JP2023094391A5 - - Google Patents
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- JP2023094391A5 JP2023094391A5 JP2021209839A JP2021209839A JP2023094391A5 JP 2023094391 A5 JP2023094391 A5 JP 2023094391A5 JP 2021209839 A JP2021209839 A JP 2021209839A JP 2021209839 A JP2021209839 A JP 2021209839A JP 2023094391 A5 JP2023094391 A5 JP 2023094391A5
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- hole
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- semiconductor device
- semiconductor element
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Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021209839A JP7760360B2 (ja) | 2021-12-23 | 2021-12-23 | 半導体装置 |
| EP22214050.1A EP4203011A3 (en) | 2021-12-23 | 2022-12-16 | Semiconductor device |
| CN202211633450.5A CN116417429A (zh) | 2021-12-23 | 2022-12-19 | 半导体装置 |
| US18/085,177 US20230207443A1 (en) | 2021-12-23 | 2022-12-20 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021209839A JP7760360B2 (ja) | 2021-12-23 | 2021-12-23 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023094391A JP2023094391A (ja) | 2023-07-05 |
| JP2023094391A5 true JP2023094391A5 (enExample) | 2024-08-29 |
| JP7760360B2 JP7760360B2 (ja) | 2025-10-27 |
Family
ID=84537406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021209839A Active JP7760360B2 (ja) | 2021-12-23 | 2021-12-23 | 半導体装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20230207443A1 (enExample) |
| EP (1) | EP4203011A3 (enExample) |
| JP (1) | JP7760360B2 (enExample) |
| CN (1) | CN116417429A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118841378A (zh) * | 2023-04-25 | 2024-10-25 | 长江存储科技有限责任公司 | 封装体结构及其形成方法 |
| JP2025087205A (ja) | 2023-11-29 | 2025-06-10 | 新光電気工業株式会社 | 半導体装置 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8378231B2 (en) * | 2008-07-31 | 2013-02-19 | Ibiden Co., Ltd. | Semiconductor device and method for manufacturing the same |
| KR101013562B1 (ko) * | 2009-01-23 | 2011-02-14 | 주식회사 하이닉스반도체 | 큐브 반도체 패키지 |
| KR20120007840A (ko) * | 2010-07-15 | 2012-01-25 | 삼성전자주식회사 | 두 개의 패키지 기판 사이에 배치된 스페이서를 가진 ｐｏｐ 반도체 패키지 |
| US8653635B2 (en) * | 2011-08-16 | 2014-02-18 | General Electric Company | Power overlay structure with leadframe connections |
| JP2013069942A (ja) * | 2011-09-24 | 2013-04-18 | Denso Corp | 半導体装置及びその製造方法 |
| US11089693B2 (en) * | 2011-12-16 | 2021-08-10 | Prologium Technology Co., Ltd. | PCB structure with a silicone layer as adhesive |
| US8987876B2 (en) * | 2013-03-14 | 2015-03-24 | General Electric Company | Power overlay structure and method of making same |
| KR102245770B1 (ko) * | 2013-10-29 | 2021-04-28 | 삼성전자주식회사 | 반도체 패키지 장치 |
| US20160113076A1 (en) * | 2014-10-20 | 2016-04-21 | Energy Focus, Inc. | Led lamp with dual mode operation |
| JP6354674B2 (ja) * | 2015-06-18 | 2018-07-11 | 株式会社デンソー | 半導体装置 |
| JP6523482B2 (ja) * | 2015-11-25 | 2019-06-05 | 三菱電機株式会社 | 電力用半導体装置 |
| US10461042B2 (en) * | 2016-01-31 | 2019-10-29 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor module |
| KR102059403B1 (ko) * | 2016-10-04 | 2019-12-26 | 삼성전자주식회사 | 팬-아웃 반도체 패키지 |
| US10622340B2 (en) * | 2016-11-21 | 2020-04-14 | Samsung Electronics Co., Ltd. | Semiconductor package |
| JP7021854B2 (ja) | 2017-01-24 | 2022-02-17 | ゼネラル・エレクトリック・カンパニイ | 電力用電子回路パッケージおよびその製造方法 |
| JP6797285B2 (ja) * | 2017-04-06 | 2020-12-09 | 三菱電機株式会社 | 半導体装置およびその製造方法、ならびに電力変換装置 |
| JP6765336B2 (ja) * | 2017-04-06 | 2020-10-07 | 三菱電機株式会社 | 電力用半導体装置およびその製造方法、ならびに電力変換装置 |
| JP7042651B2 (ja) * | 2018-02-28 | 2022-03-28 | 三菱電機株式会社 | 電力用半導体装置および電力変換装置 |
| JP7159620B2 (ja) * | 2018-05-30 | 2022-10-25 | 富士電機株式会社 | 半導体装置、冷却モジュール、電力変換装置及び電動車両 |
| WO2020202972A1 (ja) * | 2019-03-29 | 2020-10-08 | 太陽誘電株式会社 | モジュールおよびその製造方法 |
| US11444059B2 (en) * | 2019-12-19 | 2022-09-13 | Micron Technology, Inc. | Wafer-level stacked die structures and associated systems and methods |
| JP7548743B2 (ja) * | 2020-07-21 | 2024-09-10 | 新光電気工業株式会社 | 半導体装置 |
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2021
- 2021-12-23 JP JP2021209839A patent/JP7760360B2/ja active Active
-
2022
- 2022-12-16 EP EP22214050.1A patent/EP4203011A3/en active Pending
- 2022-12-19 CN CN202211633450.5A patent/CN116417429A/zh active Pending
- 2022-12-20 US US18/085,177 patent/US20230207443A1/en active Pending