JP7185420B2 - 沸騰冷却装置 - Google Patents
沸騰冷却装置 Download PDFInfo
- Publication number
- JP7185420B2 JP7185420B2 JP2018099850A JP2018099850A JP7185420B2 JP 7185420 B2 JP7185420 B2 JP 7185420B2 JP 2018099850 A JP2018099850 A JP 2018099850A JP 2018099850 A JP2018099850 A JP 2018099850A JP 7185420 B2 JP7185420 B2 JP 7185420B2
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- JP
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- Prior art keywords
- heat
- power semiconductor
- grooves
- receiving jacket
- fine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
- F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
- F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
- F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
2 水冷チューブ
3 冷媒
4 熱伝導グリース
5 放熱板(DBC基板の外側)
6 凝縮器
7 気泡
8 受熱ジャケット
9 冷却水
10 パワー半導体
11 往路管
12 復路管
13 基板又は押さえ具(DBC基板の外側)
14 絶縁体(DBC基板のセラミック)
15 溝
15a 微細縦溝
15b 微細横溝
16 ヒータ
17 銅ブロック
18 ベークライト断熱板
19 アルミジャケット
20 シールリング
21 ネジ
22 断面
25 冷媒
50 評価器具
100 沸騰冷却装置
Claims (4)
- 垂直に配置されたパワー半導体と、
前記パワー半導体の左右両面に設けられる放熱板と、
前記パワー半導体の左右両側に設けられ、前記放熱板を覆う受熱ジャケットと、
前記受熱ジャケット内に充填され、前記放熱板に直接接触する冷媒と、
前記受熱ジャケットと往路管と復路管で連結される凝縮器と、
前記放熱板の放熱面に形成され、垂直方向に延びる複数の微細縦溝と、
が備えられ、
前記パワー半導体の熱により、前記放熱面に設けた前記微細縦溝により気泡の生成を促進し、生成された気泡は上昇して前記往路管を通って凝縮器に至り、液体となって復路管で再び前記受熱ジャケットに戻ることを特徴とする沸騰冷却装置。
- 垂直に配置されたパワー半導体と、
前記パワー半導体の左右両面に設けられる放熱板と、
前記パワー半導体の左右両側に設けられ、前記放熱板を覆う受熱ジャケットと、
前記受熱ジャケット内に充填され、前記放熱板に直接接触する冷媒と、
前記受熱ジャケットと往路管と復路管で連結される凝縮器と、
前記放熱板の放熱面に形成され、垂直方向に延びる複数の微細縦溝と、前記微細縦溝に交差し、水平方向に延びる複数の微細横溝からなるメッシュ状溝と、
が備えられ、
前記パワー半導体の熱により、前記放熱面の設けた前記メッシュ状溝により気泡の生成を促進し、生成された気泡は上昇して前記往路管を通って凝縮器に至り、液体となって復路管で再び前記受熱ジャケットに戻ることを特徴とする沸騰冷却装置。
- 前記微細縦溝は、50μm以下の溝幅であることを特徴とする請求項1又は2に記載の沸騰冷却装置。
- 前記微細縦溝は、前記放熱面に対するレーザー加工によって形成されていることを特徴とする請求項1乃至3のいずれか1項に記載の沸騰冷却装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018099850A JP7185420B2 (ja) | 2018-05-24 | 2018-05-24 | 沸騰冷却装置 |
KR1020180093467A KR102540540B1 (ko) | 2018-05-24 | 2018-08-10 | 비등 냉각 장치 |
US16/195,958 US10685901B2 (en) | 2018-05-24 | 2018-11-20 | Boiling cooling device |
CN201811509580.1A CN110530181A (zh) | 2018-05-24 | 2018-12-11 | 沸腾冷却装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018099850A JP7185420B2 (ja) | 2018-05-24 | 2018-05-24 | 沸騰冷却装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019204899A JP2019204899A (ja) | 2019-11-28 |
JP7185420B2 true JP7185420B2 (ja) | 2022-12-07 |
Family
ID=68614006
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018099850A Active JP7185420B2 (ja) | 2018-05-24 | 2018-05-24 | 沸騰冷却装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10685901B2 (ja) |
JP (1) | JP7185420B2 (ja) |
KR (1) | KR102540540B1 (ja) |
CN (1) | CN110530181A (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7456185B2 (ja) * | 2019-12-18 | 2024-03-27 | 富士電機株式会社 | 沸騰冷却器 |
JP7537671B2 (ja) | 2021-05-18 | 2024-08-21 | 株式会社ロータス・サーマル・ソリューション | 沸騰冷却装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001068611A (ja) | 1999-08-31 | 2001-03-16 | Denso Corp | 沸騰冷却器 |
JP2001345589A (ja) | 2000-06-01 | 2001-12-14 | Fuji Electric Co Ltd | 電子機器冷却装置 |
WO2008090726A1 (ja) | 2007-01-24 | 2008-07-31 | Nec Corporation | 熱交換装置 |
US20110198059A1 (en) | 2008-08-01 | 2011-08-18 | Commissariat A L'energie Atomique Et Aux Ene Alt | Heat exchange structure and cooling device comprising such a structure |
Family Cites Families (21)
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JPS5265341A (en) * | 1975-11-27 | 1977-05-30 | Mitsubishi Electric Corp | Heat radiation body |
JPS5546331A (en) * | 1978-09-25 | 1980-04-01 | Borukano Kk | Heat pipe |
JPS61109143U (ja) * | 1984-12-24 | 1986-07-10 | ||
JPS61176141A (ja) * | 1985-01-31 | 1986-08-07 | Fujitsu Ltd | 固体集積回路部品の冷却装置 |
JPH073846B2 (ja) * | 1986-07-14 | 1995-01-18 | 株式会社日立製作所 | 半導体装置 |
US6679315B2 (en) * | 2002-01-14 | 2004-01-20 | Marconi Communications, Inc. | Small scale chip cooler assembly |
CN2812497Y (zh) * | 2005-06-15 | 2006-08-30 | 黄涛 | 电子镇流器的散热罩 |
KR101007850B1 (ko) * | 2008-07-25 | 2011-01-14 | 한국에너지기술연구원 | 히트파이프가 설치된 amtec장치 |
JP5210997B2 (ja) * | 2009-08-28 | 2013-06-12 | 株式会社日立製作所 | 冷却システム、及び、それを用いる電子装置 |
KR101084349B1 (ko) * | 2009-10-21 | 2011-11-17 | 주식회사 자온지 | 히트파이프형 방열장치의 제조방법 |
JP5702988B2 (ja) * | 2010-01-29 | 2015-04-15 | 株式会社 日立パワーデバイス | 半導体パワーモジュール及びそれが搭載される電力変換装置並びに半導体パワーモジュール搭載用水路形成体の製造方法 |
CN102834688B (zh) * | 2010-03-29 | 2015-07-15 | 日本电气株式会社 | 相变冷却器和设有该相变冷却器的电子设备 |
JP2013155925A (ja) | 2012-01-30 | 2013-08-15 | Toyota Motor Corp | 沸騰冷却器 |
EP2645040B1 (en) * | 2012-03-28 | 2017-06-21 | ABB Research Ltd. | Heat exchanger for traction converters |
EP2703763A1 (en) * | 2012-09-03 | 2014-03-05 | ABB Technology AG | Evaporator with integrated pre-heater for power electronics cooling |
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WO2015107899A1 (ja) * | 2014-01-16 | 2015-07-23 | 日本電気株式会社 | 冷却装置及び電子装置 |
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WO2018051499A1 (ja) * | 2016-09-16 | 2018-03-22 | 三菱電機株式会社 | 冷凍サイクル装置 |
US10224268B1 (en) * | 2016-11-28 | 2019-03-05 | CoolStar Technology, Inc. | Enhanced thermal transfer in a semiconductor structure |
US11252847B2 (en) * | 2017-06-30 | 2022-02-15 | General Electric Company | Heat dissipation system and an associated method thereof |
-
2018
- 2018-05-24 JP JP2018099850A patent/JP7185420B2/ja active Active
- 2018-08-10 KR KR1020180093467A patent/KR102540540B1/ko active IP Right Grant
- 2018-11-20 US US16/195,958 patent/US10685901B2/en active Active
- 2018-12-11 CN CN201811509580.1A patent/CN110530181A/zh active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001068611A (ja) | 1999-08-31 | 2001-03-16 | Denso Corp | 沸騰冷却器 |
JP2001345589A (ja) | 2000-06-01 | 2001-12-14 | Fuji Electric Co Ltd | 電子機器冷却装置 |
WO2008090726A1 (ja) | 2007-01-24 | 2008-07-31 | Nec Corporation | 熱交換装置 |
CN101589287A (zh) | 2007-01-24 | 2009-11-25 | 日本电气株式会社 | 热交换器单元 |
US20100012299A1 (en) | 2007-01-24 | 2010-01-21 | Nec Corporation | Heat exchanger unit |
US20110198059A1 (en) | 2008-08-01 | 2011-08-18 | Commissariat A L'energie Atomique Et Aux Ene Alt | Heat exchange structure and cooling device comprising such a structure |
JP2011530195A (ja) | 2008-08-01 | 2011-12-15 | コミッサリア ア レネルジー アトミーク エ オ ゼネルジ ザルタナテイヴ | 熱交換構造およびそのような構造を備える冷却デバイス |
Also Published As
Publication number | Publication date |
---|---|
KR20190134438A (ko) | 2019-12-04 |
US10685901B2 (en) | 2020-06-16 |
JP2019204899A (ja) | 2019-11-28 |
CN110530181A (zh) | 2019-12-03 |
KR102540540B1 (ko) | 2023-06-05 |
US20190363035A1 (en) | 2019-11-28 |
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