (2)

Publication Number Publication Date
JP2024539171A true JP2024539171A (ja) 2024-10-28
JP2024539171A5 JP2024539171A5 (https=) 2025-05-09

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JP2024523716A Pending JP2024539171A (ja) 2021-10-22 2022-10-04 スパッタリングによって高硬度かつ超平滑なａ－Ｃを形成するための方法

Country Status (7)

Country Link
US (1) US20250230538A1 (https=)
EP (1) EP4419726A1 (https=)
JP (1) JP2024539171A (https=)
KR (1) KR20240087818A (https=)
CN (1) CN118234886A (https=)
MX (1) MX2024004705A (https=)
WO (1) WO2023066510A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116426860B (zh) * 2023-06-12 2023-09-26 四川大学 基于hBN的硬密封控制阀用宽温域自润滑涂层制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000119843A (ja) * 1998-10-12 2000-04-25 Kobe Steel Ltd ダイヤモンドライクカーボン硬質多層膜成形体
JP2009191344A (ja) * 2008-02-18 2009-08-27 Kobe Steel Ltd 立方晶窒化硼素含有皮膜の形成方法
JP2013096011A (ja) * 2011-10-31 2013-05-20 Hauzer Techno Coating Bv ワークピース上に水素フリーのｔａ−Ｃ層を堆積させる装置および方法ならびにワークピース
JP2013539498A (ja) * 2010-01-29 2013-10-24 ハウザー テクノ−コーティング ベー．フェー． Ｈｉｐｉｍｓ電源を備えるコーティング装置
WO2017179233A1 (ja) * 2016-04-14 2017-10-19 住友電気工業株式会社 硬質被膜および切削工具
JP2018070977A (ja) * 2016-11-02 2018-05-10 神港精機株式会社 窒化炭素膜の形成方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012071433A (ja) 2010-09-28 2012-04-12 Mitsubishi Plastics Inc 離型フィルム
SE536285C2 (sv) 2011-04-07 2013-07-30 Ionautics Ab Sputtringsprocess för att sputtra ett target av kol
EP2759155B1 (en) 2012-12-14 2016-09-14 Huawei Technologies Co., Ltd. Dynamically adjusting capabilities of modems, each modem associated with a different subscriber identity
JP6621401B2 (ja) 2013-04-30 2019-12-18 フラウンホッファー−ゲゼルシャフト・ツァー・フォデラング・デル・アンゲワンテン・フォーシュング・エー．ファウ． 耐摩耗層を生産する方法およびその方法によって生産された耐摩耗層
CZ306607B6 (cs) 2016-02-05 2017-03-22 Platit A.S. Způsob nanášení otěruvzdorné DLC vrstvy
WO2019025559A1 (en) 2017-08-02 2019-02-07 Oerlikon Surface Solutions Ag, Pfäffikon COATING DEVICE FOR HIGHLY EFFICIENT LOW TEMPERATURE COATING

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000119843A (ja) * 1998-10-12 2000-04-25 Kobe Steel Ltd ダイヤモンドライクカーボン硬質多層膜成形体
JP2009191344A (ja) * 2008-02-18 2009-08-27 Kobe Steel Ltd 立方晶窒化硼素含有皮膜の形成方法
KR20100116618A (ko) * 2008-02-18 2010-11-01 가부시키가이샤 고베 세이코쇼 입방정 질화붕소 함유 피막의 형성 방법
JP2013539498A (ja) * 2010-01-29 2013-10-24 ハウザー テクノ−コーティング ベー．フェー． Ｈｉｐｉｍｓ電源を備えるコーティング装置
JP2013096011A (ja) * 2011-10-31 2013-05-20 Hauzer Techno Coating Bv ワークピース上に水素フリーのｔａ−Ｃ層を堆積させる装置および方法ならびにワークピース
WO2017179233A1 (ja) * 2016-04-14 2017-10-19 住友電気工業株式会社 硬質被膜および切削工具
JP2018070977A (ja) * 2016-11-02 2018-05-10 神港精機株式会社 窒化炭素膜の形成方法

Also Published As

Publication number Publication date
KR20240087818A (ko) 2024-06-19
MX2024004705A (es) 2024-05-07
EP4419726A1 (en) 2024-08-28
US20250230538A1 (en) 2025-07-17
WO2023066510A1 (en) 2023-04-27
CN118234886A (zh) 2024-06-21

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