JP2023518075A - 2つの部品の複合接続部 - Google Patents
2つの部品の複合接続部 Download PDFInfo
- Publication number
- JP2023518075A JP2023518075A JP2022556495A JP2022556495A JP2023518075A JP 2023518075 A JP2023518075 A JP 2023518075A JP 2022556495 A JP2022556495 A JP 2022556495A JP 2022556495 A JP2022556495 A JP 2022556495A JP 2023518075 A JP2023518075 A JP 2023518075A
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- Prior art keywords
- nanowires
- adhesive
- contact surface
- contact
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002131 composite material Substances 0.000 title 1
- 239000002070 nanowire Substances 0.000 claims abstract description 143
- 239000000853 adhesive Substances 0.000 claims abstract description 118
- 230000001070 adhesive effect Effects 0.000 claims abstract description 118
- 238000000034 method Methods 0.000 claims abstract description 65
- 238000005304 joining Methods 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 4
- 238000004132 cross linking Methods 0.000 claims description 4
- 229920006335 epoxy glue Polymers 0.000 claims description 4
- 239000000463 material Substances 0.000 description 12
- 239000003292 glue Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 238000005219 brazing Methods 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 7
- 230000007797 corrosion Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000005411 Van der Waals force Methods 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000012707 chemical precursor Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
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- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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Abstract
Description
a)第一部品の接触面に、多数のナノワイヤを設けるステップと、
b)第一部品の接触面又は第二部品の接触面又はその両方に、接着剤を塗布するステップと、
c)第一部品と第二部品とを合わせるステップであって、
多数のナノワイヤを第二部品の接触面と接触させて、接触面同士が接着剤によって互いに接続するようにする、ステップと
を含む。
アクリレート、
エポキシ接着剤、
架橋接着剤、
UV光により活性化可能な接着剤、
熱により活性化可能な接着剤、
二液型接着剤
のうちの1つである。
a)第一部品の接触面に第一の多数のナノワイヤを設け、且つ、第二部品の接触面に第二の多数のナノワイヤを設けるステップと、
b)第一部品の接触面及び第二部品の接触面の少なくとも一方に、接着剤を塗布するステップと、
c)第一部品と第二部品とを合わせるステップであって、
第一の多数のナノワイヤを第二部品の接触面と接触させ、第二の多数のナノワイヤを第一部品の接触面と接触させ、接触面が接着剤によって互いに接続されるようにする、ステップ
のように、ステップa)~c)が行われることが好ましい。
アクリレート、
エポキシ接着剤、
架橋接着剤、
UV光により活性化可能な接着剤、
熱により活性化可能な接着剤、
二液型接着剤
のうちの1つであることが好ましい。
この方法は、
a)第一部品2の接触面4上に、及び、選択的に第二部品3の接触面5上に、多数のナノワイヤ1を設けるステップと、
b)第一部品2の接触面4又は第二部品3の接触面5又はその両方に、接着剤6を塗布するステップであって、接着剤6は塗布するときに液体であるのが好ましく、使用される接着剤は、
アクリレート、
エポキシ接着剤、
架橋接着剤、
UV光により活性化可能な接着剤、
熱により活性化可能な接着剤、
二液型接着剤
のうちの1つであることが好ましい、ステップと、
c)第一部品2と第二部品3とを合わせるステップであって、多数のナノワイヤ1を第二部品3の接触面5と接触させて、接触面4、5が接着剤6によって互いに接続するようにする、ステップと、
を含む。この場合、少なくとも第二部品3の接触面5は、最低150℃及び最高270℃の少なくとも一方の温度まで加熱されることが好ましい。第一部品2と第二部品3は、最小2MPa及び最大200MPaの少なくとも一方の圧力で互いに向かって押されることが好ましい。
2 第一部品
3 第二部品
4 第一部品の接触面
5 第二部品の接触面
6 接着剤
7 装置
Claims (11)
- 第一部品(2)を第二部品(3)に接続する方法であって、
a)前記第一部品(2)の接触面(4)に、多数のナノワイヤ(1)を設けるステップと、
b)前記第一部品(2)の前記接触面(4)又は前記第二部品(3)の接触面(5)又はその両方に、接着剤(6)を塗布するステップと、
c)前記第一部品(2)と前記第二部品(3)とを合わせるステップであって、
多数のナノワイヤ(1)を前記第二部品(3)の前記接触面(5)と接触させて、前記接触面(4、5)が前記接着剤(6)によって互いに接続するようにする、ステップと
を含む方法。 - 請求項1に記載の方法であって、
接続部が形成された後に、前記ナノワイヤの少なくともいくつかは、前記接着剤に接触する、
方法。 - 請求項1~2のいずれか一項に記載の方法であって、
前記接着剤(6)は、ステップb)における塗布することのとき、液体である、
方法。 - 請求項1~3のいずれか一項に記載の方法であって、
前記接着剤は、
アクリレート、
エポキシ接着剤、
架橋接着剤、
UV光により活性化可能な接着剤、
熱により活性化可能な接着剤、
二液型接着剤
のうちの1つである、
方法。 - 請求項1~4のいずれか一項に記載の方法であって、
ステップa)において、前記第二部品(3)の前記接触面(5)に、多数のナノワイヤ(1)がさらに設けられ、
ステップc)において、前記第二部品(3)の前記接触面(5)にある前記ナノワイヤ(1)が前記第一部品(2)の前記接触面(4)に接触させられるように、前記部品(2、3)が合わせられる、
方法。 - 請求項1~5のいずれか一項に記載の方法であって、
ステップc)において、少なくとも前記第二部品(3)の前記接触面(5)は、最低90℃及び最高270℃の少なくとも一方の温度まで加熱される、
方法。 - 請求項1~6のいずれか一項に記載の方法であって、
ステップc)で、前記第一部品(2)と前記第二部品(3)とは、最小2MPa及び最大200MPaの少なくとも一方の圧力で互いに向かって押される、
方法。 - 第一部品(2)と第二部品(3)とを備える装置(7)であって、
前記第一部品(2)の接触面(4)と前記第二部品(3)の接触面(5)は、接着剤(6)によって且つ多数のナノワイヤ(1)によって、互いに接続されている、
装置(7)。 - 請求項8に記載の装置(7)であって、
前記ナノワイヤ(1)間の中間空間は、前記接着剤(6)で満たされる、
装置(7)。 - 請求項8又は9に記載の装置(7)であって、
前記接触面(4、5)は、前記ナノワイヤ(1)を用いて、互いに対して電気伝導可能であるか又は熱伝導可能であるか又はその両方の態様で接続される、
装置(7)。 - 請求項8~10のいずれか一項に記載の装置(7)であって、
前記接触面(4、5)は、互いに対して平行に配され、
前記ナノワイヤ(1)は、前記接触面(4、5)に対して直角に配される、
装置(7)。
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DE102017104922A1 (de) | 2017-03-08 | 2018-09-13 | Olav Birlem | Verbindung von elektrischen Leitern |
DE102017104921A1 (de) * | 2017-03-08 | 2018-09-13 | Olav Birlem | Verbindung von thermischen Leitern |
DE102017104923A1 (de) * | 2017-03-08 | 2018-09-13 | Olav Birlem | Verbindung für einen Halbleiterchip |
CA2985254A1 (en) * | 2017-11-14 | 2019-05-14 | Vuereal Inc | Integration and bonding of micro-devices into system substrate |
DE102017126724A1 (de) * | 2017-11-14 | 2019-05-16 | Nanowired Gmbh | Verfahren und Verbindungselement zum Verbinden von zwei Bauteilen sowie Anordnung von zwei verbundenen Bauteilen |
DE102019107355A1 (de) | 2019-03-22 | 2020-09-24 | Harting Electric Gmbh & Co. Kg | Werkzeuglose Kontaktierung eines elektrischen Leiters |
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2020
- 2020-03-17 DE DE102020107240.6A patent/DE102020107240A1/de active Pending
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2021
- 2021-03-08 WO PCT/EP2021/055801 patent/WO2021185617A1/de unknown
- 2021-03-08 KR KR1020227035336A patent/KR20230020944A/ko unknown
- 2021-03-08 EP EP21711205.1A patent/EP4122009A1/de active Pending
- 2021-03-08 JP JP2022556495A patent/JP2023518075A/ja active Pending
- 2021-03-09 TW TW110108369A patent/TW202229000A/zh unknown
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EP4122009A1 (de) | 2023-01-25 |
DE102020107240A1 (de) | 2021-09-23 |
KR20230020944A (ko) | 2023-02-13 |
WO2021185617A1 (de) | 2021-09-23 |
TW202229000A (zh) | 2022-08-01 |
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