TW202312099A - 用於半導體取樣製造的遮罩檢查 - Google Patents

用於半導體取樣製造的遮罩檢查 Download PDF

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Publication number
TW202312099A
TW202312099A TW111123186A TW111123186A TW202312099A TW 202312099 A TW202312099 A TW 202312099A TW 111123186 A TW111123186 A TW 111123186A TW 111123186 A TW111123186 A TW 111123186A TW 202312099 A TW202312099 A TW 202312099A
Authority
TW
Taiwan
Prior art keywords
mask
image
defect
profiles
images
Prior art date
Application number
TW111123186A
Other languages
English (en)
Chinese (zh)
Inventor
艾莉兒 徐卡林
艾夫根尼 巴爾
Original Assignee
以色列商應用材料以色列公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 以色列商應用材料以色列公司 filed Critical 以色列商應用材料以色列公司
Publication of TW202312099A publication Critical patent/TW202312099A/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0008—Industrial image inspection checking presence/absence
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/11—Region-based segmentation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G01N2021/95615—Inspecting patterns on the surface of objects using a comparative method with stored comparision signal
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95676—Masks, reticles, shadow masks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Image Processing (AREA)
TW111123186A 2021-09-13 2022-06-22 用於半導體取樣製造的遮罩檢查 TW202312099A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/473,342 US12400314B2 (en) 2021-09-13 2021-09-13 Mask inspection for semiconductor specimen fabrication
US17/473,342 2021-09-13

Publications (1)

Publication Number Publication Date
TW202312099A true TW202312099A (zh) 2023-03-16

Family

ID=85431320

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111123186A TW202312099A (zh) 2021-09-13 2022-06-22 用於半導體取樣製造的遮罩檢查

Country Status (5)

Country Link
US (1) US12400314B2 (https=)
JP (1) JP2023041623A (https=)
KR (1) KR102922494B1 (https=)
CN (1) CN115797249A (https=)
TW (1) TW202312099A (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102951001B1 (ko) * 2021-08-23 2026-04-09 삼성전자주식회사 웨이퍼 불량 검사 장치, 웨이퍼 불량 검사 시스템, 웨이퍼 검사 방법 및 웨이퍼 제조 방법
US20250308032A1 (en) * 2024-04-02 2025-10-02 Applied Materials Israel Ltd. Edge detection for greyscale images
CN119797274B (zh) * 2025-03-13 2025-07-15 中北大学 一种n型SiC耐高温欧姆接触电极结构的制备方法
CN120599588B (zh) * 2025-08-06 2025-09-30 昆山大洋电路板有限公司 一种基于机器视觉的装配式印刷电路板检测系统

Family Cites Families (15)

* Cited by examiner, † Cited by third party
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US5795688A (en) * 1996-08-14 1998-08-18 Micron Technology, Inc. Process for detecting defects in photomasks through aerial image comparisons
US7155052B2 (en) * 2002-06-10 2006-12-26 Tokyo Seimitsu (Israel) Ltd Method for pattern inspection
KR100474571B1 (ko) * 2002-09-23 2005-03-10 삼성전자주식회사 웨이퍼의 패턴 검사용 기준 이미지 설정 방법과 이 설정방법을 이용한 패턴 검사 방법 및 장치
JP4862031B2 (ja) * 2008-10-20 2012-01-25 株式会社ニューフレアテクノロジー マスク欠陥レビュー方法及びマスク欠陥レビュー装置
JP5498189B2 (ja) * 2010-02-08 2014-05-21 株式会社日立ハイテクノロジーズ 欠陥検査方法及びその装置
KR20120068128A (ko) * 2010-12-17 2012-06-27 삼성전자주식회사 패턴의 결함 검출 방법 및 이를 수행하기 위한 결함 검출 장치
US9367911B2 (en) * 2012-06-13 2016-06-14 Applied Materials Israel, Ltd. Apparatus and method for defect detection including patch-to-patch comparisons
JP5478681B2 (ja) * 2012-08-24 2014-04-23 株式会社日立ハイテクノロジーズ 半導体欠陥検査装置ならびにその方法
WO2015027198A1 (en) * 2013-08-23 2015-02-26 Kla-Tencor Corporation Block-to-block reticle inspection
US9747518B2 (en) * 2014-05-06 2017-08-29 Kla-Tencor Corporation Automatic calibration sample selection for die-to-database photomask inspection
JP2017009379A (ja) * 2015-06-19 2017-01-12 株式会社ニューフレアテクノロジー 検査装置および検査方法
WO2017203554A1 (ja) * 2016-05-23 2017-11-30 株式会社日立ハイテクノロジーズ 検査用情報生成装置、検査用情報生成方法、及び欠陥検査装置
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CN113454533B (zh) * 2019-02-25 2025-04-01 Asml荷兰有限公司 用于确定印刷图案的随机变化的方法
US12243237B2 (en) * 2020-01-10 2025-03-04 Tasmit, Inc. Pattern-edge detection method, pattern-edge detection apparatus, and storage medium storing program for causing a computer to perform pattern-edge detection

Also Published As

Publication number Publication date
KR20230039557A (ko) 2023-03-21
KR102922494B1 (ko) 2026-02-04
CN115797249A (zh) 2023-03-14
US12400314B2 (en) 2025-08-26
JP2023041623A (ja) 2023-03-24
US20230080151A1 (en) 2023-03-16

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