JP2023070147A5 - - Google Patents
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- Publication number
- JP2023070147A5 JP2023070147A5 JP2022176225A JP2022176225A JP2023070147A5 JP 2023070147 A5 JP2023070147 A5 JP 2023070147A5 JP 2022176225 A JP2022176225 A JP 2022176225A JP 2022176225 A JP2022176225 A JP 2022176225A JP 2023070147 A5 JP2023070147 A5 JP 2023070147A5
- Authority
- JP
- Japan
- Prior art keywords
- array
- evaporator
- assembly
- vents
- posts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/518,321 US12135152B2 (en) | 2021-11-03 | 2021-11-03 | Evaporator assemblies, vapor chambers, and methods for fabricating vapor chambers |
| US17/518,321 | 2021-11-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2023070147A JP2023070147A (ja) | 2023-05-18 |
| JP2023070147A5 true JP2023070147A5 (enExample) | 2025-01-24 |
Family
ID=86146817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022176225A Pending JP2023070147A (ja) | 2021-11-03 | 2022-11-02 | 蒸発器組立体、ベイパーチャンバー及びベイパーチャンバーの製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US12135152B2 (enExample) |
| JP (1) | JP2023070147A (enExample) |
| CN (1) | CN116075121A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI837370B (zh) * | 2020-05-21 | 2024-04-01 | 宏碁股份有限公司 | 均溫板結構 |
| US12349313B2 (en) * | 2021-11-05 | 2025-07-01 | Rochester Institute Of Technology | Cooling device having a boiling chamber with submerged condensation and method |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB743057A (en) * | 1951-06-30 | 1956-01-11 | Meyer Schlioma Frenkel | Improvements in or relating to evaporators |
| WO2005006395A2 (en) * | 2003-06-26 | 2005-01-20 | Thermal Corp. | Heat transfer device and method of making same |
| CN100420912C (zh) * | 2005-06-08 | 2008-09-24 | 财团法人工业技术研究院 | 热传组件的复合式毛细结构 |
| TWI307399B (en) * | 2005-09-09 | 2009-03-11 | Delta Electronics Inc | Heat dissipation module and heat pipe thereof |
| US8356657B2 (en) * | 2007-12-19 | 2013-01-22 | Teledyne Scientific & Imaging, Llc | Heat pipe system |
| US9257365B2 (en) | 2013-07-05 | 2016-02-09 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling assemblies and power electronics modules having multiple-porosity structures |
| US10660236B2 (en) | 2014-04-08 | 2020-05-19 | General Electric Company | Systems and methods for using additive manufacturing for thermal management |
| WO2017100568A2 (en) * | 2015-12-11 | 2017-06-15 | Purdue Research Foundation | Vapor chamber heat spreaders and methods of manufacturing thereof |
| US10495387B2 (en) | 2017-03-10 | 2019-12-03 | Toyota Motor Engineering & Manufacturing North America, Inc. | Multi-layer wick structures with surface enhancement and fabrication methods |
| US20190082560A1 (en) | 2017-09-08 | 2019-03-14 | Toyota Motor Engineering & Manufacturing North America, Inc. | Systems and methods for additive manufacturing of wick structure for vapor chamber |
| US10820454B2 (en) | 2018-01-31 | 2020-10-27 | Toyota Motor Engineering & Manufacturing North America, Inc. | Vapor chamber heat spreaders with engineered vapor and liquid flow paths |
| US10948241B2 (en) * | 2018-10-25 | 2021-03-16 | Toyota Motor Engineering & Manufacturing North America, Inc. | Vapor chamber heat spreaders having improved transient thermal response and methods of making the same |
| TWI811504B (zh) * | 2019-12-16 | 2023-08-11 | 訊凱國際股份有限公司 | 散熱裝置 |
| CN113437034B (zh) * | 2021-08-25 | 2022-02-22 | 中兴通讯股份有限公司 | 均温板及电子设备 |
-
2021
- 2021-11-03 US US17/518,321 patent/US12135152B2/en active Active
-
2022
- 2022-11-02 JP JP2022176225A patent/JP2023070147A/ja active Pending
- 2022-11-03 CN CN202211367992.2A patent/CN116075121A/zh active Pending
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