JP2024514601A - 集積回路（ｉｃ）チップをパッケージ基板にインターフェースするためのキャパシタ埋込み、再配線層（ｒｄｌ）基板を採用するｉｃパッケージ、および関係する方法 - Google Patents

集積回路（ｉｃ）チップをパッケージ基板にインターフェースするためのキャパシタ埋込み、再配線層（ｒｄｌ）基板を採用するｉｃパッケージ、および関係する方法 Download PDF

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JP2024514601A
JP2024514601A JP2023562736A JP2023562736A JP2024514601A JP 2024514601 A JP2024514601 A JP 2024514601A JP 2023562736 A JP2023562736 A JP 2023562736A JP 2023562736 A JP2023562736 A JP 2023562736A JP 2024514601 A JP2024514601 A JP 2024514601A
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rdl
substrate
package
layer
interconnects
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Japanese (ja)
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JP2024514601A5 (cg-RX-API-DMAC10.html
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チェ、ジホン
ナッラパティ、ジリダール
ストーン、ウィリアム
シュ、ジエンウェン
キム、ジョンヘ
チダムバラム、ペリアンナン
シェイド、アフメル
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Qualcomm Inc
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Qualcomm Inc
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Publication of JP2024514601A5 publication Critical patent/JP2024514601A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/495—Capacitive arrangements or effects of, or between wiring layers
    • H10W20/496—Capacitor integral with wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/652—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts

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  • Semiconductor Integrated Circuits (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2023562736A 2021-04-22 2022-04-08 集積回路（ｉｃ）チップをパッケージ基板にインターフェースするためのキャパシタ埋込み、再配線層（ｒｄｌ）基板を採用するｉｃパッケージ、および関係する方法 Pending JP2024514601A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/237,828 US12218041B2 (en) 2021-04-22 2021-04-22 Integrated circuit (IC) packages employing a capacitor-embedded, redistribution layer (RDL) substrate for interfacing an IC chip(s) to a package substrate, and related methods
US17/237,828 2021-04-22
PCT/US2022/071621 WO2022226465A1 (en) 2021-04-22 2022-04-08 Integrated circuit (ic) packages employing a capacitor-embedded, redistribution layer (rdl) substrate for interfacing an ic chip(s) to a package substrate, and related methods

Publications (2)

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JP2024514601A true JP2024514601A (ja) 2024-04-02
JP2024514601A5 JP2024514601A5 (cg-RX-API-DMAC10.html) 2025-03-31

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US (5) US12218041B2 (cg-RX-API-DMAC10.html)
EP (1) EP4327361A1 (cg-RX-API-DMAC10.html)
JP (1) JP2024514601A (cg-RX-API-DMAC10.html)
KR (1) KR20240000470A (cg-RX-API-DMAC10.html)
CN (1) CN117043943A (cg-RX-API-DMAC10.html)
BR (1) BR112023021017A2 (cg-RX-API-DMAC10.html)
TW (1) TW202247306A (cg-RX-API-DMAC10.html)
WO (1) WO2022226465A1 (cg-RX-API-DMAC10.html)

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US20240079352A1 (en) * 2022-09-02 2024-03-07 Qualcomm Incorporated Integrated circuit (ic) packages employing capacitor interposer substrate with aligned external interconnects, and related fabrication methods
US20240113073A1 (en) * 2022-09-29 2024-04-04 Intel Corporation Side of a die that is coplanar with a side of a molding
US12660693B2 (en) * 2022-10-28 2026-06-16 Murata Manufacturing Co., Ltd. Integration of discrete embeddable capacitors on integrated circuit chips
CN120727696B (zh) * 2025-09-01 2026-01-13 浙江大学 一种正交堆叠的双面冷却功率模块及其制备方法

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WO2022226465A1 (en) 2022-10-27
US20220344250A1 (en) 2022-10-27
EP4327361A1 (en) 2024-02-28
TW202247306A (zh) 2022-12-01
CN117043943A (zh) 2023-11-10
US20260198348A1 (en) 2026-07-09
US20260198349A1 (en) 2026-07-09
KR20240000470A (ko) 2024-01-02
US20260198350A1 (en) 2026-07-09
US12218041B2 (en) 2025-02-04
US20250118645A1 (en) 2025-04-10
BR112023021017A2 (pt) 2023-12-19

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