JP2023064098A5 - - Google Patents

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Publication number
JP2023064098A5
JP2023064098A5 JP2022170504A JP2022170504A JP2023064098A5 JP 2023064098 A5 JP2023064098 A5 JP 2023064098A5 JP 2022170504 A JP2022170504 A JP 2022170504A JP 2022170504 A JP2022170504 A JP 2022170504A JP 2023064098 A5 JP2023064098 A5 JP 2023064098A5
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JP
Japan
Prior art keywords
images
poi
mask
values
measurements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022170504A
Other languages
English (en)
Japanese (ja)
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JP2023064098A (ja
Filing date
Publication date
Priority claimed from US17/510,227 external-priority patent/US12361535B2/en
Application filed filed Critical
Publication of JP2023064098A publication Critical patent/JP2023064098A/ja
Publication of JP2023064098A5 publication Critical patent/JP2023064098A5/ja
Pending legal-status Critical Current

Links

JP2022170504A 2021-10-25 2022-10-25 半導体試料製造のためのマスク検査 Pending JP2023064098A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/510,227 US12361535B2 (en) 2021-10-25 2021-10-25 Mask inspection for semiconductor specimen fabrication
US17/510,227 2021-10-25

Publications (2)

Publication Number Publication Date
JP2023064098A JP2023064098A (ja) 2023-05-10
JP2023064098A5 true JP2023064098A5 (https=) 2025-11-05

Family

ID=86055960

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022170504A Pending JP2023064098A (ja) 2021-10-25 2022-10-25 半導体試料製造のためのマスク検査

Country Status (4)

Country Link
US (1) US12361535B2 (https=)
JP (1) JP2023064098A (https=)
KR (1) KR102915785B1 (https=)
CN (1) CN116029966A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3907725A1 (en) * 2020-05-06 2021-11-10 Admesy B.V. Method and setup for performing a series of optical measurements with a 2d imaging system
CN118778352B (zh) * 2024-06-24 2024-12-20 珠海市龙图光罩科技有限公司 掩膜版的参数测量方法、装置、设备、系统以及程序产品

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4663214B2 (ja) * 2001-03-20 2011-04-06 シノプシイス インコーポレイテッド マスク欠陥のプリンタビリティ解析を提供するシステム及び方法
US7729529B2 (en) * 2004-12-07 2010-06-01 Kla-Tencor Technologies Corp. Computer-implemented methods for detecting and/or sorting defects in a design pattern of a reticle
US7953582B2 (en) * 2006-11-21 2011-05-31 Cadence Design Systems, Inc. Method and system for lithography simulation and measurement of critical dimensions
KR101958050B1 (ko) * 2012-04-18 2019-07-04 케이엘에이-텐코 코포레이션 극자외선 레티클의 임계 치수 균일성 모니터링
US10074036B2 (en) * 2014-10-21 2018-09-11 Kla-Tencor Corporation Critical dimension uniformity enhancement techniques and apparatus
KR102735948B1 (ko) * 2015-08-10 2024-11-28 케이엘에이 코포레이션 웨이퍼-레벨 결함 인쇄성을 예측하기 위한 장치 및 방법들
US9875534B2 (en) * 2015-09-04 2018-01-23 Kla-Tencor Corporation Techniques and systems for model-based critical dimension measurements
KR20170042432A (ko) * 2015-10-08 2017-04-19 삼성전자주식회사 포토레지스트 패턴의 검사 방법
DE102016224690B4 (de) * 2016-12-12 2020-07-23 Carl Zeiss Smt Gmbh Verfahren und Vorrichtung zum Untersuchen eines Elements einer photolithographischen Maske für den EUV-Bereich
TWI755453B (zh) * 2017-05-18 2022-02-21 美商克萊譚克公司 鑑定一光微影光罩合格性之方法及系統
US20190164852A1 (en) * 2017-11-28 2019-05-30 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for in-line processing control
TWI716684B (zh) * 2018-05-09 2021-01-21 華邦電子股份有限公司 臨界尺寸量測方法及用於量測臨界尺寸的影像處理裝置
KR20250133438A (ko) * 2020-05-14 2025-09-05 에이에스엠엘 네델란즈 비.브이. 확률적 기여자를 예측하는 방법

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