JP2023041623A5 - - Google Patents

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Publication number
JP2023041623A5
JP2023041623A5 JP2022129475A JP2022129475A JP2023041623A5 JP 2023041623 A5 JP2023041623 A5 JP 2023041623A5 JP 2022129475 A JP2022129475 A JP 2022129475A JP 2022129475 A JP2022129475 A JP 2022129475A JP 2023041623 A5 JP2023041623 A5 JP 2023041623A5
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JP
Japan
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mask
contour
contours
images
image
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Pending
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JP2022129475A
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English (en)
Japanese (ja)
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JP2023041623A (ja
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Priority claimed from US17/473,342 external-priority patent/US12400314B2/en
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Publication of JP2023041623A publication Critical patent/JP2023041623A/ja
Publication of JP2023041623A5 publication Critical patent/JP2023041623A5/ja
Pending legal-status Critical Current

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JP2022129475A 2021-09-13 2022-08-16 半導体試料製造のためのマスク検査 Pending JP2023041623A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/473,342 US12400314B2 (en) 2021-09-13 2021-09-13 Mask inspection for semiconductor specimen fabrication
US17/473,342 2021-09-13

Publications (2)

Publication Number Publication Date
JP2023041623A JP2023041623A (ja) 2023-03-24
JP2023041623A5 true JP2023041623A5 (https=) 2025-08-22

Family

ID=85431320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022129475A Pending JP2023041623A (ja) 2021-09-13 2022-08-16 半導体試料製造のためのマスク検査

Country Status (5)

Country Link
US (1) US12400314B2 (https=)
JP (1) JP2023041623A (https=)
KR (1) KR102922494B1 (https=)
CN (1) CN115797249A (https=)
TW (1) TW202312099A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102951001B1 (ko) * 2021-08-23 2026-04-09 삼성전자주식회사 웨이퍼 불량 검사 장치, 웨이퍼 불량 검사 시스템, 웨이퍼 검사 방법 및 웨이퍼 제조 방법
US20250308032A1 (en) * 2024-04-02 2025-10-02 Applied Materials Israel Ltd. Edge detection for greyscale images
CN119797274B (zh) * 2025-03-13 2025-07-15 中北大学 一种n型SiC耐高温欧姆接触电极结构的制备方法
CN120599588B (zh) * 2025-08-06 2025-09-30 昆山大洋电路板有限公司 一种基于机器视觉的装配式印刷电路板检测系统

Family Cites Families (15)

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US5795688A (en) * 1996-08-14 1998-08-18 Micron Technology, Inc. Process for detecting defects in photomasks through aerial image comparisons
US7155052B2 (en) * 2002-06-10 2006-12-26 Tokyo Seimitsu (Israel) Ltd Method for pattern inspection
KR100474571B1 (ko) * 2002-09-23 2005-03-10 삼성전자주식회사 웨이퍼의 패턴 검사용 기준 이미지 설정 방법과 이 설정방법을 이용한 패턴 검사 방법 및 장치
JP4862031B2 (ja) * 2008-10-20 2012-01-25 株式会社ニューフレアテクノロジー マスク欠陥レビュー方法及びマスク欠陥レビュー装置
JP5498189B2 (ja) * 2010-02-08 2014-05-21 株式会社日立ハイテクノロジーズ 欠陥検査方法及びその装置
KR20120068128A (ko) * 2010-12-17 2012-06-27 삼성전자주식회사 패턴의 결함 검출 방법 및 이를 수행하기 위한 결함 검출 장치
US9367911B2 (en) * 2012-06-13 2016-06-14 Applied Materials Israel, Ltd. Apparatus and method for defect detection including patch-to-patch comparisons
JP5478681B2 (ja) * 2012-08-24 2014-04-23 株式会社日立ハイテクノロジーズ 半導体欠陥検査装置ならびにその方法
WO2015027198A1 (en) * 2013-08-23 2015-02-26 Kla-Tencor Corporation Block-to-block reticle inspection
US9747518B2 (en) * 2014-05-06 2017-08-29 Kla-Tencor Corporation Automatic calibration sample selection for die-to-database photomask inspection
JP2017009379A (ja) * 2015-06-19 2017-01-12 株式会社ニューフレアテクノロジー 検査装置および検査方法
WO2017203554A1 (ja) * 2016-05-23 2017-11-30 株式会社日立ハイテクノロジーズ 検査用情報生成装置、検査用情報生成方法、及び欠陥検査装置
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US12243237B2 (en) * 2020-01-10 2025-03-04 Tasmit, Inc. Pattern-edge detection method, pattern-edge detection apparatus, and storage medium storing program for causing a computer to perform pattern-edge detection

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