JP2023549527A5 - - Google Patents
Info
- Publication number
- JP2023549527A5 JP2023549527A5 JP2023528612A JP2023528612A JP2023549527A5 JP 2023549527 A5 JP2023549527 A5 JP 2023549527A5 JP 2023528612 A JP2023528612 A JP 2023528612A JP 2023528612 A JP2023528612 A JP 2023528612A JP 2023549527 A5 JP2023549527 A5 JP 2023549527A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- covering
- ring
- inner lip
- annular body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/951,823 US11996315B2 (en) | 2020-11-18 | 2020-11-18 | Thin substrate handling via edge clamping |
| US16/951,823 | 2020-11-18 | ||
| PCT/US2021/059404 WO2022108879A1 (en) | 2020-11-18 | 2021-11-15 | Thin substrate handling via edge clamping |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2023549527A JP2023549527A (ja) | 2023-11-27 |
| JP2023549527A5 true JP2023549527A5 (https=) | 2024-11-22 |
Family
ID=81587901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023528612A Pending JP2023549527A (ja) | 2020-11-18 | 2021-11-15 | エッジクランプによる薄型基板ハンドリング |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US11996315B2 (https=) |
| JP (1) | JP2023549527A (https=) |
| CN (1) | CN116711060A (https=) |
| TW (1) | TWI910268B (https=) |
| WO (1) | WO2022108879A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11935728B2 (en) * | 2020-01-31 | 2024-03-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and method of manufacturing a semiconductor device |
| US11996315B2 (en) * | 2020-11-18 | 2024-05-28 | Applied Materials, Inc. | Thin substrate handling via edge clamping |
| USD1038049S1 (en) | 2020-11-18 | 2024-08-06 | Applied Materials, Inc. | Cover ring for use in semiconductor processing chamber |
| US12371790B2 (en) * | 2022-08-17 | 2025-07-29 | Sky Tech Inc. | Wafer carrier with adjustable alignment devices and deposition equipment using the same |
| US20240186176A1 (en) * | 2022-12-02 | 2024-06-06 | Onto Innovation Inc. | Stage actuator particle shield |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5524905A (en) | 1994-09-28 | 1996-06-11 | Greene, Tweed Of Delaware, Inc. | Sealing assembly with T-shaped seal ring and anti-extrusion rings |
| US5632873A (en) * | 1995-05-22 | 1997-05-27 | Stevens; Joseph J. | Two piece anti-stick clamp ring |
| US5632673A (en) | 1995-10-30 | 1997-05-27 | Chrysler Corporation | Ventilation system for lightweight automobile |
| US5810931A (en) * | 1996-07-30 | 1998-09-22 | Applied Materials, Inc. | High aspect ratio clamp ring |
| US6051122A (en) * | 1997-08-21 | 2000-04-18 | Applied Materials, Inc. | Deposition shield assembly for a semiconductor wafer processing system |
| US6123804A (en) * | 1999-02-22 | 2000-09-26 | Applied Materials, Inc. | Sectional clamp ring |
| US6162336A (en) * | 1999-07-12 | 2000-12-19 | Chartered Semiconductor Manufacturing Ltd. | Clamping ring design to reduce wafer sticking problem in metal deposition |
| US20040149226A1 (en) * | 2003-01-30 | 2004-08-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Substrate clamp ring with removable contract pads |
| JP2005333063A (ja) * | 2004-05-21 | 2005-12-02 | Renesas Technology Corp | クランプ部材、成膜装置、成膜方法、半導体装置の製造方法 |
| JP3887394B2 (ja) * | 2004-10-08 | 2007-02-28 | 芝浦メカトロニクス株式会社 | 脆性材料の割断加工システム及びその方法 |
| USD559993S1 (en) | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
| TWD121115S1 (zh) | 2005-03-30 | 2008-01-21 | 東京威力科創股份有限公司 | 遮護環 |
| DE102005032547B4 (de) * | 2005-07-12 | 2010-01-07 | Texas Instruments Deutschland Gmbh | Wafer-Klemmanordnung zur Aufnahme eines Wafers während eines Abscheidungsverfahrens |
| USD557226S1 (en) | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| US7520969B2 (en) | 2006-03-07 | 2009-04-21 | Applied Materials, Inc. | Notched deposition ring |
| US20070283884A1 (en) * | 2006-05-30 | 2007-12-13 | Applied Materials, Inc. | Ring assembly for substrate processing chamber |
| US7981262B2 (en) | 2007-01-29 | 2011-07-19 | Applied Materials, Inc. | Process kit for substrate processing chamber |
| JP5916384B2 (ja) | 2008-04-16 | 2016-05-11 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | ウェハ処理堆積物遮蔽構成材 |
| US9490166B2 (en) * | 2010-12-08 | 2016-11-08 | Evatec Ag | Apparatus and method for depositing a layer onto a substrate |
| JP6056403B2 (ja) * | 2012-11-15 | 2017-01-11 | 東京エレクトロン株式会社 | 成膜装置 |
| US9472443B2 (en) | 2013-03-14 | 2016-10-18 | Applied Materials, Inc. | Selectively groundable cover ring for substrate process chambers |
| JP1494712S (https=) | 2013-05-15 | 2017-04-03 | ||
| TWD161030S (zh) | 2013-08-12 | 2014-06-11 | 陳世發 | 基板保持環 |
| CN104862660B (zh) * | 2014-02-24 | 2017-10-13 | 北京北方华创微电子装备有限公司 | 承载装置及等离子体加工设备 |
| US9343343B2 (en) | 2014-05-19 | 2016-05-17 | Asm Ip Holding B.V. | Method for reducing particle generation at bevel portion of substrate |
| USD797691S1 (en) | 2016-04-14 | 2017-09-19 | Applied Materials, Inc. | Composite edge ring |
| JP1584906S (https=) | 2017-01-31 | 2017-08-28 | ||
| JP1584241S (https=) | 2017-01-31 | 2017-08-21 | ||
| JP1598998S (https=) | 2017-08-31 | 2018-03-05 | ||
| USD888903S1 (en) | 2018-12-17 | 2020-06-30 | Applied Materials, Inc. | Deposition ring for physical vapor deposition chamber |
| KR102305539B1 (ko) | 2019-04-16 | 2021-09-27 | 주식회사 티씨케이 | SiC 엣지 링 |
| KR102277809B1 (ko) | 2019-07-15 | 2021-07-14 | 세메스 주식회사 | 기판 지지 유닛 및 이를 구비하는 기판 처리 시스템 |
| JP1659287S (https=) | 2019-10-18 | 2020-05-11 | ||
| USD934315S1 (en) | 2020-03-20 | 2021-10-26 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
| US12100579B2 (en) * | 2020-11-18 | 2024-09-24 | Applied Materials, Inc. | Deposition ring for thin substrate handling via edge clamping |
| US11996315B2 (en) * | 2020-11-18 | 2024-05-28 | Applied Materials, Inc. | Thin substrate handling via edge clamping |
-
2020
- 2020-11-18 US US16/951,823 patent/US11996315B2/en active Active
-
2021
- 2021-11-15 CN CN202180080408.2A patent/CN116711060A/zh active Pending
- 2021-11-15 JP JP2023528612A patent/JP2023549527A/ja active Pending
- 2021-11-15 WO PCT/US2021/059404 patent/WO2022108879A1/en not_active Ceased
- 2021-11-17 TW TW110142710A patent/TWI910268B/zh active
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