WO2008090726A1 - 熱交換装置 - Google Patents

熱交換装置 Download PDF

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Publication number
WO2008090726A1
WO2008090726A1 PCT/JP2008/000023 JP2008000023W WO2008090726A1 WO 2008090726 A1 WO2008090726 A1 WO 2008090726A1 JP 2008000023 W JP2008000023 W JP 2008000023W WO 2008090726 A1 WO2008090726 A1 WO 2008090726A1
Authority
WO
WIPO (PCT)
Prior art keywords
section
channel
surface processing
heat transfer
transfer apparatus
Prior art date
Application number
PCT/JP2008/000023
Other languages
English (en)
French (fr)
Inventor
Hitoshi Sakamoto
Kazuyuki Mikubo
Sakae Kitajo
Original Assignee
Nec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corporation filed Critical Nec Corporation
Priority to US12/523,579 priority Critical patent/US20100012299A1/en
Priority to JP2008554994A priority patent/JPWO2008090726A1/ja
Publication of WO2008090726A1 publication Critical patent/WO2008090726A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Coating Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

　本発明によれば、基体上に金属よりなる表面処理部を有し、前記表面処理部が液体冷媒の流路に接している熱交換装置であって、前記液体冷媒は表面張力が水に比較して小さい液体であって、前記表面処理部は、前記流路側に複数の窪みを備え、前記窪みは前記窪みの入り口よりも断面積が徐々に狭くなる導入部と、変曲部を経て前記導入部に連なる空洞部と、を備え、前記変曲部と前記流路との最短距離が、前記空洞部と前記流路との最短距離より大きいポーラス構造であることを特徴とする熱交換装置が提供される。
PCT/JP2008/000023 2007-01-24 2008-01-15 熱交換装置 WO2008090726A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/523,579 US20100012299A1 (en) 2007-01-24 2008-01-15 Heat exchanger unit
JP2008554994A JPWO2008090726A1 (ja) 2007-01-24 2008-01-15 熱交換装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007014062 2007-01-24
JP2007-014062 2007-01-24

Publications (1)

Publication Number Publication Date
WO2008090726A1 true WO2008090726A1 (ja) 2008-07-31

Family

ID=39644301

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/000023 WO2008090726A1 (ja) 2007-01-24 2008-01-15 熱交換装置

Country Status (4)

Country Link
US (1) US20100012299A1 (ja)
JP (1) JPWO2008090726A1 (ja)
CN (1) CN101589287A (ja)
WO (1) WO2008090726A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010128067A1 (fr) * 2009-05-06 2010-11-11 Commissariat à l'énergie atomique et aux énergies alternatives Dispositif d'echange thermique a coefficient d'échange thermique augmenté et procédé de réalisation d'un tel dispositif
WO2012053624A1 (ja) * 2010-10-19 2012-04-26 日本電気株式会社 冷却装置及びその製造方法
JP2019204899A (ja) * 2018-05-24 2019-11-28 現代自動車株式会社Ｈｙｕｎｄａｉｍｏｔｏｒ Ｃｏｍｐａｎｙ 沸騰冷却装置

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9858341B2 (en) * 2006-08-02 2018-01-02 Jason Frankovitz Method and apparatus for remotely monitoring a social website
JP2009135142A (ja) * 2007-11-28 2009-06-18 Toyota Industries Corp 沸騰冷却装置
EP2119994A1 (en) * 2008-05-14 2009-11-18 Abb Research Ltd. Evaporator for a cooling circuit
CN102637654B (zh) * 2012-04-06 2014-09-10 上海交通大学 基于泡沫金属强化沸腾换热的芯片冷却装置
JP7277178B2 (ja) * 2019-02-28 2023-05-18 キヤノン株式会社 ウルトラファインバブル生成装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6219695A (ja) * 1985-07-18 1987-01-28 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 核沸騰空洞を有する伝熱素子
JP2002228389A (ja) * 2001-02-02 2002-08-14 Sangaku Renkei Kiko Kyushu:Kk 伝熱促進方法および沸騰伝熱面
JP2003293166A (ja) * 2002-04-02 2003-10-15 Kobe Steel Ltd 銅又は銅合金管及びその製造方法
JP2005093179A (ja) * 2003-09-16 2005-04-07 Nissan Motor Co Ltd マイクロチャネル型蒸発器
JP2005233477A (ja) * 2004-02-18 2005-09-02 Nissan Motor Co Ltd 蒸発器

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5145359A (ja) * 1974-10-16 1976-04-17 Hitachi Ltd Netsukokanheki
JPS5325379B2 (ja) * 1974-10-21 1978-07-26
JPS55113897A (en) * 1979-02-21 1980-09-02 Mitsubishi Electric Corp Production of boiling heat transfer surface
JPS5852993A (ja) * 1981-09-25 1983-03-29 Hitachi Ltd 多孔質伝熱面
US4709754A (en) * 1985-07-18 1987-12-01 International Business Machines Corp. Heat transfer element with nucleate boiling surface and bimetallic fin formed from element
JP3450148B2 (ja) * 1997-03-07 2003-09-22 三菱電機株式会社 ループ型ヒートパイプ
KR100801236B1 (ko) * 1998-08-28 2008-02-11 에자이 알앤드디 매니지먼트 가부시키가이샤 고미 등을 경감한 의약조성물
US7556086B2 (en) * 2001-04-06 2009-07-07 University Of Maryland, College Park Orientation-independent thermosyphon heat spreader
US20060088746A1 (en) * 2004-10-25 2006-04-27 3M Innovative Properties Company Passive dual-phase cooling for fuel cell assemblies

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6219695A (ja) * 1985-07-18 1987-01-28 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 核沸騰空洞を有する伝熱素子
JP2002228389A (ja) * 2001-02-02 2002-08-14 Sangaku Renkei Kiko Kyushu:Kk 伝熱促進方法および沸騰伝熱面
JP2003293166A (ja) * 2002-04-02 2003-10-15 Kobe Steel Ltd 銅又は銅合金管及びその製造方法
JP2005093179A (ja) * 2003-09-16 2005-04-07 Nissan Motor Co Ltd マイクロチャネル型蒸発器
JP2005233477A (ja) * 2004-02-18 2005-09-02 Nissan Motor Co Ltd 蒸発器

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010128067A1 (fr) * 2009-05-06 2010-11-11 Commissariat à l'énergie atomique et aux énergies alternatives Dispositif d'echange thermique a coefficient d'échange thermique augmenté et procédé de réalisation d'un tel dispositif
FR2945337A1 (fr) * 2009-05-06 2010-11-12 Commissariat Energie Atomique Dispositif d'echange thermique a coefficient d'echange thermique augmente et procede de realisation d'un tel dispositif
CN102422114A (zh) * 2009-05-06 2012-04-18 法国原子能及替代能源委员会 具有增大的热交换系数的热交换装置和用于生产该装置的方法
JP2012526257A (ja) * 2009-05-06 2012-10-25 コミッサリア ア レネルジー アトミーク エ オ ゼネルジ ザルタナテイヴ 熱交換係数を向上させた熱交換装置およびその装置を製造する方法
WO2012053624A1 (ja) * 2010-10-19 2012-04-26 日本電気株式会社 冷却装置及びその製造方法
JP2019204899A (ja) * 2018-05-24 2019-11-28 現代自動車株式会社Ｈｙｕｎｄａｉｍｏｔｏｒ Ｃｏｍｐａｎｙ 沸騰冷却装置
JP7185420B2 (ja) 2018-05-24 2022-12-07 現代自動車株式会社 沸騰冷却装置

Also Published As

Publication number Publication date
US20100012299A1 (en) 2010-01-21
JPWO2008090726A1 (ja) 2010-05-13
CN101589287A (zh) 2009-11-25

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