JP7580627B2 - 半導体デバイスウエハのための改良されたメトロロジーについてのシステムおよび方法 - Google Patents

半導体デバイスウエハのための改良されたメトロロジーについてのシステムおよび方法 Download PDF

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JP7580627B2
JP7580627B2 JP2023555675A JP2023555675A JP7580627B2 JP 7580627 B2 JP7580627 B2 JP 7580627B2 JP 2023555675 A JP2023555675 A JP 2023555675A JP 2023555675 A JP2023555675 A JP 2023555675A JP 7580627 B2 JP7580627 B2 JP 7580627B2
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quality parameter
sdw
measurement
parameter values
sms
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JP2024517055A (ja
JP2024517055A5 (cg-RX-API-DMAC7.html
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リラン エルシャルミ
ダリア ネグリ
オハド バハール
ヨッシ シモン
アムノン マナセン
ダヴィド ニル ベン
ヨラム ウジエル
エタイ ラバート
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KLA Corp
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KLA Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
JP2023555675A 2021-04-22 2021-10-01 半導体デバイスウエハのための改良されたメトロロジーについてのシステムおよび方法 Active JP7580627B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US202163177966P 2021-04-22 2021-04-22
US63/177,966 2021-04-22
US17/469,280 2021-09-08
US17/469,280 US12131959B2 (en) 2021-04-22 2021-09-08 Systems and methods for improved metrology for semiconductor device wafers
PCT/US2021/053051 WO2022225549A1 (en) 2021-04-22 2021-10-01 Systems and methods for improved metrology for semiconductor device wafers

Publications (3)

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JP2024517055A JP2024517055A (ja) 2024-04-19
JP2024517055A5 JP2024517055A5 (cg-RX-API-DMAC7.html) 2024-09-20
JP7580627B2 true JP7580627B2 (ja) 2024-11-11

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US (1) US12131959B2 (cg-RX-API-DMAC7.html)
JP (1) JP7580627B2 (cg-RX-API-DMAC7.html)
KR (1) KR102901219B1 (cg-RX-API-DMAC7.html)
CN (1) CN116868069B (cg-RX-API-DMAC7.html)
TW (1) TWI865831B (cg-RX-API-DMAC7.html)
WO (1) WO2022225549A1 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12165930B2 (en) 2021-06-03 2024-12-10 Kla Corporation Adaptive modeling misregistration measurement system and method

Citations (3)

* Cited by examiner, † Cited by third party
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US20030025895A1 (en) 2001-08-03 2003-02-06 Michael Binnard Apparatus and methods for detecting tool-induced shift in microlithography apparatus
JP2008258606A (ja) 2007-03-30 2008-10-23 Asml Netherlands Bv スキャトロメータの非対称性を測定する方法、基板のオーバレイエラーを測定する方法および計測装置
US20090024344A1 (en) 2007-07-16 2009-01-22 Vistec Semiconductor Systems Gmbh Method for correcting an error of the imaging system of a coordinate measuring machine

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JP3609896B2 (ja) * 1996-04-16 2005-01-12 株式会社ルネサステクノロジ 重ね合わせ測定誤差補正方法
US7804994B2 (en) 2002-02-15 2010-09-28 Kla-Tencor Technologies Corporation Overlay metrology and control method
WO2004053426A1 (en) 2002-12-05 2004-06-24 Kla-Tencor Technologies Corporation Apparatus and methods for detecting overlay errors using scatterometry
US7608468B1 (en) 2003-07-02 2009-10-27 Kla-Tencor Technologies, Corp. Apparatus and methods for determining overlay and uses of same
JP4314082B2 (ja) 2003-08-19 2009-08-12 キヤノン株式会社 アライメント方法
NL2003890A (en) 2008-12-16 2010-06-17 Asml Netherlands Bv Calibration method, inspection method and apparatus, lithographic apparatus, and lithographic processing cell.
US9927718B2 (en) 2010-08-03 2018-03-27 Kla-Tencor Corporation Multi-layer overlay metrology target and complimentary overlay metrology measurement systems
US8860941B2 (en) * 2012-04-27 2014-10-14 Taiwan Semiconductor Manufacturing Co., Ltd. Tool induced shift reduction determination for overlay metrology
US8843875B2 (en) * 2012-05-08 2014-09-23 Kla-Tencor Corporation Measurement model optimization based on parameter variations across a wafer
US9778213B2 (en) 2013-08-19 2017-10-03 Kla-Tencor Corporation Metrology tool with combined XRF and SAXS capabilities
WO2015196168A1 (en) 2014-06-21 2015-12-23 Kla-Tencor Corporation Compound imaging metrology targets
US10565697B2 (en) * 2017-10-22 2020-02-18 Kla-Tencor Corporation Utilizing overlay misregistration error estimations in imaging overlay metrology
IL282726B2 (en) * 2018-11-21 2025-01-01 Kla Corp Process optimization through experimental design and response surface models
JP7254217B2 (ja) * 2019-02-14 2023-04-07 ケーエルエー コーポレイション 誘導されたトポグラフィを利用した半導体デバイスウェハの位置ずれを測定するためのシステムと方法
WO2020167331A1 (en) 2019-02-15 2020-08-20 Kla-Tencor Corporation Misregistration measurements using combined optical and electron beam technology
KR102666266B1 (ko) 2019-03-25 2024-05-14 케이엘에이 코포레이션 휘어진 반도체 웨이퍼를 평탄화하는 진공 홀드-다운 장치
US11302544B2 (en) * 2019-03-28 2022-04-12 Kla-Tencor Corporation Method for measuring and correcting misregistration between layers in a semiconductor device, and misregistration targets useful therein
US11862521B2 (en) 2019-06-20 2024-01-02 Kla Corporation Multiple-tool parameter set calibration and misregistration measurement system and method
US11640117B2 (en) * 2019-06-25 2023-05-02 Kla Corporation Selection of regions of interest for measurement of misregistration and amelioration thereof
CN114342053B (zh) 2019-09-16 2025-05-16 科磊股份有限公司 周期性半导体装置偏移计量学系统及方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030025895A1 (en) 2001-08-03 2003-02-06 Michael Binnard Apparatus and methods for detecting tool-induced shift in microlithography apparatus
JP2008258606A (ja) 2007-03-30 2008-10-23 Asml Netherlands Bv スキャトロメータの非対称性を測定する方法、基板のオーバレイエラーを測定する方法および計測装置
US20090024344A1 (en) 2007-07-16 2009-01-22 Vistec Semiconductor Systems Gmbh Method for correcting an error of the imaging system of a coordinate measuring machine

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Publication number Publication date
JP2024517055A (ja) 2024-04-19
CN116868069B (zh) 2024-09-06
TWI865831B (zh) 2024-12-11
KR20230174215A (ko) 2023-12-27
KR102901219B1 (ko) 2025-12-16
WO2022225549A1 (en) 2022-10-27
US20220344218A1 (en) 2022-10-27
US12131959B2 (en) 2024-10-29
TW202245090A (zh) 2022-11-16
CN116868069A (zh) 2023-10-10

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