JPWO2022230577A5 - - Google Patents

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Publication number
JPWO2022230577A5
JPWO2022230577A5 JP2023517200A JP2023517200A JPWO2022230577A5 JP WO2022230577 A5 JPWO2022230577 A5 JP WO2022230577A5 JP 2023517200 A JP2023517200 A JP 2023517200A JP 2023517200 A JP2023517200 A JP 2023517200A JP WO2022230577 A5 JPWO2022230577 A5 JP WO2022230577A5
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JP
Japan
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diagram showing
present
schematic configuration
configuration diagram
ttv
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JP2023517200A
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English (en)
Japanese (ja)
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JPWO2022230577A1 (https=
JP7663680B2 (ja
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Priority claimed from PCT/JP2022/015911 external-priority patent/WO2022230577A1/ja
Publication of JPWO2022230577A1 publication Critical patent/JPWO2022230577A1/ja
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Priority to JP2025062160A priority Critical patent/JP2025102965A/ja
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JP2023517200A 2021-04-28 2022-03-30 積層構造体、半導体装置及び積層構造体の製造方法 Active JP7663680B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025062160A JP2025102965A (ja) 2021-04-28 2025-04-04 積層構造体、半導体装置及び下地基板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021076657 2021-04-28
JP2021076657 2021-04-28
PCT/JP2022/015911 WO2022230577A1 (ja) 2021-04-28 2022-03-30 積層構造体、半導体装置及び積層構造体の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025062160A Division JP2025102965A (ja) 2021-04-28 2025-04-04 積層構造体、半導体装置及び下地基板

Publications (3)

Publication Number Publication Date
JPWO2022230577A1 JPWO2022230577A1 (https=) 2022-11-03
JPWO2022230577A5 true JPWO2022230577A5 (https=) 2024-01-26
JP7663680B2 JP7663680B2 (ja) 2025-04-16

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ID=83847408

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JP2023517200A Active JP7663680B2 (ja) 2021-04-28 2022-03-30 積層構造体、半導体装置及び積層構造体の製造方法
JP2025062160A Pending JP2025102965A (ja) 2021-04-28 2025-04-04 積層構造体、半導体装置及び下地基板

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JP2025062160A Pending JP2025102965A (ja) 2021-04-28 2025-04-04 積層構造体、半導体装置及び下地基板

Country Status (7)

Country Link
US (1) US20240250115A1 (https=)
EP (1) EP4332279A4 (https=)
JP (2) JP7663680B2 (https=)
KR (1) KR20240000497A (https=)
CN (2) CN117321256A (https=)
TW (2) TWM633282U (https=)
WO (1) WO2022230577A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM633935U (zh) * 2021-04-07 2022-11-11 日商信越化學工業股份有限公司 積層體的製造系統、積層體以及半導體裝置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101159658B1 (ko) * 2006-12-28 2012-06-25 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 사파이어 기판 연마 방법
JP5793732B2 (ja) 2011-07-27 2015-10-14 高知県公立大学法人 ドーパントを添加した結晶性の高い導電性α型酸化ガリウム薄膜およびその生成方法
US10090388B2 (en) 2014-03-31 2018-10-02 Flosfia Inc. Crystalline multilayer structure and semiconductor device
JP7053539B2 (ja) * 2019-08-02 2022-04-12 信越化学工業株式会社 積層体、半導体膜、半導体装置、半導体システム及び積層体の製造方法

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