JP2023163540A5 - - Google Patents

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Publication number
JP2023163540A5
JP2023163540A5 JP2022074506A JP2022074506A JP2023163540A5 JP 2023163540 A5 JP2023163540 A5 JP 2023163540A5 JP 2022074506 A JP2022074506 A JP 2022074506A JP 2022074506 A JP2022074506 A JP 2022074506A JP 2023163540 A5 JP2023163540 A5 JP 2023163540A5
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JP
Japan
Prior art keywords
layer
film
electrode film
semiconductor device
lower electrode
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Application number
JP2022074506A
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English (en)
Japanese (ja)
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JP7761524B2 (ja
JP2023163540A (ja
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Priority to JP2022074506A priority Critical patent/JP7761524B2/ja
Priority claimed from JP2022074506A external-priority patent/JP7761524B2/ja
Priority to US18/176,671 priority patent/US20230352397A1/en
Publication of JP2023163540A publication Critical patent/JP2023163540A/ja
Publication of JP2023163540A5 publication Critical patent/JP2023163540A5/ja
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Publication of JP7761524B2 publication Critical patent/JP7761524B2/ja
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JP2022074506A 2022-04-28 2022-04-28 半導体装置及び半導体装置の製造方法 Active JP7761524B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022074506A JP7761524B2 (ja) 2022-04-28 2022-04-28 半導体装置及び半導体装置の製造方法
US18/176,671 US20230352397A1 (en) 2022-04-28 2023-03-01 Semiconductor device and method of manufacturing the semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022074506A JP7761524B2 (ja) 2022-04-28 2022-04-28 半導体装置及び半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2023163540A JP2023163540A (ja) 2023-11-10
JP2023163540A5 true JP2023163540A5 (enExample) 2024-09-24
JP7761524B2 JP7761524B2 (ja) 2025-10-28

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ID=88512641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022074506A Active JP7761524B2 (ja) 2022-04-28 2022-04-28 半導体装置及び半導体装置の製造方法

Country Status (2)

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US (1) US20230352397A1 (enExample)
JP (1) JP7761524B2 (enExample)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311299A (ja) * 2004-03-26 2005-11-04 Hitachi Ltd 半導体装置及びその製造方法
JP6075114B2 (ja) * 2013-02-27 2017-02-08 ローム株式会社 半導体装置および半導体装置の製造方法
JP6336826B2 (ja) * 2014-06-04 2018-06-06 ルネサスエレクトロニクス株式会社 半導体装置

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