JP2023531530A5 - - Google Patents
Info
- Publication number
- JP2023531530A5 JP2023531530A5 JP2022579815A JP2022579815A JP2023531530A5 JP 2023531530 A5 JP2023531530 A5 JP 2023531530A5 JP 2022579815 A JP2022579815 A JP 2022579815A JP 2022579815 A JP2022579815 A JP 2022579815A JP 2023531530 A5 JP2023531530 A5 JP 2023531530A5
- Authority
- JP
- Japan
- Prior art keywords
- region
- machine learning
- process layer
- regions
- structures
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IN202041026631 | 2020-06-24 | ||
| IN202041026631 | 2020-06-24 | ||
| US202063063973P | 2020-08-11 | 2020-08-11 | |
| US63/063,973 | 2020-08-11 | ||
| US17/135,998 | 2020-12-29 | ||
| US17/135,998 US11967058B2 (en) | 2020-06-24 | 2020-12-29 | Semiconductor overlay measurements using machine learning |
| PCT/US2021/038563 WO2021262778A1 (en) | 2020-06-24 | 2021-06-23 | Semiconductor overlay measurements using machine learning |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023531530A JP2023531530A (ja) | 2023-07-24 |
| JP2023531530A5 true JP2023531530A5 (https=) | 2024-04-04 |
| JP7490094B2 JP7490094B2 (ja) | 2024-05-24 |
Family
ID=79031289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022579815A Active JP7490094B2 (ja) | 2020-06-24 | 2021-06-23 | 機械学習を用いた半導体オーバーレイ測定 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US11967058B2 (https=) |
| EP (1) | EP4150662A4 (https=) |
| JP (1) | JP7490094B2 (https=) |
| KR (1) | KR102797875B1 (https=) |
| CN (1) | CN115699282A (https=) |
| IL (1) | IL298625B2 (https=) |
| TW (1) | TWI864292B (https=) |
| WO (1) | WO2021262778A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12014961B2 (en) * | 2021-04-19 | 2024-06-18 | Nanya Technology Corporation | Method of semiconductor overlay measuring and method of semiconductor structure manufacturing |
| US12535744B2 (en) * | 2022-10-31 | 2026-01-27 | Kla Corporation | Overlay estimation based on optical inspection and machine learning |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100834832B1 (ko) | 2006-11-29 | 2008-06-03 | 삼성전자주식회사 | 오버레이 계측설비를 이용한 패턴의 임계치수 측정방법 |
| US8148682B2 (en) * | 2009-12-29 | 2012-04-03 | Hitachi, Ltd. | Method and apparatus for pattern position and overlay measurement |
| JP5081276B2 (ja) | 2010-06-02 | 2012-11-28 | 株式会社日立ハイテクノロジーズ | パターン計測装置、パターン計測方法、およびプログラム |
| JP6029293B2 (ja) * | 2012-03-07 | 2016-11-24 | 株式会社日立ハイテクノロジーズ | 走査型電子顕微鏡の画像処理装置、および、走査方法 |
| KR102521159B1 (ko) * | 2014-11-25 | 2023-04-13 | 피디에프 솔루션즈, 인코포레이티드 | 반도체 제조 공정을 위한 개선된 공정 제어 기술 |
| US10545490B2 (en) * | 2015-06-01 | 2020-01-28 | Applied Materials Israel Ltd. | Method of inspecting a specimen and system thereof |
| US9530199B1 (en) * | 2015-07-13 | 2016-12-27 | Applied Materials Israel Ltd | Technique for measuring overlay between layers of a multilayer structure |
| KR102278879B1 (ko) * | 2016-01-27 | 2021-07-19 | 주식회사 히타치하이테크 | 계측 장치, 방법 및 표시 장치 |
| US10615084B2 (en) | 2016-03-01 | 2020-04-07 | Asml Netherlands B.V. | Method and apparatus to determine a patterning process parameter, associated with a change in a physical configuration, using measured pixel optical characteristic values |
| US11580398B2 (en) | 2016-10-14 | 2023-02-14 | KLA-Tenor Corp. | Diagnostic systems and methods for deep learning models configured for semiconductor applications |
| US10817999B2 (en) | 2017-07-18 | 2020-10-27 | Kla Corporation | Image-based overlay metrology and monitoring using through-focus imaging |
| US10915017B2 (en) * | 2017-08-31 | 2021-02-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | Multi-function overlay marks for reducing noise and extracting focus and critical dimension information |
| US10795268B2 (en) * | 2017-09-29 | 2020-10-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for measuring overlay errors using overlay measurement patterns |
| US10837919B2 (en) * | 2017-11-06 | 2020-11-17 | Kla Corporation | Single cell scatterometry overlay targets |
| CN116758012A (zh) | 2018-06-08 | 2023-09-15 | Asml荷兰有限公司 | 确定与在衬底上的结构相关的感兴趣的特性的方法、掩模版、衬底 |
| US11094053B2 (en) | 2018-10-08 | 2021-08-17 | Kla Corporation | Deep learning based adaptive regions of interest for critical dimension measurements of semiconductor substrates |
| JP7209835B2 (ja) * | 2018-11-30 | 2023-01-20 | エーエスエムエル ネザーランズ ビー．ブイ． | 機械学習モデル予測における不確実性を減少させる方法 |
| JP7341241B2 (ja) * | 2019-08-30 | 2023-09-08 | 株式会社日立ハイテク | 計測システム、所定の構造を含む半導体の画像計測を行う際に用いる学習モデルを生成する方法、およびコンピュータに、所定の構造を含む半導体の画像計測を行う際に用いる学習モデルを生成する処理を実行させるためのプログラムを格納する記憶媒体 |
| US12197138B2 (en) * | 2021-02-25 | 2025-01-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Machine learning on overlay management |
-
2020
- 2020-12-29 US US17/135,998 patent/US11967058B2/en active Active
-
2021
- 2021-06-07 TW TW110120546A patent/TWI864292B/zh active
- 2021-06-23 CN CN202180042124.4A patent/CN115699282A/zh active Pending
- 2021-06-23 EP EP21830308.9A patent/EP4150662A4/en active Pending
- 2021-06-23 IL IL298625A patent/IL298625B2/en unknown
- 2021-06-23 KR KR1020227045264A patent/KR102797875B1/ko active Active
- 2021-06-23 WO PCT/US2021/038563 patent/WO2021262778A1/en not_active Ceased
- 2021-06-23 JP JP2022579815A patent/JP7490094B2/ja active Active
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