JP2023070147A - 蒸発器組立体、ベイパーチャンバー及びベイパーチャンバーの製造方法 - Google Patents

蒸発器組立体、ベイパーチャンバー及びベイパーチャンバーの製造方法 Download PDF

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Publication number
JP2023070147A
JP2023070147A JP2022176225A JP2022176225A JP2023070147A JP 2023070147 A JP2023070147 A JP 2023070147A JP 2022176225 A JP2022176225 A JP 2022176225A JP 2022176225 A JP2022176225 A JP 2022176225A JP 2023070147 A JP2023070147 A JP 2023070147A
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JP
Japan
Prior art keywords
array
evaporator
posts
vents
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022176225A
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English (en)
Japanese (ja)
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JP2023070147A5 (enExample
Inventor
エヌ．ジョシー シャイレシュ
N JOSHI Shailesh
ローハン ダニー
Lohan Danny
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Engineering and Manufacturing North America Inc
Original Assignee
Toyota Motor Engineering and Manufacturing North America Inc
Toyota Engineering and Manufacturing North America Inc
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Filing date
Publication date
Application filed by Toyota Motor Engineering and Manufacturing North America Inc, Toyota Engineering and Manufacturing North America Inc filed Critical Toyota Motor Engineering and Manufacturing North America Inc
Publication of JP2023070147A publication Critical patent/JP2023070147A/ja
Publication of JP2023070147A5 publication Critical patent/JP2023070147A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/02—Evaporators
    • F25B39/022—Evaporators with plate-like or laminated elements
    • F25B39/024—Evaporators with plate-like or laminated elements with elements constructed in the shape of a hollow panel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Dispersion Chemistry (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2022176225A 2021-11-03 2022-11-02 蒸発器組立体、ベイパーチャンバー及びベイパーチャンバーの製造方法 Pending JP2023070147A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/518,321 US12135152B2 (en) 2021-11-03 2021-11-03 Evaporator assemblies, vapor chambers, and methods for fabricating vapor chambers
US17/518,321 2021-11-03

Publications (2)

Publication Number Publication Date
JP2023070147A true JP2023070147A (ja) 2023-05-18
JP2023070147A5 JP2023070147A5 (enExample) 2025-01-24

Family

ID=86146817

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022176225A Pending JP2023070147A (ja) 2021-11-03 2022-11-02 蒸発器組立体、ベイパーチャンバー及びベイパーチャンバーの製造方法

Country Status (3)

Country Link
US (1) US12135152B2 (enExample)
JP (1) JP2023070147A (enExample)
CN (1) CN116075121A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI837370B (zh) * 2020-05-21 2024-04-01 宏碁股份有限公司 均溫板結構
US12349313B2 (en) * 2021-11-05 2025-07-01 Rochester Institute Of Technology Cooling device having a boiling chamber with submerged condensation and method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060124281A1 (en) * 2003-06-26 2006-06-15 Rosenfeld John H Heat transfer device and method of making same
CN1877241A (zh) * 2005-06-08 2006-12-13 财团法人工业技术研究院 热传组件的复合式毛细结构
US20070056712A1 (en) * 2005-09-09 2007-03-15 Delta Electronics, Inc. Heat dissipation module and heat pipe thereof
US20130112376A1 (en) * 2007-12-19 2013-05-09 Teledyne Scientific & Imaging, Llc Heat pipe system
CN113437034A (zh) * 2021-08-25 2021-09-24 中兴通讯股份有限公司 均温板及电子设备

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB743057A (en) * 1951-06-30 1956-01-11 Meyer Schlioma Frenkel Improvements in or relating to evaporators
US9257365B2 (en) 2013-07-05 2016-02-09 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling assemblies and power electronics modules having multiple-porosity structures
US10660236B2 (en) 2014-04-08 2020-05-19 General Electric Company Systems and methods for using additive manufacturing for thermal management
WO2017100568A2 (en) * 2015-12-11 2017-06-15 Purdue Research Foundation Vapor chamber heat spreaders and methods of manufacturing thereof
US10495387B2 (en) 2017-03-10 2019-12-03 Toyota Motor Engineering & Manufacturing North America, Inc. Multi-layer wick structures with surface enhancement and fabrication methods
US20190082560A1 (en) 2017-09-08 2019-03-14 Toyota Motor Engineering & Manufacturing North America, Inc. Systems and methods for additive manufacturing of wick structure for vapor chamber
US10820454B2 (en) 2018-01-31 2020-10-27 Toyota Motor Engineering & Manufacturing North America, Inc. Vapor chamber heat spreaders with engineered vapor and liquid flow paths
US10948241B2 (en) * 2018-10-25 2021-03-16 Toyota Motor Engineering & Manufacturing North America, Inc. Vapor chamber heat spreaders having improved transient thermal response and methods of making the same
TWI811504B (zh) * 2019-12-16 2023-08-11 訊凱國際股份有限公司 散熱裝置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060124281A1 (en) * 2003-06-26 2006-06-15 Rosenfeld John H Heat transfer device and method of making same
CN1877241A (zh) * 2005-06-08 2006-12-13 财团法人工业技术研究院 热传组件的复合式毛细结构
US20070056712A1 (en) * 2005-09-09 2007-03-15 Delta Electronics, Inc. Heat dissipation module and heat pipe thereof
US20130112376A1 (en) * 2007-12-19 2013-05-09 Teledyne Scientific & Imaging, Llc Heat pipe system
CN113437034A (zh) * 2021-08-25 2021-09-24 中兴通讯股份有限公司 均温板及电子设备

Also Published As

Publication number Publication date
CN116075121A (zh) 2023-05-05
US12135152B2 (en) 2024-11-05
US20230138653A1 (en) 2023-05-04

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