JP2023041623A - 半導体試料製造のためのマスク検査 - Google Patents

半導体試料製造のためのマスク検査 Download PDF

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Publication number
JP2023041623A
JP2023041623A JP2022129475A JP2022129475A JP2023041623A JP 2023041623 A JP2023041623 A JP 2023041623A JP 2022129475 A JP2022129475 A JP 2022129475A JP 2022129475 A JP2022129475 A JP 2022129475A JP 2023041623 A JP2023041623 A JP 2023041623A
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JP
Japan
Prior art keywords
mask
contours
contour
image
images
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Pending
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JP2022129475A
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English (en)
Japanese (ja)
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JP2023041623A5 (https=
Inventor
シュカリム アリエル
Shkalim Ariel
バル エフゲニー
Bal Evgeny
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Applied Materials Israel Ltd
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Applied Materials Israel Ltd
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Application filed by Applied Materials Israel Ltd filed Critical Applied Materials Israel Ltd
Publication of JP2023041623A publication Critical patent/JP2023041623A/ja
Publication of JP2023041623A5 publication Critical patent/JP2023041623A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0008—Industrial image inspection checking presence/absence
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/11—Region-based segmentation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G01N2021/95615—Inspecting patterns on the surface of objects using a comparative method with stored comparision signal
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95676—Masks, reticles, shadow masks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Image Processing (AREA)
JP2022129475A 2021-09-13 2022-08-16 半導体試料製造のためのマスク検査 Pending JP2023041623A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/473,342 US12400314B2 (en) 2021-09-13 2021-09-13 Mask inspection for semiconductor specimen fabrication
US17/473,342 2021-09-13

Publications (2)

Publication Number Publication Date
JP2023041623A true JP2023041623A (ja) 2023-03-24
JP2023041623A5 JP2023041623A5 (https=) 2025-08-22

Family

ID=85431320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022129475A Pending JP2023041623A (ja) 2021-09-13 2022-08-16 半導体試料製造のためのマスク検査

Country Status (5)

Country Link
US (1) US12400314B2 (https=)
JP (1) JP2023041623A (https=)
KR (1) KR102922494B1 (https=)
CN (1) CN115797249A (https=)
TW (1) TW202312099A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102951001B1 (ko) * 2021-08-23 2026-04-09 삼성전자주식회사 웨이퍼 불량 검사 장치, 웨이퍼 불량 검사 시스템, 웨이퍼 검사 방법 및 웨이퍼 제조 방법
US20250308032A1 (en) * 2024-04-02 2025-10-02 Applied Materials Israel Ltd. Edge detection for greyscale images
CN119797274B (zh) * 2025-03-13 2025-07-15 中北大学 一种n型SiC耐高温欧姆接触电极结构的制备方法
CN120599588B (zh) * 2025-08-06 2025-09-30 昆山大洋电路板有限公司 一种基于机器视觉的装配式印刷电路板检测系统

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005529388A (ja) * 2002-06-10 2005-09-29 株式会社東京精密 パターン検査方法
JP2010096690A (ja) * 2008-10-20 2010-04-30 Nuflare Technology Inc マスク欠陥レビュー方法及びマスク欠陥レビュー装置
JP2011163855A (ja) * 2010-02-08 2011-08-25 Hitachi High-Technologies Corp 欠陥検査方法及びその装置
JP2013030782A (ja) * 2012-08-24 2013-02-07 Hitachi High-Technologies Corp 半導体欠陥検査装置ならびにその方法
JP2014002144A (ja) * 2012-06-13 2014-01-09 Applied Materials Israel Ltd パッチ・ツー・パッチ比較を含む欠陥検出のための装置及び方法
WO2020174342A1 (en) * 2019-02-25 2020-09-03 D2S, Inc. Methods and systems to classify features in electronic designs

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Publication number Priority date Publication date Assignee Title
US5795688A (en) * 1996-08-14 1998-08-18 Micron Technology, Inc. Process for detecting defects in photomasks through aerial image comparisons
KR100474571B1 (ko) * 2002-09-23 2005-03-10 삼성전자주식회사 웨이퍼의 패턴 검사용 기준 이미지 설정 방법과 이 설정방법을 이용한 패턴 검사 방법 및 장치
KR20120068128A (ko) * 2010-12-17 2012-06-27 삼성전자주식회사 패턴의 결함 검출 방법 및 이를 수행하기 위한 결함 검출 장치
WO2015027198A1 (en) * 2013-08-23 2015-02-26 Kla-Tencor Corporation Block-to-block reticle inspection
US9747518B2 (en) * 2014-05-06 2017-08-29 Kla-Tencor Corporation Automatic calibration sample selection for die-to-database photomask inspection
JP2017009379A (ja) * 2015-06-19 2017-01-12 株式会社ニューフレアテクノロジー 検査装置および検査方法
WO2017203554A1 (ja) * 2016-05-23 2017-11-30 株式会社日立ハイテクノロジーズ 検査用情報生成装置、検査用情報生成方法、及び欠陥検査装置
CN113454533B (zh) * 2019-02-25 2025-04-01 Asml荷兰有限公司 用于确定印刷图案的随机变化的方法
US12243237B2 (en) * 2020-01-10 2025-03-04 Tasmit, Inc. Pattern-edge detection method, pattern-edge detection apparatus, and storage medium storing program for causing a computer to perform pattern-edge detection

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005529388A (ja) * 2002-06-10 2005-09-29 株式会社東京精密 パターン検査方法
JP2010096690A (ja) * 2008-10-20 2010-04-30 Nuflare Technology Inc マスク欠陥レビュー方法及びマスク欠陥レビュー装置
JP2011163855A (ja) * 2010-02-08 2011-08-25 Hitachi High-Technologies Corp 欠陥検査方法及びその装置
JP2014002144A (ja) * 2012-06-13 2014-01-09 Applied Materials Israel Ltd パッチ・ツー・パッチ比較を含む欠陥検出のための装置及び方法
JP2013030782A (ja) * 2012-08-24 2013-02-07 Hitachi High-Technologies Corp 半導体欠陥検査装置ならびにその方法
WO2020174342A1 (en) * 2019-02-25 2020-09-03 D2S, Inc. Methods and systems to classify features in electronic designs

Also Published As

Publication number Publication date
KR20230039557A (ko) 2023-03-21
KR102922494B1 (ko) 2026-02-04
TW202312099A (zh) 2023-03-16
CN115797249A (zh) 2023-03-14
US12400314B2 (en) 2025-08-26
US20230080151A1 (en) 2023-03-16

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