KR102915785B1 - 반도체 시편 제조를 위한 마스크 검사 - Google Patents

반도체 시편 제조를 위한 마스크 검사

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Publication number
KR102915785B1
KR102915785B1 KR1020220107495A KR20220107495A KR102915785B1 KR 102915785 B1 KR102915785 B1 KR 102915785B1 KR 1020220107495 A KR1020220107495 A KR 1020220107495A KR 20220107495 A KR20220107495 A KR 20220107495A KR 102915785 B1 KR102915785 B1 KR 102915785B1
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South Korea
Prior art keywords
mask
images
poi
measurement
sections
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Application number
KR1020220107495A
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English (en)
Korean (ko)
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KR20230059132A (ko
Inventor
로넨 마드몬
아리엘 쉬칼림
샤니 벤 야코브
Original Assignee
어플라이드 머티리얼즈 이스라엘 리미티드
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Publication of KR20230059132A publication Critical patent/KR20230059132A/ko
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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/20—Image preprocessing
    • G06V10/25—Determination of region of interest [ROI] or a volume of interest [VOI]
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0008—Industrial image inspection checking presence/absence
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/60—Analysis of geometric attributes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • G06T7/74—Determining position or orientation of objects or cameras using feature-based methods involving reference images or patches
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/20—Image preprocessing
    • G06V10/24—Aligning, centring, orientation detection or correction of the image
    • G06V10/245—Aligning, centring, orientation detection or correction of the image by locating a pattern; Special marks for positioning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/74—Image or video pattern matching; Proximity measures in feature spaces
    • G06V10/75—Organisation of the matching processes, e.g. simultaneous or sequential comparisons of image or video features; Coarse-fine approaches, e.g. multi-scale approaches; using context analysis; Selection of dictionaries
    • G06V10/751—Comparing pixel values or logical combinations thereof, or feature values having positional relevance, e.g. template matching
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95676—Masks, reticles, shadow masks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G06T2207/10061—Microscopic image from scanning electron microscope
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20021—Dividing image into blocks, subimages or windows
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/74—Image or video pattern matching; Proximity measures in feature spaces
    • G06V10/75—Organisation of the matching processes, e.g. simultaneous or sequential comparisons of image or video features; Coarse-fine approaches, e.g. multi-scale approaches; using context analysis; Selection of dictionaries
    • G06V10/759—Region-based matching
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V2201/00—Indexing scheme relating to image or video recognition or understanding
    • G06V2201/06—Recognition of objects for industrial automation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Quality & Reliability (AREA)
  • Multimedia (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Geometry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Artificial Intelligence (AREA)
  • Computing Systems (AREA)
  • Software Systems (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Databases & Information Systems (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
KR1020220107495A 2021-10-25 2022-08-26 반도체 시편 제조를 위한 마스크 검사 Active KR102915785B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/510,227 US12361535B2 (en) 2021-10-25 2021-10-25 Mask inspection for semiconductor specimen fabrication
US17/510,227 2021-10-25

Publications (2)

Publication Number Publication Date
KR20230059132A KR20230059132A (ko) 2023-05-03
KR102915785B1 true KR102915785B1 (ko) 2026-01-22

Family

ID=86055960

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020220107495A Active KR102915785B1 (ko) 2021-10-25 2022-08-26 반도체 시편 제조를 위한 마스크 검사

Country Status (4)

Country Link
US (1) US12361535B2 (https=)
JP (1) JP2023064098A (https=)
KR (1) KR102915785B1 (https=)
CN (1) CN116029966A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3907725A1 (en) * 2020-05-06 2021-11-10 Admesy B.V. Method and setup for performing a series of optical measurements with a 2d imaging system
CN118778352B (zh) * 2024-06-24 2024-12-20 珠海市龙图光罩科技有限公司 掩膜版的参数测量方法、装置、设备、系统以及程序产品

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060291714A1 (en) 2004-12-07 2006-12-28 Kenong Wu Computer-implemented methods for detecting and/or sorting defects in a design pattern of a reticle
US20150144798A1 (en) 2012-04-18 2015-05-28 Kla-Tencor Corporation Critical dimension uniformity monitoring for extreme ultraviolet reticles
US20170103924A1 (en) 2015-10-08 2017-04-13 Samsung Electronics Co., Ltd. Method for inspecting photoresist pattern
US10074036B2 (en) 2014-10-21 2018-09-11 Kla-Tencor Corporation Critical dimension uniformity enhancement techniques and apparatus
US20190164852A1 (en) 2017-11-28 2019-05-30 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for in-line processing control

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4663214B2 (ja) * 2001-03-20 2011-04-06 シノプシイス インコーポレイテッド マスク欠陥のプリンタビリティ解析を提供するシステム及び方法
US7953582B2 (en) * 2006-11-21 2011-05-31 Cadence Design Systems, Inc. Method and system for lithography simulation and measurement of critical dimensions
KR102735948B1 (ko) * 2015-08-10 2024-11-28 케이엘에이 코포레이션 웨이퍼-레벨 결함 인쇄성을 예측하기 위한 장치 및 방법들
US9875534B2 (en) * 2015-09-04 2018-01-23 Kla-Tencor Corporation Techniques and systems for model-based critical dimension measurements
DE102016224690B4 (de) * 2016-12-12 2020-07-23 Carl Zeiss Smt Gmbh Verfahren und Vorrichtung zum Untersuchen eines Elements einer photolithographischen Maske für den EUV-Bereich
TWI755453B (zh) * 2017-05-18 2022-02-21 美商克萊譚克公司 鑑定一光微影光罩合格性之方法及系統
TWI716684B (zh) * 2018-05-09 2021-01-21 華邦電子股份有限公司 臨界尺寸量測方法及用於量測臨界尺寸的影像處理裝置
KR20250133438A (ko) * 2020-05-14 2025-09-05 에이에스엠엘 네델란즈 비.브이. 확률적 기여자를 예측하는 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060291714A1 (en) 2004-12-07 2006-12-28 Kenong Wu Computer-implemented methods for detecting and/or sorting defects in a design pattern of a reticle
US20150144798A1 (en) 2012-04-18 2015-05-28 Kla-Tencor Corporation Critical dimension uniformity monitoring for extreme ultraviolet reticles
US10074036B2 (en) 2014-10-21 2018-09-11 Kla-Tencor Corporation Critical dimension uniformity enhancement techniques and apparatus
US20170103924A1 (en) 2015-10-08 2017-04-13 Samsung Electronics Co., Ltd. Method for inspecting photoresist pattern
US20190164852A1 (en) 2017-11-28 2019-05-30 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for in-line processing control

Also Published As

Publication number Publication date
US20230131950A1 (en) 2023-04-27
JP2023064098A (ja) 2023-05-10
US12361535B2 (en) 2025-07-15
CN116029966A (zh) 2023-04-28
KR20230059132A (ko) 2023-05-03

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