TWI865831B - 用於半導體裝置晶圓之改良計量的系統及方法 - Google Patents

用於半導體裝置晶圓之改良計量的系統及方法 Download PDF

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Publication number
TWI865831B
TWI865831B TW110137265A TW110137265A TWI865831B TW I865831 B TWI865831 B TW I865831B TW 110137265 A TW110137265 A TW 110137265A TW 110137265 A TW110137265 A TW 110137265A TW I865831 B TWI865831 B TW I865831B
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Taiwan
Prior art keywords
measurement
sdw
orientation
fms
sms
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TW110137265A
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English (en)
Chinese (zh)
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TW202245090A (zh
Inventor
里蘭 葉魯夏米
戴瑞亞 尼葛瑞
歐哈德 貝洽爾
由西 西門
阿農 馬那森
大衛 尼爾 班
約拉姆 于齊耶爾
伊塔 拉伯特
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美商科磊股份有限公司
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
TW110137265A 2021-04-22 2021-10-07 用於半導體裝置晶圓之改良計量的系統及方法 TWI865831B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US202163177966P 2021-04-22 2021-04-22
US63/177,966 2021-04-22
US17/469,280 2021-09-08
US17/469,280 US12131959B2 (en) 2021-04-22 2021-09-08 Systems and methods for improved metrology for semiconductor device wafers

Publications (2)

Publication Number Publication Date
TW202245090A TW202245090A (zh) 2022-11-16
TWI865831B true TWI865831B (zh) 2024-12-11

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TW110137265A TWI865831B (zh) 2021-04-22 2021-10-07 用於半導體裝置晶圓之改良計量的系統及方法

Country Status (6)

Country Link
US (1) US12131959B2 (cg-RX-API-DMAC7.html)
JP (1) JP7580627B2 (cg-RX-API-DMAC7.html)
KR (1) KR102901219B1 (cg-RX-API-DMAC7.html)
CN (1) CN116868069B (cg-RX-API-DMAC7.html)
TW (1) TWI865831B (cg-RX-API-DMAC7.html)
WO (1) WO2022225549A1 (cg-RX-API-DMAC7.html)

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US12165930B2 (en) 2021-06-03 2024-12-10 Kla Corporation Adaptive modeling misregistration measurement system and method

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US6678038B2 (en) 2001-08-03 2004-01-13 Nikon Corporation Apparatus and methods for detecting tool-induced shift in microlithography apparatus
US7804994B2 (en) 2002-02-15 2010-09-28 Kla-Tencor Technologies Corporation Overlay metrology and control method
WO2004053426A1 (en) 2002-12-05 2004-06-24 Kla-Tencor Technologies Corporation Apparatus and methods for detecting overlay errors using scatterometry
US7608468B1 (en) 2003-07-02 2009-10-27 Kla-Tencor Technologies, Corp. Apparatus and methods for determining overlay and uses of same
JP4314082B2 (ja) 2003-08-19 2009-08-12 キヤノン株式会社 アライメント方法
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US9927718B2 (en) 2010-08-03 2018-03-27 Kla-Tencor Corporation Multi-layer overlay metrology target and complimentary overlay metrology measurement systems
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WO2020167331A1 (en) 2019-02-15 2020-08-20 Kla-Tencor Corporation Misregistration measurements using combined optical and electron beam technology
KR102666266B1 (ko) 2019-03-25 2024-05-14 케이엘에이 코포레이션 휘어진 반도체 웨이퍼를 평탄화하는 진공 홀드-다운 장치
US11302544B2 (en) * 2019-03-28 2022-04-12 Kla-Tencor Corporation Method for measuring and correcting misregistration between layers in a semiconductor device, and misregistration targets useful therein
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Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
US20090024344A1 (en) * 2007-07-16 2009-01-22 Vistec Semiconductor Systems Gmbh Method for correcting an error of the imaging system of a coordinate measuring machine
US20190122357A1 (en) * 2017-10-22 2019-04-25 Kla-Tencor Corporation Utilizing overlay misregistration error estimations in imaging overlay metrology

Also Published As

Publication number Publication date
JP2024517055A (ja) 2024-04-19
CN116868069B (zh) 2024-09-06
KR20230174215A (ko) 2023-12-27
KR102901219B1 (ko) 2025-12-16
WO2022225549A1 (en) 2022-10-27
US20220344218A1 (en) 2022-10-27
US12131959B2 (en) 2024-10-29
JP7580627B2 (ja) 2024-11-11
TW202245090A (zh) 2022-11-16
CN116868069A (zh) 2023-10-10

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