JP1494712S - - Google Patents
Info
- Publication number
- JP1494712S JP1494712S JPD2013-10671F JP2013010671F JP1494712S JP 1494712 S JP1494712 S JP 1494712S JP 2013010671 F JP2013010671 F JP 2013010671F JP 1494712 S JP1494712 S JP 1494712S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2013-10671F JP1494712S (https=) | 2013-05-15 | 2013-05-15 | |
| US29/472,350 USD766849S1 (en) | 2013-05-15 | 2013-11-12 | Substrate retaining ring |
| TW102307326F TWD167109S (zh) | 2013-05-15 | 2013-11-14 | 基板保持環 |
| US29/573,831 USD793976S1 (en) | 2013-05-15 | 2016-08-10 | Substrate retaining ring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2013-10671F JP1494712S (https=) | 2013-05-15 | 2013-05-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1494712S true JP1494712S (https=) | 2017-04-03 |
Family
ID=58418545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2013-10671F Active JP1494712S (https=) | 2013-05-15 | 2013-05-15 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1494712S (https=) |
| TW (1) | TWD167109S (https=) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD981459S1 (en) | 2021-06-16 | 2023-03-21 | Ebara Corporation | Retaining ring for substrate |
| USD1063595S1 (en) | 2023-03-30 | 2025-02-25 | Samsung Electronics Co., Ltd. | CMP (chemical mechanical planarization) retaining ring |
| USD1103131S1 (en) | 2023-07-17 | 2025-11-25 | Samsung Electronics Co., Ltd. | CMP (chemical mechanical planarization) retaining ring |
| USD1103949S1 (en) | 2023-07-17 | 2025-12-02 | Samsung Electronics Co., Ltd. | CMP (chemical mechanical planarization) retaining ring |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7098273B2 (ja) | 2016-03-04 | 2022-07-11 | アプライド マテリアルズ インコーポレイテッド | ユニバーサルプロセスキット |
| USD942516S1 (en) | 2019-02-08 | 2022-02-01 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD933725S1 (en) | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
| USD931241S1 (en) | 2019-08-28 | 2021-09-21 | Applied Materials, Inc. | Lower shield for a substrate processing chamber |
| US11996315B2 (en) | 2020-11-18 | 2024-05-28 | Applied Materials, Inc. | Thin substrate handling via edge clamping |
| USD1038049S1 (en) | 2020-11-18 | 2024-08-06 | Applied Materials, Inc. | Cover ring for use in semiconductor processing chamber |
| JP1782147S (ja) | 2024-03-29 | 2024-10-11 | カバーリング | |
| JP1790303S (ja) | 2024-07-10 | 2025-01-31 | カバーリング |
-
2013
- 2013-05-15 JP JPD2013-10671F patent/JP1494712S/ja active Active
- 2013-11-14 TW TW102307326F patent/TWD167109S/zh unknown
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD981459S1 (en) | 2021-06-16 | 2023-03-21 | Ebara Corporation | Retaining ring for substrate |
| USD1063595S1 (en) | 2023-03-30 | 2025-02-25 | Samsung Electronics Co., Ltd. | CMP (chemical mechanical planarization) retaining ring |
| USD1103131S1 (en) | 2023-07-17 | 2025-11-25 | Samsung Electronics Co., Ltd. | CMP (chemical mechanical planarization) retaining ring |
| USD1103949S1 (en) | 2023-07-17 | 2025-12-02 | Samsung Electronics Co., Ltd. | CMP (chemical mechanical planarization) retaining ring |
Also Published As
| Publication number | Publication date |
|---|---|
| TWD167109S (zh) | 2015-04-11 |