JP2023504808A - キャリア箔付き金属箔、その製造方法、およびそれを含む積層体 - Google Patents
キャリア箔付き金属箔、その製造方法、およびそれを含む積層体 Download PDFInfo
- Publication number
- JP2023504808A JP2023504808A JP2022532001A JP2022532001A JP2023504808A JP 2023504808 A JP2023504808 A JP 2023504808A JP 2022532001 A JP2022532001 A JP 2022532001A JP 2022532001 A JP2022532001 A JP 2022532001A JP 2023504808 A JP2023504808 A JP 2023504808A
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- Prior art keywords
- foil
- carrier foil
- layer
- metal
- metal foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000011888 foil Substances 0.000 title claims abstract description 224
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 143
- 239000002184 metal Substances 0.000 title claims abstract description 143
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 239000010410 layer Substances 0.000 claims description 132
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 76
- 239000000956 alloy Substances 0.000 claims description 65
- 229910045601 alloy Inorganic materials 0.000 claims description 65
- 239000012044 organic layer Substances 0.000 claims description 52
- 229910052759 nickel Inorganic materials 0.000 claims description 35
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 27
- 229910052750 molybdenum Inorganic materials 0.000 claims description 27
- 239000011733 molybdenum Substances 0.000 claims description 27
- 150000001923 cyclic compounds Chemical class 0.000 claims description 18
- 238000007747 plating Methods 0.000 claims description 18
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- NNRAOBUKHNZQFX-UHFFFAOYSA-N 2H-benzotriazole-4-thiol Chemical compound SC1=CC=CC2=C1NN=N2 NNRAOBUKHNZQFX-UHFFFAOYSA-N 0.000 claims description 11
- 239000011572 manganese Substances 0.000 claims description 10
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 8
- FXSVYLHRUWAOKB-UHFFFAOYSA-N SC1=CC=CC=2NN=NC21.[Na] Chemical compound SC1=CC=CC=2NN=NC21.[Na] FXSVYLHRUWAOKB-UHFFFAOYSA-N 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 229910052698 phosphorus Inorganic materials 0.000 claims description 8
- 239000011574 phosphorus Substances 0.000 claims description 8
- 239000010941 cobalt Substances 0.000 claims description 7
- 229910017052 cobalt Inorganic materials 0.000 claims description 7
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 7
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 229910052748 manganese Inorganic materials 0.000 claims description 6
- GGZHVNZHFYCSEV-UHFFFAOYSA-N 1-Phenyl-5-mercaptotetrazole Chemical compound SC1=NN=NN1C1=CC=CC=C1 GGZHVNZHFYCSEV-UHFFFAOYSA-N 0.000 claims description 5
- AFBBKYQYNPNMAT-UHFFFAOYSA-N 1h-1,2,4-triazol-1-ium-3-thiolate Chemical compound SC=1N=CNN=1 AFBBKYQYNPNMAT-UHFFFAOYSA-N 0.000 claims description 5
- FTERHQFTRLXWDG-UHFFFAOYSA-N 2-methyl-1h-1,2,4-triazole-5-thione Chemical compound CN1C=NC(S)=N1 FTERHQFTRLXWDG-UHFFFAOYSA-N 0.000 claims description 5
- WZUUZPAYWFIBDF-UHFFFAOYSA-N 5-amino-1,2-dihydro-1,2,4-triazole-3-thione Chemical compound NC1=NNC(S)=N1 WZUUZPAYWFIBDF-UHFFFAOYSA-N 0.000 claims description 5
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 claims description 4
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 4
- 239000012964 benzotriazole Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- GTODOEDLCNTSLG-UHFFFAOYSA-N 2h-triazole-4-carboxylic acid Chemical compound OC(=O)C1=CNN=N1 GTODOEDLCNTSLG-UHFFFAOYSA-N 0.000 claims description 2
- 239000000203 mixture Substances 0.000 abstract description 6
- 230000007547 defect Effects 0.000 abstract description 5
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- 230000001070 adhesive effect Effects 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 12
- 238000009713 electroplating Methods 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 239000012535 impurity Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
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- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 3
- 230000003078 antioxidant effect Effects 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 235000015393 sodium molybdate Nutrition 0.000 description 1
- 239000011684 sodium molybdate Substances 0.000 description 1
- TVXXNOYZHKPKGW-UHFFFAOYSA-N sodium molybdate (anhydrous) Chemical compound [Na+].[Na+].[O-][Mo]([O-])(=O)=O TVXXNOYZHKPKGW-UHFFFAOYSA-N 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1637—Composition of the substrate metallic substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
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Abstract
Description
本発明に係るキャリア箔付き金属箔は、キャリア箔、合金層、有機層、および金属層を含む。これらについて以下図1を参照しつつ詳細に説明する。
本発明は、キャリア箔付き金属箔の製造方法を提供する。これについて以下詳細に説明する。
まず、キャリア箔を準備する。具体的には、銅もしくはアルミニウムで形成された金属箔膜;または、ポリエチレンテレフタレート(PET)、ポリフェニレンサルファイド(PPS)、もしくはテフロンで形成されたポリマー薄膜をキャリア箔として準備することができる。
準備したキャリア箔上に合金層を形成する。合金層は、電気めっきまたは無電解めっきにより形成することができる。電気めっきまたは無電解めっきにおいて、ニッケル(Ni)を含有する第1の成分およびモリブデン(Mo)を含有する第2の成分を含むめっき溶液を使用することができる。
次に、形成した合金層上に有機層を形成する。有機層は、浸漬法、シャワー法、またはスプレー法などのコーティング法によって形成することができる。コーティング法では、2個以上の窒素原子を含有する環状化合物を含むコーティング溶液を使用することができる。
次に、形成した有機層上に金属層を形成する。金属層は、電気めっきもしくは無電解めっきなどのめっき法;または、化学蒸着(CVC)、物理化学蒸着(PVC)、もしくはイオンプレーティングなどの蒸着法によって形成することができる。
本発明は、キャリア箔付き金属箔と樹脂基材とを含む積層体を提供する。
18μmの厚さを有する銅箔で形成されたキャリア箔を5重量%の硫酸に沈め(immersed)、漬け込み(pickled)、続いて純水で洗浄した。洗浄したキャリア箔をニッケル(第1の成分)とモリブデン(第2の成分)とを含有するめっき溶液(50g/Lの硫酸ニッケル、60g/Lのモリブデン酸ナトリウム、および50g/Lのクエン酸を含有する水溶液)を用いて電気めっきして、200nmの厚さを有する合金層(ニッケル:モリブデン比=60:40の重量比)を形成した。この場合では、pH10以上を維持しながら、5A/dm2で30秒間電気めっきを行った。
有機層を形成する際にナトリウムメルカプトベンゾトリアゾールの代わりにベンゾトリアゾールを使用したことを除いて、実施例1と同様のプロセスでキャリア箔付き金属箔を製造した。
有機層を形成する際にナトリウムメルカプトベンゾトリアゾールの代わりにメルカプトベンズイミダゾールを使用したことを除いて、実施例1と同様のプロセスでキャリア箔付き金属箔を製造した。
ニッケル:モリブデンの比が80:20の重量比になるようにめっき溶液の組成を調節して合金層を形成したことを除いて、実施例1と同様のプロセスでキャリア箔付き金属箔を製造した。
ニッケル:モリブデンの比が40:60の重量比になるようにめっき溶液の組成を調節して合金層を形成したことを除いて、実施例1と同様のプロセスでキャリア箔付き金属箔を製造した。
ニッケルおよびモリブデンを含有するめっき溶液の代わりに、ニッケル(第1の成分)、モリブデン(第2の成分)、およびコバルト(第3の成分)を含有するめっき溶液を用いて合金層(ニッケル:モリブデン:コバルトの比=50:35:15の重量比)を形成したことを除いて、実施例1と同様のプロセスでキャリア箔付き金属箔を製造した。
ニッケルおよびモリブデンを含有するめっき溶液の代わりに、ニッケル(第1の成分)、モリブデン(第2の成分)、およびリン(第3の成分)を含有するめっき溶液を用いて合金層(ニッケル:モリブデン:リンの比=55:42:3の重量比)を形成したことを除いて、実施例1と同様のプロセスでキャリア箔付き金属箔を製造した。
ニッケルおよびモリブデンを含有するめっき溶液の代わりに、ニッケル(第1の成分)、モリブデン(第2の成分)、およびマンガン(第3の成分)を含有するめっき溶液を用いて合金層(ニッケル:モリブデン:マンガンの比=40:35:25の重量比)を形成したことを除いて、実施例1と同様のプロセスでキャリア箔付き金属箔を製造した。
ニッケルおよびモリブデンを含有するめっき溶液の代わりに、ニッケル(第1の成分)、モリブデン(第2の成分)、マンガン(第3の成分)、およびリン(第4の成分)を含有するめっき溶液を用いて合金層(ニッケル:モリブデン:鉄:リンの比=43:40:15:2の重量比)を形成したことを除いて、実施例1と同様のプロセスでキャリア箔付き金属箔を製造した。
有機層を形成しなかったことを除いて、実施例1と同様のプロセスでキャリア箔付き金属箔を製造した。
ニッケルおよびモリブデンを含有するめっき溶液の代わりに、ニッケルおよび鉄を含有するめっき溶液を用いて有機層(ニッケル:鉄の比=70:30の重量比)を形成したことを除いて、実施例1と同様のプロセスでキャリア箔付き金属箔を製造した。
ニッケルおよびモリブデンを含有するめっき溶液の代わりに、ニッケルおよびコバルトを含有するめっき溶液を用いて有機層(ニッケル:コバルトの比=70:30の重量比)を形成したことを除いて、実施例1と同様のプロセスでキャリア箔付き金属箔を製造した。
ニッケルおよびモリブデンを含有するめっき溶液の代わりに、鉄およびモリブデンを含有するめっき溶液を用いて有機層(鉄:モリブデンの比=70:30の重量比)を形成したことを除いて、実施例1と同様のプロセスでキャリア箔付き金属箔を製造した。
ニッケル:モリブデンの比が85:15の重量比になるようにめっき溶液の組成を調節して合金層を形成したことを除いて、実施例1と同様のプロセスでキャリア箔付き金属箔を製造した。
ニッケル:モリブデンの比が35:65の重量比になるようにめっき溶液の組成を調節して合金層を形成したことを除いて、実施例1と同様のプロセスでキャリア箔付き金属箔を製造した。この場合では、ニッケル:モリブデンの比が35:65の重量比であったため、電気めっきがうまく行われず、合金層が適切に形成されなかった。その結果、続いて形成した有機層と金属層との間の接着強度が低く、キャリア箔付き金属箔として使用するのが困難であった。
実施例1~9および比較例1~5で製造したキャリア箔付き金属箔上に積層された樹脂基材(Doosan Electronics prepreg (DS-7409HG))を形成し、該樹脂基材を220MPaの圧力、220℃で、100分間プレスすることにより積層体を製造した。
実施例1~9および比較例1~5で製造したキャリア箔付き金属箔ならびに製造例1~9および比較製造例1~5で製造した積層体の剥離強度(gf/cm)をIPC-TM-650規格(幅10mm×長さ10cmのプレート状試験片を使用)により測定した。結果を下記表1に示した。ここで、剥離強度とは、金属層と、有機層/合金層/キャリア箔が接着されている構造体との間の剥離強度を意味する。
Claims (8)
- キャリア箔と、
前記キャリア箔上に提供された合金層と、
前記合金層上に提供された有機層と、
前記有機層上に提供された金属層と、
を含む、キャリア箔付き金属箔(carrier foil-attached metal foil)であって、
前記合金層が、ニッケル(Ni)を含有する第1の成分およびモリブデン(Mo)を含有する第2の成分を含み、前記第1の成分aおよび前記第2の成分bの比a:bが、40~80:60~20の重量比であり、
前記有機層が、2個以上の窒素原子を含有する環状化合物を含む、
キャリア箔付き金属箔。 - 前記環状化合物が、ベンゾトリアゾール、メルカプトベンズイミダゾール、メルカプトベンゾトリアゾール、ナトリウムメルカプトベンゾトリアゾール、3-アミノ-5-メルカプト-1,2,4-トリアゾール、3-メルカプト-1,2,4-トリアゾール、トリアゾール-5-カルボン酸、1-メチル-3-メルカプト-1,2,4-トリアゾール、および1-フェニル-5-メルカプトテトラゾールからなる群より選択される少なくとも1種である、請求項1に記載のキャリア箔付き金属箔。
- 前記合金層が、コバルト(Co)、リン(P)、マンガン(Mn)、および鉄(Fe)からなる群より選択される少なくとも1種を含有する第3の成分をさらに含む、請求項1に記載のキャリア箔付き金属箔。
- 前記第1の成分a、前記第2の成分b、および前記第3の成分cの比a:b:cが、30~60:25~50:1~40の重量比である、請求項3に記載のキャリア箔付き金属箔。
- キャリア箔を準備することと、
前記キャリア箔上に合金層を形成することと、
前記合金層上に有機層を形成することと、
前記有機層上に金属層を形成することと、
を含む、キャリア箔付き金属箔(carrier foil-attached metal foil)の製造方法であって、
前記合金層が、ニッケル(Ni)を含有する第1の成分およびモリブデン(Mo)を含有する第2の成分を含むめっき溶液で形成され、前記第1の成分aおよび前記第2の成分bの比a:bが、40~80:60~20の重量比であり、
前記有機層が、2個以上の窒素原子を含有する環状化合物を含むコーティング溶液で形成される、
キャリア箔付き金属箔の製造方法。 - 前記環状化合物の含有量が、100重量部の前記コーティング溶液に対して0.1~2重量部である、請求項5に記載の方法。
- 前記めっき溶液が、コバルト(Co)、リン(P)、マンガン(Mn)、および鉄(Fe)からなる群より選択される少なくとも1種を含有する第3の成分をさらに含む、請求項5に記載の方法。
- 請求項1~請求項4のいずれか1項に記載のキャリア箔付き金属箔と、
前記キャリア箔付き金属箔上に提供された樹脂基材と、
を含む、積層体。
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- 2019-11-27 KR KR1020190154286A patent/KR102137068B1/ko active IP Right Grant
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2020
- 2020-10-15 US US17/779,955 patent/US20230020180A1/en active Pending
- 2020-10-15 CN CN202080094784.2A patent/CN115023514A/zh active Pending
- 2020-10-15 JP JP2022532001A patent/JP2023504808A/ja active Pending
- 2020-10-15 WO PCT/KR2020/014066 patent/WO2021107397A1/ko unknown
- 2020-10-15 EP EP20894258.1A patent/EP4050128A4/en active Pending
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Also Published As
Publication number | Publication date |
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EP4050128A1 (en) | 2022-08-31 |
WO2021107397A1 (ko) | 2021-06-03 |
US20230020180A1 (en) | 2023-01-19 |
CN115023514A (zh) | 2022-09-06 |
EP4050128A4 (en) | 2023-12-27 |
KR102137068B1 (ko) | 2020-07-23 |
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