JP2024517055A5 - - Google Patents
Info
- Publication number
- JP2024517055A5 JP2024517055A5 JP2023555675A JP2023555675A JP2024517055A5 JP 2024517055 A5 JP2024517055 A5 JP 2024517055A5 JP 2023555675 A JP2023555675 A JP 2023555675A JP 2023555675 A JP2023555675 A JP 2023555675A JP 2024517055 A5 JP2024517055 A5 JP 2024517055A5
- Authority
- JP
- Japan
- Prior art keywords
- quality parameter
- parameter values
- generating
- sdw
- orientation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202163177966P | 2021-04-22 | 2021-04-22 | |
| US63/177,966 | 2021-04-22 | ||
| US17/469,280 | 2021-09-08 | ||
| US17/469,280 US12131959B2 (en) | 2021-04-22 | 2021-09-08 | Systems and methods for improved metrology for semiconductor device wafers |
| PCT/US2021/053051 WO2022225549A1 (en) | 2021-04-22 | 2021-10-01 | Systems and methods for improved metrology for semiconductor device wafers |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2024517055A JP2024517055A (ja) | 2024-04-19 |
| JP2024517055A5 true JP2024517055A5 (cg-RX-API-DMAC7.html) | 2024-09-20 |
| JP7580627B2 JP7580627B2 (ja) | 2024-11-11 |
Family
ID=83694528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023555675A Active JP7580627B2 (ja) | 2021-04-22 | 2021-10-01 | 半導体デバイスウエハのための改良されたメトロロジーについてのシステムおよび方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12131959B2 (cg-RX-API-DMAC7.html) |
| JP (1) | JP7580627B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR102901219B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN116868069B (cg-RX-API-DMAC7.html) |
| TW (1) | TWI865831B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2022225549A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12165930B2 (en) | 2021-06-03 | 2024-12-10 | Kla Corporation | Adaptive modeling misregistration measurement system and method |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3609896B2 (ja) * | 1996-04-16 | 2005-01-12 | 株式会社ルネサステクノロジ | 重ね合わせ測定誤差補正方法 |
| US6678038B2 (en) | 2001-08-03 | 2004-01-13 | Nikon Corporation | Apparatus and methods for detecting tool-induced shift in microlithography apparatus |
| US7804994B2 (en) | 2002-02-15 | 2010-09-28 | Kla-Tencor Technologies Corporation | Overlay metrology and control method |
| WO2004053426A1 (en) | 2002-12-05 | 2004-06-24 | Kla-Tencor Technologies Corporation | Apparatus and methods for detecting overlay errors using scatterometry |
| US7608468B1 (en) | 2003-07-02 | 2009-10-27 | Kla-Tencor Technologies, Corp. | Apparatus and methods for determining overlay and uses of same |
| JP4314082B2 (ja) | 2003-08-19 | 2009-08-12 | キヤノン株式会社 | アライメント方法 |
| US7656518B2 (en) * | 2007-03-30 | 2010-02-02 | Asml Netherlands B.V. | Method of measuring asymmetry in a scatterometer, a method of measuring an overlay error in a substrate and a metrology apparatus |
| DE102007033345B4 (de) * | 2007-07-16 | 2009-07-16 | Vistec Semiconductor Systems Gmbh | Verfahren zur Korrektur von Abbildungsfehlern einer Messoptik einer Koordinaten-Messmaschine |
| NL2003890A (en) | 2008-12-16 | 2010-06-17 | Asml Netherlands Bv | Calibration method, inspection method and apparatus, lithographic apparatus, and lithographic processing cell. |
| US9927718B2 (en) | 2010-08-03 | 2018-03-27 | Kla-Tencor Corporation | Multi-layer overlay metrology target and complimentary overlay metrology measurement systems |
| US8860941B2 (en) * | 2012-04-27 | 2014-10-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Tool induced shift reduction determination for overlay metrology |
| US8843875B2 (en) * | 2012-05-08 | 2014-09-23 | Kla-Tencor Corporation | Measurement model optimization based on parameter variations across a wafer |
| US9778213B2 (en) | 2013-08-19 | 2017-10-03 | Kla-Tencor Corporation | Metrology tool with combined XRF and SAXS capabilities |
| WO2015196168A1 (en) | 2014-06-21 | 2015-12-23 | Kla-Tencor Corporation | Compound imaging metrology targets |
| US10565697B2 (en) * | 2017-10-22 | 2020-02-18 | Kla-Tencor Corporation | Utilizing overlay misregistration error estimations in imaging overlay metrology |
| IL282726B2 (en) * | 2018-11-21 | 2025-01-01 | Kla Corp | Process optimization through experimental design and response surface models |
| JP7254217B2 (ja) * | 2019-02-14 | 2023-04-07 | ケーエルエー コーポレイション | 誘導されたトポグラフィを利用した半導体デバイスウェハの位置ずれを測定するためのシステムと方法 |
| WO2020167331A1 (en) | 2019-02-15 | 2020-08-20 | Kla-Tencor Corporation | Misregistration measurements using combined optical and electron beam technology |
| KR102666266B1 (ko) | 2019-03-25 | 2024-05-14 | 케이엘에이 코포레이션 | 휘어진 반도체 웨이퍼를 평탄화하는 진공 홀드-다운 장치 |
| US11302544B2 (en) * | 2019-03-28 | 2022-04-12 | Kla-Tencor Corporation | Method for measuring and correcting misregistration between layers in a semiconductor device, and misregistration targets useful therein |
| US11862521B2 (en) | 2019-06-20 | 2024-01-02 | Kla Corporation | Multiple-tool parameter set calibration and misregistration measurement system and method |
| US11640117B2 (en) * | 2019-06-25 | 2023-05-02 | Kla Corporation | Selection of regions of interest for measurement of misregistration and amelioration thereof |
| CN114342053B (zh) | 2019-09-16 | 2025-05-16 | 科磊股份有限公司 | 周期性半导体装置偏移计量学系统及方法 |
-
2021
- 2021-09-08 US US17/469,280 patent/US12131959B2/en active Active
- 2021-10-01 JP JP2023555675A patent/JP7580627B2/ja active Active
- 2021-10-01 CN CN202180094001.5A patent/CN116868069B/zh active Active
- 2021-10-01 WO PCT/US2021/053051 patent/WO2022225549A1/en not_active Ceased
- 2021-10-01 KR KR1020237032686A patent/KR102901219B1/ko active Active
- 2021-10-07 TW TW110137265A patent/TWI865831B/zh active
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