CN116417429A - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN116417429A
CN116417429A CN202211633450.5A CN202211633450A CN116417429A CN 116417429 A CN116417429 A CN 116417429A CN 202211633450 A CN202211633450 A CN 202211633450A CN 116417429 A CN116417429 A CN 116417429A
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CN
China
Prior art keywords
substrate
upper substrate
sealing resin
semiconductor element
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211633450.5A
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English (en)
Chinese (zh)
Inventor
村山启
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Publication of CN116417429A publication Critical patent/CN116417429A/zh
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    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
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    • H01L2924/186—Material

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN202211633450.5A 2021-12-23 2022-12-19 半导体装置 Pending CN116417429A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021209839A JP7760360B2 (ja) 2021-12-23 2021-12-23 半導体装置
JP2021-209839 2021-12-23

Publications (1)

Publication Number Publication Date
CN116417429A true CN116417429A (zh) 2023-07-11

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CN202211633450.5A Pending CN116417429A (zh) 2021-12-23 2022-12-19 半导体装置

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US (1) US20230207443A1 (enExample)
EP (1) EP4203011A3 (enExample)
JP (1) JP7760360B2 (enExample)
CN (1) CN116417429A (enExample)

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JP2025087205A (ja) 2023-11-29 2025-06-10 新光電気工業株式会社 半導体装置

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EP4203011A2 (en) 2023-06-28
EP4203011A3 (en) 2023-07-26
US20230207443A1 (en) 2023-06-29
JP2023094391A (ja) 2023-07-05
JP7760360B2 (ja) 2025-10-27

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