MY190559A - Copper foil provided with carrier, method of manufacturing copper foil provided with carrier, and copper clad laminate manufactured by using copper foil provided with carrier and manufacturing method of printed wiring board - Google Patents

Copper foil provided with carrier, method of manufacturing copper foil provided with carrier, and copper clad laminate manufactured by using copper foil provided with carrier and manufacturing method of printed wiring board

Info

Publication number
MY190559A
MY190559A MYPI2016703415A MYPI2016703415A MY190559A MY 190559 A MY190559 A MY 190559A MY PI2016703415 A MYPI2016703415 A MY PI2016703415A MY PI2016703415 A MYPI2016703415 A MY PI2016703415A MY 190559 A MY190559 A MY 190559A
Authority
MY
Malaysia
Prior art keywords
carrier
copper foil
foil provided
manufacturing
copper
Prior art date
Application number
MYPI2016703415A
Inventor
Ayumu Tateoka
Yasuo Sato
Hiroyuki Watanabe
Original Assignee
Mitsui Mining & Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co Ltd filed Critical Mitsui Mining & Smelting Co Ltd
Publication of MY190559A publication Critical patent/MY190559A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • C25D1/22—Separating compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/24—Aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

An object of the present invention is to provide a copper foil provided with a carrier in which the copper foil after carrier releasing is hardly oxidized. To achieve the object, the copper foil provided with a carrier comprising the carrier stacked a releasing layer and the copper foil in this order wherein a difference between the lightness L* value on the carrier released surface of the copper foil just after carrier releasing of the copper foil provided with a carrier and a lightness L* value on the carrier released surface of the copper foil after keeping for 3 days in a constant-temperature humidified atmosphere of the temperature of 25?C and the humidity of 50% to 70% is 1.5 or less is employed.
MYPI2016703415A 2014-04-02 2015-04-02 Copper foil provided with carrier, method of manufacturing copper foil provided with carrier, and copper clad laminate manufactured by using copper foil provided with carrier and manufacturing method of printed wiring board MY190559A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014076392 2014-04-02
PCT/JP2015/060492 WO2015152380A1 (en) 2014-04-02 2015-04-02 Copper foil having carrier, production method for copper foil having carrier, and copper clad laminate sheet and printed wiring board obtained using copper foil having carrier

Publications (1)

Publication Number Publication Date
MY190559A true MY190559A (en) 2022-04-27

Family

ID=54240688

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2016703415A MY190559A (en) 2014-04-02 2015-04-02 Copper foil provided with carrier, method of manufacturing copper foil provided with carrier, and copper clad laminate manufactured by using copper foil provided with carrier and manufacturing method of printed wiring board

Country Status (6)

Country Link
JP (1) JP6054523B2 (en)
KR (1) KR101832806B1 (en)
CN (1) CN106133200B (en)
MY (1) MY190559A (en)
TW (1) TWI592066B (en)
WO (1) WO2015152380A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017073121A1 (en) * 2015-10-28 2017-05-04 三井金属鉱業株式会社 Method for manufacturing printed wiring board
KR102137068B1 (en) * 2019-11-27 2020-07-23 와이엠티 주식회사 Carrier foil with metal foil, manufacturing method of the same, and laminate comprising the same
CN112361731A (en) * 2020-11-05 2021-02-12 陕西汉和新材料科技有限公司 Method for preventing copper foil from being oxidized

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05228130A (en) 1992-02-19 1993-09-07 Otax Kk Portable blood monitoring device
JP3676152B2 (en) * 1999-11-11 2005-07-27 三井金属鉱業株式会社 Electrolytic copper foil with carrier foil and method for producing the same
JP3690962B2 (en) 2000-04-26 2005-08-31 三井金属鉱業株式会社 Electrolytic copper foil with carrier foil, method for producing electrolytic copper foil with carrier foil, and copper-clad laminate
JP3973197B2 (en) 2001-12-20 2007-09-12 三井金属鉱業株式会社 Electrolytic copper foil with carrier foil and method for producing the same
CN1984526B (en) 2005-12-15 2011-01-12 古河电气工业株式会社 Ultrathin copper foil with carrier and printed circuit board
TWI402009B (en) * 2007-12-10 2013-07-11 Furukawa Electric Co Ltd Surface treatment of copper foil and circuit substrate
KR101722430B1 (en) * 2009-07-24 2017-04-03 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 Regin composite electrolytic copper foil, copper clad laminate and printed wiring board
JP5503789B2 (en) * 2013-08-30 2014-05-28 三井金属鉱業株式会社 Electrolytic copper foil with carrier foil and copper-clad laminate obtained using the electrolytic copper foil with carrier foil

Also Published As

Publication number Publication date
TW201603659A (en) 2016-01-16
CN106133200B (en) 2018-04-27
JP6054523B2 (en) 2016-12-27
JPWO2015152380A1 (en) 2017-04-13
KR20160114696A (en) 2016-10-05
WO2015152380A1 (en) 2015-10-08
KR101832806B1 (en) 2018-02-28
TWI592066B (en) 2017-07-11
CN106133200A (en) 2016-11-16

Similar Documents

Publication Publication Date Title
EP3026145A4 (en) Treated surface copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper clad laminate, and printed circuit board manufacturing method
SG11201708802VA (en) Resin composition, prepreg, laminate and multilayer printed wiring board
EP3489308A4 (en) Resin composition, laminate sheet, and multilayer printed wiring board
PH12015500027A1 (en) Ultrathin copper foil, method of manufacturing the same, and ultrathin copper layer
EP3290479A4 (en) Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board
MY185462A (en) Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board
EP2947122A4 (en) Resin composition, prepreg, laminate, metal foil-clad laminate, and printed wiring board
UA117159C2 (en) Layered building board for inside and outside
EP3026144A4 (en) Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper-clad laminate, and method for manufacturing printed circuit board
SG11201610849XA (en) Resin composition, prepreg, metallic foil-clad laminate, and printed wiring board
EP3115418A4 (en) Resin composition, prepreg, resin sheet, metal-foil-clad laminated plate, and printed wiring board
EP3805293A4 (en) Resin composition, prepreg, metal foil-tightened laminated sheet, resin sheet, and printed wiring board
MY157604A (en) Copper foil with carrier, and copper clad laminate, printed wiring board and printed circuit board using the same, and method for manufacturing printed wiring board
SG11201609003XA (en) Metal foil with releasing resin layer, and printed wiring board
EP3715393A4 (en) Resin composition, prepreg, resin-including film, resin-including metal foil, metal-clad laminate, and wiring board
EP3375822A4 (en) Resin composition, prepreg, metal foil-clad laminated board, resin sheet, and printed wiring board
EP3046402A4 (en) Adhesive composition for printed wiring boards, bonding film, coverlay, copper-clad laminate and printed wiring board
EP3321322A4 (en) Resin composition, prepreg, resin sheet, metal foil-clad laminate sheet, and printed wiring board
IL262895A (en) Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin composition
SG11201608609UA (en) Copper clad laminate provided with protective layer and multilayered printed wiring board
MY190559A (en) Copper foil provided with carrier, method of manufacturing copper foil provided with carrier, and copper clad laminate manufactured by using copper foil provided with carrier and manufacturing method of printed wiring board
EP3421234A4 (en) Method for the production of multilayer laminated boards and resulting board
EP3412722A4 (en) Halogen-free thermosetting resin composition, prepreg containing same, laminate, and printed circuit board
EP3272782A4 (en) Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board
EP3392286A4 (en) Epoxy resin composition and prepreg, laminated board and printed-circuit board comprising same