JP2024513073A - 静電気防止ポリアミド組成物及びそれを含む物品 - Google Patents

静電気防止ポリアミド組成物及びそれを含む物品 Download PDF

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JP2024513073A
JP2024513073A JP2023561098A JP2023561098A JP2024513073A JP 2024513073 A JP2024513073 A JP 2024513073A JP 2023561098 A JP2023561098 A JP 2023561098A JP 2023561098 A JP2023561098 A JP 2023561098A JP 2024513073 A JP2024513073 A JP 2024513073A
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polyamide
polyamide composition
glass
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JP2024513073A5 (https=
Inventor
チノムソ ヌウォス，
ヴィジェイ ゴパラクリシュナン，
マシュー ビンセント，
リー カーベル，
リンジー アンダーソン，
Original Assignee
ソルベイ スペシャルティ ポリマーズ ユーエスエー， エルエルシー
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Publication of JP2024513073A publication Critical patent/JP2024513073A/ja
Publication of JP2024513073A5 publication Critical patent/JP2024513073A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/046—Carbon nanorods, nanowires, nanoplatelets or nanofibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/40—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/201—Pre-melted polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
    • C08J5/042—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with carbon fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/041—Carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/44—Carbon
    • C09C1/48—Carbon black
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/18—Conductive material dispersed in non-conductive inorganic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/004—Additives being defined by their length
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/01—Magnetic additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/017—Additives being an antistatic agent

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2023561098A 2021-04-06 2022-04-04 静電気防止ポリアミド組成物及びそれを含む物品 Pending JP2024513073A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US202163171216P 2021-04-06 2021-04-06
US63/171,216 2021-04-06
EP21189881 2021-08-05
EP21189881.2 2021-08-05
PCT/EP2022/058900 WO2022214438A1 (en) 2021-04-06 2022-04-04 Electrostatic dissipative polyamide composition and article comprising it

Publications (2)

Publication Number Publication Date
JP2024513073A true JP2024513073A (ja) 2024-03-21
JP2024513073A5 JP2024513073A5 (https=) 2025-03-12

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JP2023561098A Pending JP2024513073A (ja) 2021-04-06 2022-04-04 静電気防止ポリアミド組成物及びそれを含む物品

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Country Link
US (1) US20240166843A1 (https=)
EP (1) EP4320070A1 (https=)
JP (1) JP2024513073A (https=)
KR (1) KR20230167359A (https=)
WO (1) WO2022214438A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115716988B (zh) * 2022-10-28 2024-02-23 江苏金发科技新材料有限公司 一种长碳链聚酰胺组合物及其制备方法和应用
WO2024242025A1 (ja) * 2023-05-19 2024-11-28 株式会社クラレ ポリアミド組成物

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0565409A (ja) * 1991-06-14 1993-03-19 Mitsubishi Gas Chem Co Inc ポリアミド樹脂組成物
JPH10219105A (ja) * 1997-02-07 1998-08-18 Unitika Ltd ポリアミド樹脂組成物、これを用いてなる電気機器筐体部品
JP2004269664A (ja) * 2003-03-07 2004-09-30 Asahi Kasei Chemicals Corp 優れた樹脂製筐体
JP2010510374A (ja) * 2006-11-22 2010-04-02 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー ポリアミド樹脂組成物を含む携帯電話ハウジング
JP2012207075A (ja) * 2011-03-29 2012-10-25 Teijin Chem Ltd ガラス強化樹脂組成物
WO2022085584A1 (ja) * 2020-10-20 2022-04-28 ユニチカ株式会社 ポリアミド樹脂組成物およびそれからなる成形体、車載カメラ用部品

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001040229A (ja) * 1999-08-03 2001-02-13 Toray Ind Inc 難燃性樹脂組成物、およびその成形品
US7678295B2 (en) * 2006-10-13 2010-03-16 Sabic Innovative Plastics Ip B.V. Reinforced poly(arylene ether)/polyamide composition and article comprising the foregoing
JP2015043246A (ja) * 2011-12-22 2015-03-05 旭化成ケミカルズ株式会社 ディスクダンパー及びハードディスクドライブ
CN109923080B (zh) * 2016-10-27 2022-05-10 日本板硝子株式会社 片状玻璃及树脂组合物
EP4413083A4 (en) * 2021-10-07 2025-06-11 Solvay Specialty Polymers USA, LLC Electrostatic dissipative polyamide composition and article comprising it

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0565409A (ja) * 1991-06-14 1993-03-19 Mitsubishi Gas Chem Co Inc ポリアミド樹脂組成物
JPH10219105A (ja) * 1997-02-07 1998-08-18 Unitika Ltd ポリアミド樹脂組成物、これを用いてなる電気機器筐体部品
JP2004269664A (ja) * 2003-03-07 2004-09-30 Asahi Kasei Chemicals Corp 優れた樹脂製筐体
JP2010510374A (ja) * 2006-11-22 2010-04-02 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー ポリアミド樹脂組成物を含む携帯電話ハウジング
JP2012207075A (ja) * 2011-03-29 2012-10-25 Teijin Chem Ltd ガラス強化樹脂組成物
WO2022085584A1 (ja) * 2020-10-20 2022-04-28 ユニチカ株式会社 ポリアミド樹脂組成物およびそれからなる成形体、車載カメラ用部品

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EP4320070A1 (en) 2024-02-14
KR20230167359A (ko) 2023-12-08
WO2022214438A1 (en) 2022-10-13
US20240166843A1 (en) 2024-05-23

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