JP2024175135A - 接続構造体、接続構造体の製造方法、接続材料、及び被覆導電粒子 - Google Patents

接続構造体、接続構造体の製造方法、接続材料、及び被覆導電粒子 Download PDF

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JP2024175135A
JP2024175135A JP2024166460A JP2024166460A JP2024175135A JP 2024175135 A JP2024175135 A JP 2024175135A JP 2024166460 A JP2024166460 A JP 2024166460A JP 2024166460 A JP2024166460 A JP 2024166460A JP 2024175135 A JP2024175135 A JP 2024175135A
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Japan
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metal
particles
conductive
terminal
conductive layer
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Japanese (ja)
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JP2024175135A5 (https=
Inventor
雄介 田中
Yusuke Tanaka
正治 青木
Masaharu Aoki
早織 杉岡
Saori Sugioka
秀次 波木
Hideji Namiki
生子 久我
Ikuko Kuga
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Dexerials Corp
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Dexerials Corp
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Priority claimed from JP2020076961A external-priority patent/JP7592399B2/ja
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of JP2024175135A publication Critical patent/JP2024175135A/ja
Publication of JP2024175135A5 publication Critical patent/JP2024175135A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Wire Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2024166460A 2019-05-01 2024-09-25 接続構造体、接続構造体の製造方法、接続材料、及び被覆導電粒子 Pending JP2024175135A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019087150 2019-05-01
JP2019087150 2019-05-01
JP2020076961A JP7592399B2 (ja) 2019-05-01 2020-04-23 接続構造体、接続構造体の製造方法、接続材料、及び被覆導電粒子

Related Parent Applications (1)

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JP2020076961A Division JP7592399B2 (ja) 2019-05-01 2020-04-23 接続構造体、接続構造体の製造方法、接続材料、及び被覆導電粒子

Publications (2)

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JP2024175135A true JP2024175135A (ja) 2024-12-17
JP2024175135A5 JP2024175135A5 (https=) 2025-04-03

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JP2024166460A Pending JP2024175135A (ja) 2019-05-01 2024-09-25 接続構造体、接続構造体の製造方法、接続材料、及び被覆導電粒子

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Country Link
US (1) US12237096B2 (https=)
JP (1) JP2024175135A (https=)
WO (1) WO2020222301A1 (https=)

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CN112965305B (zh) * 2020-07-08 2023-11-17 友达光电股份有限公司 显示面板
US12195642B2 (en) * 2022-05-04 2025-01-14 Mk High Technology Joint Stock Company Anisotropic conductive film and method and composition for making the same

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JP2009152302A (ja) * 2007-12-19 2009-07-09 Canon Inc 光起電力素子の形成方法
JP2012009148A (ja) * 2010-06-22 2012-01-12 Konica Minolta Holdings Inc 積層型透明導電性フィルム

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JP2005317270A (ja) 2004-04-27 2005-11-10 Sekisui Chem Co Ltd 導電性微粒子及び導電接続構造体
WO2006080289A1 (ja) * 2005-01-25 2006-08-03 Sekisui Chemical Co., Ltd. 導電性微粒子、及び異方性導電材料
CN103493151A (zh) * 2011-02-23 2014-01-01 迪睿合电子材料有限公司 透明导电膜、信息输入装置及电子设备
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KR102031654B1 (ko) * 2012-05-23 2019-10-15 삼성디스플레이 주식회사 윈도우 구조물, 그 제조 방법, 윈도우 구조물을 포함하는 카메라가 탑재된 전자 장치 및 그 제조 방법
JP2014127519A (ja) * 2012-12-25 2014-07-07 Sony Corp 固体撮像素子、及び、電子機器
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WO2014133124A1 (ja) 2013-02-28 2014-09-04 積水化学工業株式会社 導電性微粒子、異方性導電材料、及び、導電接続構造体
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WO2018139280A1 (ja) * 2017-01-30 2018-08-02 ソニーセミコンダクタソリューションズ株式会社 カメラモジュールおよびその製造方法、並びに電子機器
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TWI772522B (zh) 2017-09-20 2022-08-01 日商積水化學工業股份有限公司 含金屬粒子、連接材料、連接結構體、連接結構體之製造方法、導通檢查用構件及導通檢查裝置
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JPS63231889A (ja) * 1987-03-19 1988-09-27 日立化成工業株式会社 回路の接続部材
JP2009152302A (ja) * 2007-12-19 2009-07-09 Canon Inc 光起電力素子の形成方法
JP2012009148A (ja) * 2010-06-22 2012-01-12 Konica Minolta Holdings Inc 積層型透明導電性フィルム

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US12237096B2 (en) 2025-02-25
US20220223315A1 (en) 2022-07-14

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