JPS5265341A - Heat radiation body - Google Patents
Heat radiation bodyInfo
- Publication number
- JPS5265341A JPS5265341A JP14189375A JP14189375A JPS5265341A JP S5265341 A JPS5265341 A JP S5265341A JP 14189375 A JP14189375 A JP 14189375A JP 14189375 A JP14189375 A JP 14189375A JP S5265341 A JPS5265341 A JP S5265341A
- Authority
- JP
- Japan
- Prior art keywords
- heat radiation
- radiation body
- heat conduction
- boiling heat
- inporous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Details Of Measuring And Other Instruments (AREA)
Abstract
PURPOSE: The radiation surface of the heat radiation body utilizing boiling heat conduction is formed inporous uneveness by sand-blast or liquid horning process, and moreover by applying the plating treatment, the surface is made porous, and thus thus the boiling heat conduction rate is improved.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14189375A JPS5265341A (en) | 1975-11-27 | 1975-11-27 | Heat radiation body |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14189375A JPS5265341A (en) | 1975-11-27 | 1975-11-27 | Heat radiation body |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5265341A true JPS5265341A (en) | 1977-05-30 |
Family
ID=15302606
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14189375A Pending JPS5265341A (en) | 1975-11-27 | 1975-11-27 | Heat radiation body |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5265341A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5710953A (en) * | 1980-06-23 | 1982-01-20 | Mitsubishi Electric Corp | Semiconductor device |
JPS60254637A (en) * | 1984-05-31 | 1985-12-16 | Fujitsu Ltd | Semiconductor element package for vapor cooling |
JP2019204899A (en) * | 2018-05-24 | 2019-11-28 | 現代自動車株式会社Hyundaimotor Company | Vapor cooling device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4886151A (en) * | 1972-02-18 | 1973-11-14 | ||
JPS4967250A (en) * | 1972-10-31 | 1974-06-29 |
-
1975
- 1975-11-27 JP JP14189375A patent/JPS5265341A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4886151A (en) * | 1972-02-18 | 1973-11-14 | ||
JPS4967250A (en) * | 1972-10-31 | 1974-06-29 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5710953A (en) * | 1980-06-23 | 1982-01-20 | Mitsubishi Electric Corp | Semiconductor device |
JPS6250983B2 (en) * | 1980-06-23 | 1987-10-28 | Mitsubishi Electric Corp | |
JPS60254637A (en) * | 1984-05-31 | 1985-12-16 | Fujitsu Ltd | Semiconductor element package for vapor cooling |
JPH038588B2 (en) * | 1984-05-31 | 1991-02-06 | Fujitsu Ltd | |
JP2019204899A (en) * | 2018-05-24 | 2019-11-28 | 現代自動車株式会社Hyundaimotor Company | Vapor cooling device |
CN110530181A (en) * | 2018-05-24 | 2019-12-03 | 现代自动车株式会社 | Boiling cooling device |
KR20190134438A (en) * | 2018-05-24 | 2019-12-04 | 현대자동차주식회사 | Boiling cooling system |
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