JP2023070147A5 - - Google Patents

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Publication number
JP2023070147A5
JP2023070147A5 JP2022176225A JP2022176225A JP2023070147A5 JP 2023070147 A5 JP2023070147 A5 JP 2023070147A5 JP 2022176225 A JP2022176225 A JP 2022176225A JP 2022176225 A JP2022176225 A JP 2022176225A JP 2023070147 A5 JP2023070147 A5 JP 2023070147A5
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JP
Japan
Prior art keywords
array
evaporator
assembly
vents
posts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022176225A
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English (en)
Japanese (ja)
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JP2023070147A (ja
Filing date
Publication date
Priority claimed from US17/518,321 external-priority patent/US12135152B2/en
Application filed filed Critical
Publication of JP2023070147A publication Critical patent/JP2023070147A/ja
Publication of JP2023070147A5 publication Critical patent/JP2023070147A5/ja
Pending legal-status Critical Current

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JP2022176225A 2021-11-03 2022-11-02 蒸発器組立体、ベイパーチャンバー及びベイパーチャンバーの製造方法 Pending JP2023070147A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/518,321 US12135152B2 (en) 2021-11-03 2021-11-03 Evaporator assemblies, vapor chambers, and methods for fabricating vapor chambers
US17/518,321 2021-11-03

Publications (2)

Publication Number Publication Date
JP2023070147A JP2023070147A (ja) 2023-05-18
JP2023070147A5 true JP2023070147A5 (enExample) 2025-01-24

Family

ID=86146817

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022176225A Pending JP2023070147A (ja) 2021-11-03 2022-11-02 蒸発器組立体、ベイパーチャンバー及びベイパーチャンバーの製造方法

Country Status (3)

Country Link
US (1) US12135152B2 (enExample)
JP (1) JP2023070147A (enExample)
CN (1) CN116075121A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI837370B (zh) * 2020-05-21 2024-04-01 宏碁股份有限公司 均溫板結構
US12349313B2 (en) * 2021-11-05 2025-07-01 Rochester Institute Of Technology Cooling device having a boiling chamber with submerged condensation and method

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB743057A (en) * 1951-06-30 1956-01-11 Meyer Schlioma Frenkel Improvements in or relating to evaporators
WO2005006395A2 (en) * 2003-06-26 2005-01-20 Thermal Corp. Heat transfer device and method of making same
CN100420912C (zh) * 2005-06-08 2008-09-24 财团法人工业技术研究院 热传组件的复合式毛细结构
TWI307399B (en) * 2005-09-09 2009-03-11 Delta Electronics Inc Heat dissipation module and heat pipe thereof
US8356657B2 (en) * 2007-12-19 2013-01-22 Teledyne Scientific & Imaging, Llc Heat pipe system
US9257365B2 (en) 2013-07-05 2016-02-09 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling assemblies and power electronics modules having multiple-porosity structures
US10660236B2 (en) 2014-04-08 2020-05-19 General Electric Company Systems and methods for using additive manufacturing for thermal management
WO2017100568A2 (en) * 2015-12-11 2017-06-15 Purdue Research Foundation Vapor chamber heat spreaders and methods of manufacturing thereof
US10495387B2 (en) 2017-03-10 2019-12-03 Toyota Motor Engineering & Manufacturing North America, Inc. Multi-layer wick structures with surface enhancement and fabrication methods
US20190082560A1 (en) 2017-09-08 2019-03-14 Toyota Motor Engineering & Manufacturing North America, Inc. Systems and methods for additive manufacturing of wick structure for vapor chamber
US10820454B2 (en) 2018-01-31 2020-10-27 Toyota Motor Engineering & Manufacturing North America, Inc. Vapor chamber heat spreaders with engineered vapor and liquid flow paths
US10948241B2 (en) * 2018-10-25 2021-03-16 Toyota Motor Engineering & Manufacturing North America, Inc. Vapor chamber heat spreaders having improved transient thermal response and methods of making the same
TWI811504B (zh) * 2019-12-16 2023-08-11 訊凱國際股份有限公司 散熱裝置
CN113437034B (zh) * 2021-08-25 2022-02-22 中兴通讯股份有限公司 均温板及电子设备

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