JP2023098944A5 - - Google Patents
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- JP2023098944A5 JP2023098944A5 JP2023061506A JP2023061506A JP2023098944A5 JP 2023098944 A5 JP2023098944 A5 JP 2023098944A5 JP 2023061506 A JP2023061506 A JP 2023061506A JP 2023061506 A JP2023061506 A JP 2023061506A JP 2023098944 A5 JP2023098944 A5 JP 2023098944A5
- Authority
- JP
- Japan
- Prior art keywords
- area
- processing chamber
- region
- showerhead
- dimension
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 2
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/189,440 US11094511B2 (en) | 2018-11-13 | 2018-11-13 | Processing chamber with substrate edge enhancement processing |
| US16/189,440 | 2018-11-13 | ||
| JP2021524208A JP7296456B2 (ja) | 2018-11-13 | 2019-09-20 | 基板の縁部での向上した処理を伴う処理チャンバ |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021524208A Division JP7296456B2 (ja) | 2018-11-13 | 2019-09-20 | 基板の縁部での向上した処理を伴う処理チャンバ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2023098944A JP2023098944A (ja) | 2023-07-11 |
| JP2023098944A5 true JP2023098944A5 (https=) | 2023-09-14 |
Family
ID=70549954
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021524208A Active JP7296456B2 (ja) | 2018-11-13 | 2019-09-20 | 基板の縁部での向上した処理を伴う処理チャンバ |
| JP2023061506A Pending JP2023098944A (ja) | 2018-11-13 | 2023-04-05 | 基板の縁部での向上した処理を伴う処理チャンバ |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021524208A Active JP7296456B2 (ja) | 2018-11-13 | 2019-09-20 | 基板の縁部での向上した処理を伴う処理チャンバ |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11094511B2 (https=) |
| JP (2) | JP7296456B2 (https=) |
| KR (2) | KR20210060646A (https=) |
| CN (2) | CN119811974A (https=) |
| TW (1) | TWI842751B (https=) |
| WO (1) | WO2020101804A1 (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021158451A1 (en) * | 2020-02-04 | 2021-08-12 | Lam Research Corporation | Radiofrequency signal filter arrangement for plasma processing system |
| WO2022197915A1 (en) * | 2021-03-19 | 2022-09-22 | Lam Research Corporation | Nozzle for remote plasma cleaning of process chambers |
| US11742185B2 (en) * | 2021-03-26 | 2023-08-29 | Applied Materials, Inc. | Uniform in situ cleaning and deposition |
| WO2023043091A1 (ko) * | 2021-09-14 | 2023-03-23 | 주식회사 티이엠 | 조립형 프로파일 상부 전극 및 이를 포함하는 플라즈마 처리 장치 |
| CN114121583B (zh) * | 2021-11-17 | 2024-03-29 | 长江存储科技有限责任公司 | 边缘刻蚀装置及晶圆处理方法 |
| US12062523B2 (en) * | 2022-02-14 | 2024-08-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods and systems for cooling plasma treatment components |
| CN116322244A (zh) * | 2023-02-17 | 2023-06-23 | 无锡极电光能科技有限公司 | 电子传输层及钙钛矿太阳能电池的制造方法 |
| USD1112390S1 (en) | 2024-07-22 | 2026-02-10 | Asm Ip Holding B.V. | Flow control ring |
Family Cites Families (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5643394A (en) | 1994-09-16 | 1997-07-01 | Applied Materials, Inc. | Gas injection slit nozzle for a plasma process reactor |
| US6050506A (en) | 1998-02-13 | 2000-04-18 | Applied Materials, Inc. | Pattern of apertures in a showerhead for chemical vapor deposition |
| US6372150B1 (en) | 1998-12-18 | 2002-04-16 | Cypress Semiconductor Corp. | High vapor plasma strip methods and devices to enhance the reduction of organic residues over metal surfaces |
| JP2001244256A (ja) * | 2000-03-02 | 2001-09-07 | Hitachi Ltd | 処理装置 |
| US6750155B2 (en) | 2001-08-08 | 2004-06-15 | Lam Research Corporation | Methods to minimize moisture condensation over a substrate in a rapid cycle chamber |
| AU2002366921A1 (en) * | 2001-12-13 | 2003-07-09 | Tokyo Electron Limited | Ring mechanism, and plasma processing device using the ring mechanism |
| US7390755B1 (en) | 2002-03-26 | 2008-06-24 | Novellus Systems, Inc. | Methods for post etch cleans |
| US20040237997A1 (en) | 2003-05-27 | 2004-12-02 | Applied Materials, Inc. ; | Method for removal of residue from a substrate |
| KR20060035158A (ko) * | 2004-10-21 | 2006-04-26 | 삼성전자주식회사 | 반도체 식각 장치의 포커스링 |
| KR20060084897A (ko) * | 2005-01-21 | 2006-07-26 | 삼성전자주식회사 | 반도체 제조설비의 샤워헤드 |
| JP2007250967A (ja) | 2006-03-17 | 2007-09-27 | Tokyo Electron Ltd | プラズマ処理装置および方法とフォーカスリング |
| US8057633B2 (en) * | 2006-03-28 | 2011-11-15 | Tokyo Electron Limited | Post-etch treatment system for removing residue on a substrate |
| GB0616131D0 (en) * | 2006-08-14 | 2006-09-20 | Oxford Instr Plasma Technology | Surface processing apparatus |
| KR101272334B1 (ko) * | 2006-09-13 | 2013-06-07 | 삼성디스플레이 주식회사 | 기판 지지 장치 및 박막 트랜지스터 표시판 |
| KR100997104B1 (ko) * | 2008-07-04 | 2010-11-29 | 주식회사 테스 | 반도체 제조용 샤워헤드 및 이 샤워헤드를 구비한 반도체제조장치 |
| US8287650B2 (en) * | 2008-09-10 | 2012-10-16 | Applied Materials, Inc. | Low sloped edge ring for plasma processing chamber |
| US8043434B2 (en) | 2008-10-23 | 2011-10-25 | Lam Research Corporation | Method and apparatus for removing photoresist |
| WO2010062345A2 (en) | 2008-10-31 | 2010-06-03 | Lam Research Corporation | Lower electrode assembly of plasma processing chamber |
| EP2396457A2 (en) | 2009-02-08 | 2011-12-21 | AP Solutions, Inc. | Plasma source with integral blade and method for removing materials from substrates |
| JP5455462B2 (ja) * | 2009-06-23 | 2014-03-26 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
| DE202010014805U1 (de) * | 2009-11-02 | 2011-02-17 | Lam Research Corporation (Delaware Corporation) | Heissrandring mit geneigter oberer Oberfläche |
| US8470614B2 (en) * | 2010-10-28 | 2013-06-25 | Texas Instruments Incorporated | PECVD showerhead configuration for CMP uniformity and improved stress |
| TW201331408A (zh) * | 2011-10-07 | 2013-08-01 | Tokyo Electron Ltd | 電漿處理裝置 |
| CN202405228U (zh) * | 2012-01-20 | 2012-08-29 | 中微半导体设备(上海)有限公司 | 一种用于等离子体处理装置的聚焦环 |
| US20140034242A1 (en) * | 2012-07-31 | 2014-02-06 | Lam Research Corporation | Edge ring assembly for plasma processing chamber and method of manufacture thereof |
| US9121097B2 (en) * | 2012-08-31 | 2015-09-01 | Novellus Systems, Inc. | Variable showerhead flow by varying internal baffle conductance |
| KR20140101996A (ko) * | 2013-02-13 | 2014-08-21 | 삼성전자주식회사 | 기판 지지유닛 및 이를 구비한 플라즈마 식각장치 |
| US20140271097A1 (en) * | 2013-03-15 | 2014-09-18 | Applied Materials, Inc. | Processing systems and methods for halide scavenging |
| KR101518398B1 (ko) * | 2013-12-06 | 2015-05-08 | 참엔지니어링(주) | 기판 처리 장치 |
| JP6219179B2 (ja) | 2014-01-20 | 2017-10-25 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| KR102328847B1 (ko) * | 2014-08-21 | 2021-11-19 | 엘지디스플레이 주식회사 | 대면적기판 처리장치 |
| CN105552014B (zh) * | 2014-10-28 | 2018-09-18 | 北京北方华创微电子装备有限公司 | 一种支撑装置以及等离子刻蚀设备 |
| US10903055B2 (en) * | 2015-04-17 | 2021-01-26 | Applied Materials, Inc. | Edge ring for bevel polymer reduction |
| US10378107B2 (en) * | 2015-05-22 | 2019-08-13 | Lam Research Corporation | Low volume showerhead with faceplate holes for improved flow uniformity |
| CN108028175B (zh) * | 2015-09-22 | 2019-06-28 | 应用材料公司 | 喷头支撑结构 |
| TWI689619B (zh) * | 2016-04-01 | 2020-04-01 | 美商應用材料股份有限公司 | 用於提供均勻流動的氣體的設備及方法 |
| TWM563652U (zh) * | 2016-10-13 | 2018-07-11 | 美商應用材料股份有限公司 | 用於電漿處理裝置的腔室部件及包含其之裝置 |
| US10032661B2 (en) | 2016-11-18 | 2018-07-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device, method, and tool of manufacture |
| US10504738B2 (en) * | 2017-05-31 | 2019-12-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Focus ring for plasma etcher |
-
2018
- 2018-11-13 US US16/189,440 patent/US11094511B2/en active Active
-
2019
- 2019-09-20 JP JP2021524208A patent/JP7296456B2/ja active Active
- 2019-09-20 WO PCT/US2019/052169 patent/WO2020101804A1/en not_active Ceased
- 2019-09-20 CN CN202411937510.1A patent/CN119811974A/zh active Pending
- 2019-09-20 KR KR1020217014712A patent/KR20210060646A/ko not_active Ceased
- 2019-09-20 CN CN201980067121.9A patent/CN112840445A/zh active Pending
- 2019-09-20 KR KR1020237029061A patent/KR102673616B1/ko active Active
- 2019-10-08 TW TW108136319A patent/TWI842751B/zh active
-
2023
- 2023-04-05 JP JP2023061506A patent/JP2023098944A/ja active Pending
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