JP2023081820A5 - - Google Patents

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Publication number
JP2023081820A5
JP2023081820A5 JP2022097956A JP2022097956A JP2023081820A5 JP 2023081820 A5 JP2023081820 A5 JP 2023081820A5 JP 2022097956 A JP2022097956 A JP 2022097956A JP 2022097956 A JP2022097956 A JP 2022097956A JP 2023081820 A5 JP2023081820 A5 JP 2023081820A5
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JP
Japan
Prior art keywords
semiconductor film
nitride semiconductor
substrate
electronic device
furthermore
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Application number
JP2022097956A
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English (en)
Japanese (ja)
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JP2023081820A (ja
JP7597081B2 (ja
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Priority to US18/715,417 priority Critical patent/US20250031421A1/en
Priority to EP22901010.3A priority patent/EP4442870A1/en
Priority to KR1020247018471A priority patent/KR20240117553A/ko
Priority to PCT/JP2022/040820 priority patent/WO2023100577A1/ja
Priority to CN202280079606.1A priority patent/CN118414455A/zh
Priority to TW111141769A priority patent/TW202340552A/zh
Publication of JP2023081820A publication Critical patent/JP2023081820A/ja
Publication of JP2023081820A5 publication Critical patent/JP2023081820A5/ja
Application granted granted Critical
Publication of JP7597081B2 publication Critical patent/JP7597081B2/ja
Active legal-status Critical Current
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JP2022097956A 2021-12-01 2022-06-17 電子デバイス用基板及びその製造方法 Active JP7597081B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
EP22901010.3A EP4442870A1 (en) 2021-12-01 2022-10-31 Substrate for electronic device and production method therefor
KR1020247018471A KR20240117553A (ko) 2021-12-01 2022-10-31 전자디바이스용 기판 및 그의 제조방법
PCT/JP2022/040820 WO2023100577A1 (ja) 2021-12-01 2022-10-31 電子デバイス用基板及びその製造方法
CN202280079606.1A CN118414455A (zh) 2021-12-01 2022-10-31 电子器件用基板及其制造方法
US18/715,417 US20250031421A1 (en) 2021-12-01 2022-10-31 Substrate for electronic device and method for producing the same
TW111141769A TW202340552A (zh) 2021-12-01 2022-11-02 電子元件用基板及其製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021195583 2021-12-01
JP2021195583 2021-12-01

Publications (3)

Publication Number Publication Date
JP2023081820A JP2023081820A (ja) 2023-06-13
JP2023081820A5 true JP2023081820A5 (https=) 2024-06-05
JP7597081B2 JP7597081B2 (ja) 2024-12-10

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ID=86728127

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022097956A Active JP7597081B2 (ja) 2021-12-01 2022-06-17 電子デバイス用基板及びその製造方法

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JP (1) JP7597081B2 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63193517A (ja) * 1987-02-06 1988-08-10 Nec Corp 複合単結晶基板
JPH07335511A (ja) * 1994-06-13 1995-12-22 Nippon Telegr & Teleph Corp <Ntt> 張り合わせウエハ
CN103681992A (zh) 2014-01-07 2014-03-26 苏州晶湛半导体有限公司 半导体衬底、半导体器件及半导体衬底制造方法
JP6863423B2 (ja) 2019-08-06 2021-04-21 信越半導体株式会社 電子デバイス用基板およびその製造方法

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