JP2024525833A5 - - Google Patents

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Publication number
JP2024525833A5
JP2024525833A5 JP2024502167A JP2024502167A JP2024525833A5 JP 2024525833 A5 JP2024525833 A5 JP 2024525833A5 JP 2024502167 A JP2024502167 A JP 2024502167A JP 2024502167 A JP2024502167 A JP 2024502167A JP 2024525833 A5 JP2024525833 A5 JP 2024525833A5
Authority
JP
Japan
Prior art keywords
uniform
semiconductor device
channel region
power semiconductor
profile
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024502167A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024525833A (ja
Filing date
Publication date
Priority claimed from EP21186132.3A external-priority patent/EP4120362A1/en
Application filed filed Critical
Publication of JP2024525833A publication Critical patent/JP2024525833A/ja
Publication of JP2024525833A5 publication Critical patent/JP2024525833A5/ja
Pending legal-status Critical Current

Links

JP2024502167A 2021-07-16 2022-07-13 パワー半導体デバイスおよび製造方法 Pending JP2024525833A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP21186132.3A EP4120362A1 (en) 2021-07-16 2021-07-16 Power semiconductor device
EP21186132.3 2021-07-16
PCT/EP2022/069644 WO2023285555A1 (en) 2021-07-16 2022-07-13 Power semiconductor device and production method

Publications (2)

Publication Number Publication Date
JP2024525833A JP2024525833A (ja) 2024-07-12
JP2024525833A5 true JP2024525833A5 (cg-RX-API-DMAC10.html) 2025-06-24

Family

ID=76958824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024502167A Pending JP2024525833A (ja) 2021-07-16 2022-07-13 パワー半導体デバイスおよび製造方法

Country Status (5)

Country Link
EP (1) EP4120362A1 (cg-RX-API-DMAC10.html)
JP (1) JP2024525833A (cg-RX-API-DMAC10.html)
CN (1) CN117730417A (cg-RX-API-DMAC10.html)
DE (1) DE212022000255U1 (cg-RX-API-DMAC10.html)
WO (1) WO2023285555A1 (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102023121453A1 (de) * 2023-08-10 2025-02-13 Infineon Technologies Ag Halbleitervorrichtung mit breiter bandlücke und verfahren zum herstellen einer halbleitervorrichtung mit breiter bandlücke
WO2026098791A1 (en) * 2024-11-11 2026-05-15 Huawei Technologies Co., Ltd. Power device with composite gate dielectric layer

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6225669B1 (en) 1998-09-30 2001-05-01 Advanced Micro Devices, Inc. Non-uniform gate/dielectric field effect transistor
KR100858556B1 (ko) 2000-08-08 2008-09-16 마이크로세미 코포레이션 비대칭적 채널 구조를 가지는 전력 mos 소자
JP4460741B2 (ja) * 2000-09-27 2010-05-12 株式会社東芝 電力用半導体素子及びその製造方法
JP4073176B2 (ja) * 2001-04-02 2008-04-09 新電元工業株式会社 半導体装置およびその製造方法
US8592894B2 (en) * 2008-06-30 2013-11-26 Freescale Semiconductor, Inc. Method of forming a power semiconductor device and power semiconductor device
DE102011079747A1 (de) * 2010-07-27 2012-02-02 Denso Corporation Halbleitervorrichtung mit Schaltelement und Freilaufdiode, sowie Steuerverfahren hierfür
JP6048317B2 (ja) * 2013-06-05 2016-12-21 株式会社デンソー 炭化珪素半導体装置
KR20150090669A (ko) * 2014-01-29 2015-08-06 에스케이하이닉스 주식회사 듀얼일함수 매립게이트형 트랜지스터 및 그 제조 방법, 그를 구비한 전자장치
JP2016054181A (ja) * 2014-09-03 2016-04-14 トヨタ自動車株式会社 絶縁ゲート型スイッチング素子
JP6271078B2 (ja) * 2015-03-12 2018-01-31 株式会社日立製作所 半導体装置および電力変換装置
JP6472776B2 (ja) * 2016-02-01 2019-02-20 富士電機株式会社 炭化珪素半導体装置および炭化珪素半導体装置の製造方法
CN109087951A (zh) * 2018-08-23 2018-12-25 深圳市南硕明泰科技有限公司 功率器件及其制备方法
US11309413B2 (en) * 2019-10-10 2022-04-19 Wolfspeed, Inc. Semiconductor device with improved short circuit withstand time and methods for manufacturing the same

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