JP2023099430A - 積層型電子部品 - Google Patents

積層型電子部品 Download PDF

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Publication number
JP2023099430A
JP2023099430A JP2022146059A JP2022146059A JP2023099430A JP 2023099430 A JP2023099430 A JP 2023099430A JP 2022146059 A JP2022146059 A JP 2022146059A JP 2022146059 A JP2022146059 A JP 2022146059A JP 2023099430 A JP2023099430 A JP 2023099430A
Authority
JP
Japan
Prior art keywords
electronic component
component according
multilayer electronic
electrode
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022146059A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023099430A5 (enExample
Inventor
ジュン アン、ソ
So Jung An
ジョン チョイ、ヒュン
Hyung Jong Choi
ジェオン リー、ヨー
Yoo Jeong Lee
イェオル リー、チュン
Chung Yeol Lee
イェウン ウォン、クワン
Kwang Yeun Won
キュン スン、ウー
Woo Kyung Sung
ジュン パク、ミュン
Myun-Jun Park
ホ リー、ジョン
Jong Ho Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of JP2023099430A publication Critical patent/JP2023099430A/ja
Publication of JP2023099430A5 publication Critical patent/JP2023099430A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/13—Energy storage using capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2022146059A 2021-12-31 2022-09-14 積層型電子部品 Pending JP2023099430A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020210194176A KR20230103350A (ko) 2021-12-31 2021-12-31 적층형 전자 부품
KR10-2021-0194176 2021-12-31

Publications (2)

Publication Number Publication Date
JP2023099430A true JP2023099430A (ja) 2023-07-13
JP2023099430A5 JP2023099430A5 (enExample) 2025-07-24

Family

ID=86964423

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022146059A Pending JP2023099430A (ja) 2021-12-31 2022-09-14 積層型電子部品

Country Status (4)

Country Link
US (1) US12249461B2 (enExample)
JP (1) JP2023099430A (enExample)
KR (2) KR20230103350A (enExample)
CN (1) CN116387033A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250072361A (ko) * 2023-11-16 2025-05-23 삼성전기주식회사 적층형 전자 부품

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0684687A (ja) * 1992-08-31 1994-03-25 Toshiba Corp セラミックチップ部品およびチップ部品実装構造
US6627509B2 (en) * 2001-11-26 2003-09-30 Delaware Capital Formation, Inc. Surface flashover resistant capacitors and method for producing same
JP4093188B2 (ja) * 2003-05-27 2008-06-04 株式会社村田製作所 積層セラミック電子部品とその実装構造および実装方法
JP4479747B2 (ja) * 2007-05-30 2010-06-09 Ｔｄｋ株式会社 積層コンデンサ
JP2012164966A (ja) * 2011-01-21 2012-08-30 Murata Mfg Co Ltd セラミック電子部品
KR101548770B1 (ko) * 2011-06-23 2015-09-01 삼성전기주식회사 칩 타입 적층 커패시터
JP2013026392A (ja) * 2011-07-20 2013-02-04 Tdk Corp 電子部品及び電子部品の製造方法
KR101862396B1 (ko) * 2011-09-08 2018-05-30 삼성전기주식회사 적층 세라믹 전자부품 및 이의 제조방법
JP5459327B2 (ja) * 2012-01-24 2014-04-02 株式会社村田製作所 電子部品
KR101462754B1 (ko) * 2013-01-24 2014-11-17 삼성전기주식회사 적층 세라믹 커패시터 및 그 제조방법.
JP5920304B2 (ja) * 2013-09-25 2016-05-18 株式会社村田製作所 電子部品およびその製造方法
US9390858B2 (en) * 2014-04-03 2016-07-12 Murata Manufacturing Co., Ltd. Electronic component, method of manufacturing the same, and mount structure of electronic component
JP6156345B2 (ja) * 2014-12-10 2017-07-05 株式会社村田製作所 電子部品及びその製造方法
JP6592923B2 (ja) 2015-03-20 2019-10-23 株式会社村田製作所 電子部品およびその製造方法
KR101823246B1 (ko) 2016-06-21 2018-01-29 삼성전기주식회사 적층 세라믹 전자 부품 및 그 실장 기판
JP7017893B2 (ja) * 2017-09-25 2022-02-09 太陽誘電株式会社 積層セラミックコンデンサ
JP6806035B2 (ja) * 2017-10-31 2021-01-06 株式会社村田製作所 積層セラミックコンデンサ
JP7115461B2 (ja) * 2019-12-12 2022-08-09 株式会社村田製作所 積層セラミックコンデンサ

Also Published As

Publication number Publication date
US12249461B2 (en) 2025-03-11
CN116387033A (zh) 2023-07-04
KR20230103350A (ko) 2023-07-07
US20230230770A1 (en) 2023-07-20
KR20250010733A (ko) 2025-01-21

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