JP2023157671A5 - - Google Patents

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Publication number
JP2023157671A5
JP2023157671A5 JP2022067732A JP2022067732A JP2023157671A5 JP 2023157671 A5 JP2023157671 A5 JP 2023157671A5 JP 2022067732 A JP2022067732 A JP 2022067732A JP 2022067732 A JP2022067732 A JP 2022067732A JP 2023157671 A5 JP2023157671 A5 JP 2023157671A5
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JP
Japan
Prior art keywords
trench
impurity region
depth
emitter electrode
main surface
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JP2022067732A
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English (en)
Japanese (ja)
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JP2023157671A (ja
JP7788924B2 (ja
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Priority to JP2022067732A priority Critical patent/JP7788924B2/ja
Priority to US18/152,593 priority patent/US20230335604A1/en
Priority to CN202310222416.7A priority patent/CN116913956A/zh
Priority to DE102023202818.2A priority patent/DE102023202818A1/de
Priority to TW112113208A priority patent/TW202343792A/zh
Priority to KR1020230047976A priority patent/KR20230148111A/ko
Publication of JP2023157671A publication Critical patent/JP2023157671A/ja
Publication of JP2023157671A5 publication Critical patent/JP2023157671A5/ja
Application granted granted Critical
Publication of JP7788924B2 publication Critical patent/JP7788924B2/ja
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JP2022067732A 2022-04-15 2022-04-15 半導体装置およびその製造方法 Active JP7788924B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2022067732A JP7788924B2 (ja) 2022-04-15 半導体装置およびその製造方法
US18/152,593 US20230335604A1 (en) 2022-04-15 2023-01-10 Semiconductor device and method of manufacturing the same
CN202310222416.7A CN116913956A (zh) 2022-04-15 2023-03-09 半导体器件及其制造方法
DE102023202818.2A DE102023202818A1 (de) 2022-04-15 2023-03-28 Halbleitervorrichtung und verfahren zu deren herstellung
TW112113208A TW202343792A (zh) 2022-04-15 2023-04-10 半導體裝置及其製造方法
KR1020230047976A KR20230148111A (ko) 2022-04-15 2023-04-12 반도체 장치 및 그 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022067732A JP7788924B2 (ja) 2022-04-15 半導体装置およびその製造方法

Publications (3)

Publication Number Publication Date
JP2023157671A JP2023157671A (ja) 2023-10-26
JP2023157671A5 true JP2023157671A5 (enExample) 2024-09-30
JP7788924B2 JP7788924B2 (ja) 2025-12-19

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