JP2023037280A5 - - Google Patents

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Publication number
JP2023037280A5
JP2023037280A5 JP2021143928A JP2021143928A JP2023037280A5 JP 2023037280 A5 JP2023037280 A5 JP 2023037280A5 JP 2021143928 A JP2021143928 A JP 2021143928A JP 2021143928 A JP2021143928 A JP 2021143928A JP 2023037280 A5 JP2023037280 A5 JP 2023037280A5
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JP
Japan
Prior art keywords
semiconductor
semiconductor chip
uneven structure
electrode
protective film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2021143928A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023037280A (ja
JP7586034B2 (ja
Filing date
Publication date
Priority claimed from JP2021143928A external-priority patent/JP7586034B2/ja
Priority to JP2021143928A priority Critical patent/JP7586034B2/ja
Application filed filed Critical
Priority to PCT/JP2022/032778 priority patent/WO2023033047A1/ja
Priority to CN202280059482.0A priority patent/CN117916892A/zh
Publication of JP2023037280A publication Critical patent/JP2023037280A/ja
Publication of JP2023037280A5 publication Critical patent/JP2023037280A5/ja
Priority to US18/420,125 priority patent/US20240203811A1/en
Priority to JP2024191937A priority patent/JP2025016654A/ja
Publication of JP7586034B2 publication Critical patent/JP7586034B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2021143928A 2021-09-03 2021-09-03 半導体装置 Active JP7586034B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2021143928A JP7586034B2 (ja) 2021-09-03 2021-09-03 半導体装置
PCT/JP2022/032778 WO2023033047A1 (ja) 2021-09-03 2022-08-31 半導体装置
CN202280059482.0A CN117916892A (zh) 2021-09-03 2022-08-31 半导体装置
US18/420,125 US20240203811A1 (en) 2021-09-03 2024-01-23 Semiconductor device
JP2024191937A JP2025016654A (ja) 2021-09-03 2024-10-31 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021143928A JP7586034B2 (ja) 2021-09-03 2021-09-03 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024191937A Division JP2025016654A (ja) 2021-09-03 2024-10-31 半導体装置

Publications (3)

Publication Number Publication Date
JP2023037280A JP2023037280A (ja) 2023-03-15
JP2023037280A5 true JP2023037280A5 (enExample) 2023-09-07
JP7586034B2 JP7586034B2 (ja) 2024-11-19

Family

ID=85411278

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021143928A Active JP7586034B2 (ja) 2021-09-03 2021-09-03 半導体装置
JP2024191937A Pending JP2025016654A (ja) 2021-09-03 2024-10-31 半導体装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024191937A Pending JP2025016654A (ja) 2021-09-03 2024-10-31 半導体装置

Country Status (4)

Country Link
US (1) US20240203811A1 (enExample)
JP (2) JP7586034B2 (enExample)
CN (1) CN117916892A (enExample)
WO (1) WO2023033047A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7717010B2 (ja) * 2022-03-08 2025-08-01 株式会社デンソー 半導体装置
WO2025224813A1 (ja) * 2024-04-23 2025-10-30 三菱電機株式会社 半導体装置及び半導体装置の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06140563A (ja) * 1992-10-23 1994-05-20 Rohm Co Ltd 半導体装置
JP3561821B2 (ja) * 1995-12-01 2004-09-02 日本テキサス・インスツルメンツ株式会社 半導体パッケージ装置
JP2005150419A (ja) * 2003-11-17 2005-06-09 Nippon Soken Inc 半導体装置
JP4361828B2 (ja) * 2004-04-30 2009-11-11 富士通マイクロエレクトロニクス株式会社 樹脂封止型半導体装置
JP2006196710A (ja) * 2005-01-13 2006-07-27 Fuji Electric Device Technology Co Ltd 半導体素子の製造方法
JP4422671B2 (ja) * 2005-12-06 2010-02-24 トヨタ自動車株式会社 半導体装置とその製造方法
JP4535151B2 (ja) * 2008-03-19 2010-09-01 株式会社デンソー 炭化珪素半導体装置の製造方法
JP5729126B2 (ja) * 2011-05-18 2015-06-03 株式会社デンソー 半導体装置の製造方法
JP2017092212A (ja) * 2015-11-09 2017-05-25 株式会社東芝 半導体装置およびその製造方法
JP6623973B2 (ja) * 2016-08-19 2019-12-25 信越半導体株式会社 発光素子及び発光素子の製造方法
WO2020012810A1 (ja) * 2018-07-11 2020-01-16 住友電気工業株式会社 炭化珪素半導体装置
JP6887541B1 (ja) * 2020-02-21 2021-06-16 三菱電機株式会社 半導体装置

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