JP2024094620A - 配線回路基板、電気的要素実装基板、配線回路基板の製造方法および電気的要素実装基板の製造方法 - Google Patents

配線回路基板、電気的要素実装基板、配線回路基板の製造方法および電気的要素実装基板の製造方法 Download PDF

Info

Publication number
JP2024094620A
JP2024094620A JP2022211280A JP2022211280A JP2024094620A JP 2024094620 A JP2024094620 A JP 2024094620A JP 2022211280 A JP2022211280 A JP 2022211280A JP 2022211280 A JP2022211280 A JP 2022211280A JP 2024094620 A JP2024094620 A JP 2024094620A
Authority
JP
Japan
Prior art keywords
circuit board
layer
insulating
insulating layer
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022211280A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024094620A5 (https=
Inventor
淳 石井
Atsushi Ishii
征宏 藤林
Masahiro Fujibayashi
雅人 榎木
Masahito Enoki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP2022211280A priority Critical patent/JP2024094620A/ja
Priority to TW112151350A priority patent/TW202435372A/zh
Priority to KR1020257024108A priority patent/KR20250130328A/ko
Priority to PCT/JP2023/047178 priority patent/WO2024143520A1/ja
Priority to CN202380088894.1A priority patent/CN120418955A/zh
Publication of JP2024094620A publication Critical patent/JP2024094620A/ja
Publication of JP2024094620A5 publication Critical patent/JP2024094620A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/42—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/435—Cross-sectional shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2022211280A 2022-12-28 2022-12-28 配線回路基板、電気的要素実装基板、配線回路基板の製造方法および電気的要素実装基板の製造方法 Pending JP2024094620A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2022211280A JP2024094620A (ja) 2022-12-28 2022-12-28 配線回路基板、電気的要素実装基板、配線回路基板の製造方法および電気的要素実装基板の製造方法
TW112151350A TW202435372A (zh) 2022-12-28 2023-12-28 配線電路基板、電性要素安裝基板、電子機器、配線電路基板的製造方法及電性要素安裝基板的製造方法
KR1020257024108A KR20250130328A (ko) 2022-12-28 2023-12-28 배선 회로 기판, 전기적 요소 실장 기판, 전자 기기, 배선 회로 기판의 제조 방법 및 전기적 요소 실장 기판의 제조 방법
PCT/JP2023/047178 WO2024143520A1 (ja) 2022-12-28 2023-12-28 配線回路基板、電気的要素実装基板、電子機器、配線回路基板の製造方法および電気的要素実装基板の製造方法
CN202380088894.1A CN120418955A (zh) 2022-12-28 2023-12-28 布线电路基板、电气要素安装基板、电子设备、布线电路基板的制造方法、以及电气要素安装基板的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022211280A JP2024094620A (ja) 2022-12-28 2022-12-28 配線回路基板、電気的要素実装基板、配線回路基板の製造方法および電気的要素実装基板の製造方法

Publications (2)

Publication Number Publication Date
JP2024094620A true JP2024094620A (ja) 2024-07-10
JP2024094620A5 JP2024094620A5 (https=) 2026-01-13

Family

ID=91717949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022211280A Pending JP2024094620A (ja) 2022-12-28 2022-12-28 配線回路基板、電気的要素実装基板、配線回路基板の製造方法および電気的要素実装基板の製造方法

Country Status (5)

Country Link
JP (1) JP2024094620A (https=)
KR (1) KR20250130328A (https=)
CN (1) CN120418955A (https=)
TW (1) TW202435372A (https=)
WO (1) WO2024143520A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3287310B2 (ja) * 1998-06-30 2002-06-04 カシオ計算機株式会社 半導体装置及びその製造方法
JP2000349198A (ja) * 1999-04-02 2000-12-15 Nitto Denko Corp チップサイズパッケージ用インターポーザ及びその製造方法と中間部材
JP2002223050A (ja) * 2001-01-29 2002-08-09 Hitachi Metals Ltd 複合金属板、ビルドアップコア基板、ビルドアップ配線基板、及びその製造方法
JP2006186321A (ja) * 2004-12-01 2006-07-13 Shinko Electric Ind Co Ltd 回路基板の製造方法及び電子部品実装構造体の製造方法
JP2016039285A (ja) * 2014-08-08 2016-03-22 イビデン株式会社 プリント配線板の製造方法
JP7357436B2 (ja) * 2017-04-10 2023-10-06 日東電工株式会社 撮像素子実装基板、その製造方法、および、実装基板集合体
JP2018207082A (ja) * 2017-06-09 2018-12-27 イビデン株式会社 リジッドフレキシブル配線板およびその製造方法

Also Published As

Publication number Publication date
CN120418955A (zh) 2025-08-01
TW202435372A (zh) 2024-09-01
KR20250130328A (ko) 2025-09-01
WO2024143520A1 (ja) 2024-07-04

Similar Documents

Publication Publication Date Title
US9723729B2 (en) Printed wiring board
US9258899B2 (en) Method of fabricating a wiring board
CN101548378B (zh) 半导体器件及其制造方法
JP6029958B2 (ja) 配線基板の製造方法
WO2010137420A1 (ja) 配線板及びその製造方法
TWI390696B (zh) 半導體裝置及其製造方法
JP6637847B2 (ja) 配線基板、配線基板の製造方法
JP7539820B2 (ja) 配線基板及び半導体装置
JP2018082084A (ja) プリント配線板およびプリント配線板の製造方法
US11935822B2 (en) Wiring substrate having metal post offset from conductor pad and method for manufacturing wiring substrate
US20220013455A1 (en) Wiring substrate and method for manufacturing wiring substrate
JP2024094620A (ja) 配線回路基板、電気的要素実装基板、配線回路基板の製造方法および電気的要素実装基板の製造方法
US9041166B2 (en) Manufacturing method of circuit structure
US11749596B2 (en) Wiring substrate
JP2018032661A (ja) プリント配線板およびその製造方法
JP2024094622A (ja) 配線回路基板およびその製造方法
JP2024094621A (ja) 電気的要素実装基板の製造方法
JP2023087329A (ja) 配線基板
JP2017201674A (ja) プリント配線板およびその製造方法
JP4514538B2 (ja) 回路装置およびその製造方法
JP6259045B2 (ja) 配線基板の製造方法
US12394702B2 (en) Wiring board
JP2025008669A (ja) 配線回路基板および配線回路基板の製造方法
JP2024159298A (ja) 配線回路基板およびその製造方法
JP2025039435A (ja) 配線回路基板および配線回路基板集合体シート

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20251226

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20251226