JP2023517747A5 - - Google Patents

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Publication number
JP2023517747A5
JP2023517747A5 JP2022555939A JP2022555939A JP2023517747A5 JP 2023517747 A5 JP2023517747 A5 JP 2023517747A5 JP 2022555939 A JP2022555939 A JP 2022555939A JP 2022555939 A JP2022555939 A JP 2022555939A JP 2023517747 A5 JP2023517747 A5 JP 2023517747A5
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JP
Japan
Prior art keywords
layer
substrate
pattern
metric
topographic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022555939A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023517747A (ja
JP7812040B2 (ja
Filing date
Publication date
Priority claimed from US17/122,898 external-priority patent/US11776808B2/en
Application filed filed Critical
Publication of JP2023517747A publication Critical patent/JP2023517747A/ja
Publication of JP2023517747A5 publication Critical patent/JP2023517747A5/ja
Priority to JP2025133001A priority Critical patent/JP2025159084A/ja
Application granted granted Critical
Publication of JP7812040B2 publication Critical patent/JP7812040B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2022555939A 2020-03-17 2021-02-09 スピンオン膜の平坦化 Active JP7812040B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025133001A JP2025159084A (ja) 2020-03-17 2025-08-08 スピンオン膜の平坦化

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US202062990823P 2020-03-17 2020-03-17
US62/990,823 2020-03-17
US17/122,898 US11776808B2 (en) 2020-03-17 2020-12-15 Planarization of spin-on films
US17/122,898 2020-12-15
PCT/US2021/017165 WO2021188226A1 (en) 2020-03-17 2021-02-09 Planarization of spin-on films

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025133001A Division JP2025159084A (ja) 2020-03-17 2025-08-08 スピンオン膜の平坦化

Publications (3)

Publication Number Publication Date
JP2023517747A JP2023517747A (ja) 2023-04-26
JP2023517747A5 true JP2023517747A5 (enExample) 2024-01-16
JP7812040B2 JP7812040B2 (ja) 2026-02-09

Family

ID=77748471

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022555939A Active JP7812040B2 (ja) 2020-03-17 2021-02-09 スピンオン膜の平坦化
JP2025133001A Pending JP2025159084A (ja) 2020-03-17 2025-08-08 スピンオン膜の平坦化

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025133001A Pending JP2025159084A (ja) 2020-03-17 2025-08-08 スピンオン膜の平坦化

Country Status (6)

Country Link
US (1) US11776808B2 (enExample)
JP (2) JP7812040B2 (enExample)
KR (1) KR102901242B1 (enExample)
CN (1) CN115298805B (enExample)
TW (1) TWI896615B (enExample)
WO (1) WO2021188226A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114744065B (zh) * 2022-03-23 2024-06-14 中国电子科技集团公司第十一研究所 台面结构芯片的非接触式光刻方法
US12325046B2 (en) * 2022-06-28 2025-06-10 Canon Kabushiki Kaisha Superstrate including a body and layers and methods of forming and using the same

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0161467B1 (ko) 1995-11-29 1999-02-01 김광호 반도체장치의 평탄화 방법
US6440638B2 (en) 1998-09-28 2002-08-27 International Business Machines Corp. Method and apparatus for resist planarization
US6645851B1 (en) 2002-09-17 2003-11-11 Taiwan Semiconductor Manufacturing Company Method of forming planarized coatings on contact hole patterns of various duty ratios
US20090008579A1 (en) * 2003-10-07 2009-01-08 Tokyo Electron Limited Electron beam lithography apparatus and design method of patterned beam-defining aperture
US7229745B2 (en) * 2004-06-14 2007-06-12 Bae Systems Information And Electronic Systems Integration Inc. Lithographic semiconductor manufacturing using a multi-layered process
JP2006049684A (ja) * 2004-08-06 2006-02-16 Sanyo Electric Co Ltd 半導体装置の製造方法
KR100612027B1 (ko) * 2005-05-12 2006-08-11 삼성전자주식회사 가교 폴리머를 이용한 잉크젯 프린트헤드의 제조방법
US7419611B2 (en) * 2005-09-02 2008-09-02 International Business Machines Corporation Processes and materials for step and flash imprint lithography
US20120266810A1 (en) * 2011-04-20 2012-10-25 Taiwan Semiconductor Manufacturing Company, Ltd. Planarization system for high wafer topography
KR20160083080A (ko) * 2013-11-08 2016-07-11 도쿄엘렉트론가부시키가이샤 화학적 폴리싱 및 평탄화를 위한 방법
JP6893613B2 (ja) 2015-04-13 2021-06-23 東京エレクトロン株式会社 基板を平坦化するためのシステム及び方法
WO2017087066A1 (en) * 2015-11-20 2017-05-26 Tokyo Electron Limited Methods of forming etch masks for sub-resolution substrate patterning
KR102399364B1 (ko) * 2016-10-04 2022-05-18 도쿄엘렉트론가부시키가이샤 기판 제조 동안의 피처 토포그래피에 대한 스핀 코트 평탄화의 용이화
US10790146B2 (en) * 2016-12-05 2020-09-29 Rohm And Haas Electronic Materials Llc Aromatic resins for underlayers
US10991594B2 (en) * 2018-06-22 2021-04-27 Tokyo Electron Limited Method for area-selective etching of silicon nitride layers for the manufacture of microelectronic workpieces
US20200328102A1 (en) 2019-04-15 2020-10-15 Tokyo Electron Limited Method for die-level unique authentication and serialization of semiconductor devices
US20210294148A1 (en) * 2020-03-17 2021-09-23 Tokyo Electron Limited Planarizing Organic Films
US11455436B2 (en) * 2020-03-25 2022-09-27 Tokyo Electron Limited Predicting across wafer spin-on planarization over a patterned topography
US11656550B2 (en) * 2020-09-01 2023-05-23 Tokyo Electron Limited Controlling semiconductor film thickness

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