JP2023049306A - ガラスセラミック誘電体材料、焼結体、焼結体の製造方法及び高周波用回路部材 - Google Patents
ガラスセラミック誘電体材料、焼結体、焼結体の製造方法及び高周波用回路部材 Download PDFInfo
- Publication number
- JP2023049306A JP2023049306A JP2021158970A JP2021158970A JP2023049306A JP 2023049306 A JP2023049306 A JP 2023049306A JP 2021158970 A JP2021158970 A JP 2021158970A JP 2021158970 A JP2021158970 A JP 2021158970A JP 2023049306 A JP2023049306 A JP 2023049306A
- Authority
- JP
- Japan
- Prior art keywords
- sintered body
- inner layer
- dielectric material
- glass
- laminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002241 glass-ceramic Substances 0.000 title claims abstract description 28
- 239000003989 dielectric material Substances 0.000 title claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000011521 glass Substances 0.000 claims abstract description 28
- 239000000843 powder Substances 0.000 claims abstract description 24
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000000919 ceramic Substances 0.000 claims abstract description 11
- 239000000203 mixture Substances 0.000 claims abstract description 5
- 239000013078 crystal Substances 0.000 claims description 20
- NWXHSRDXUJENGJ-UHFFFAOYSA-N calcium;magnesium;dioxido(oxo)silane Chemical compound [Mg+2].[Ca+2].[O-][Si]([O-])=O.[O-][Si]([O-])=O NWXHSRDXUJENGJ-UHFFFAOYSA-N 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 15
- 229910052637 diopside Inorganic materials 0.000 claims description 15
- 238000010304 firing Methods 0.000 claims description 11
- 229910052709 silver Inorganic materials 0.000 claims description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- 238000013001 point bending Methods 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 8
- 238000005259 measurement Methods 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 4
- 238000005245 sintering Methods 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052681 coesite Inorganic materials 0.000 abstract description 3
- 229910052906 cristobalite Inorganic materials 0.000 abstract description 3
- 239000000377 silicon dioxide Substances 0.000 abstract description 3
- 235000012239 silicon dioxide Nutrition 0.000 abstract description 3
- 229910052682 stishovite Inorganic materials 0.000 abstract description 3
- 229910052905 tridymite Inorganic materials 0.000 abstract description 3
- 239000005340 laminated glass Substances 0.000 abstract 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 239000002002 slurry Substances 0.000 description 6
- 238000005452 bending Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 229910018068 Li 2 O Inorganic materials 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000010344 co-firing Methods 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 230000000930 thermomechanical effect Effects 0.000 description 3
- 238000004017 vitrification Methods 0.000 description 3
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- FUJCRWPEOMXPAD-UHFFFAOYSA-N Li2O Inorganic materials [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 description 2
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- XUCJHNOBJLKZNU-UHFFFAOYSA-M dilithium;hydroxide Chemical compound [Li+].[Li+].[OH-] XUCJHNOBJLKZNU-UHFFFAOYSA-M 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- NOTVAPJNGZMVSD-UHFFFAOYSA-N potassium monoxide Inorganic materials [K]O[K] NOTVAPJNGZMVSD-UHFFFAOYSA-N 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 230000001376 precipitating effect Effects 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N 1,4a-dimethyl-7-propan-2-yl-2,3,4,4b,5,6,10,10a-octahydrophenanthrene-1-carboxylic acid Chemical compound C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 239000006060 molten glass Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Glass Compositions (AREA)
- Compositions Of Oxide Ceramics (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021158970A JP2023049306A (ja) | 2021-09-29 | 2021-09-29 | ガラスセラミック誘電体材料、焼結体、焼結体の製造方法及び高周波用回路部材 |
| CN202211195023.3A CN115872624A (zh) | 2021-09-29 | 2022-09-28 | 玻璃陶瓷电介质材料、烧结体、烧结体的制造方法以及高频用电路部件 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021158970A JP2023049306A (ja) | 2021-09-29 | 2021-09-29 | ガラスセラミック誘電体材料、焼結体、焼結体の製造方法及び高周波用回路部材 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2023049306A true JP2023049306A (ja) | 2023-04-10 |
Family
ID=85770146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021158970A Pending JP2023049306A (ja) | 2021-09-29 | 2021-09-29 | ガラスセラミック誘電体材料、焼結体、焼結体の製造方法及び高周波用回路部材 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2023049306A (zh) |
| CN (1) | CN115872624A (zh) |
-
2021
- 2021-09-29 JP JP2021158970A patent/JP2023049306A/ja active Pending
-
2022
- 2022-09-28 CN CN202211195023.3A patent/CN115872624A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN115872624A (zh) | 2023-03-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7015160B2 (en) | Glass ceramic dielectric material suitable for production of a microwave circuit component | |
| JP4569000B2 (ja) | 高周波用低温焼結誘電体材料およびその焼結体 | |
| JPH0676227B2 (ja) | ガラスセラミツク焼結体 | |
| WO2021024620A1 (ja) | ガラス粉末、誘電体材料、焼結体及び高周波用回路部材 | |
| JP7498891B2 (ja) | ガラス粉末、誘電体材料、焼結体及び高周波用回路部材 | |
| JP2006256956A (ja) | ガラスセラミックス焼結体及びマイクロ波用回路部材 | |
| JPH10120436A (ja) | ガラスセラミック誘電体材料 | |
| JP2023049306A (ja) | ガラスセラミック誘電体材料、焼結体、焼結体の製造方法及び高周波用回路部材 | |
| JP7549289B2 (ja) | ガラスセラミック誘電体材料、焼結体及び高周波用回路部材 | |
| TWI850615B (zh) | 積層玻璃陶瓷介電體材料、燒結體、燒結體之製造方法及高頻用電路構件 | |
| CN117222607A (zh) | 玻璃陶瓷电介质材料、烧结体及高频用电路部件 | |
| KR20230142453A (ko) | 적층 유리 세라믹 유전체 재료, 소결체, 소결체의 제조방법 및 고주파용 회로 부재 | |
| JPH07242439A (ja) | 低温焼成ガラスセラミック基板およびその製造方法 | |
| CN115724588A (zh) | 结晶性玻璃粉末、玻璃陶瓷电介质材料、烧结体和高频电路部件 | |
| WO2022230475A1 (ja) | ガラスセラミック誘電体材料、焼結体及び高周波用回路部材 | |
| JP2003095740A (ja) | ガラスセラミック誘電体材料および焼結体 | |
| JP2023033104A (ja) | 結晶性ガラス粉末、ガラスセラミック誘電体材料、焼結体及び高周波回路部材 | |
| CN116848594A (zh) | 层叠玻璃陶瓷电介质材料、烧结体、烧结体的制造方法以及高频用电路部件 | |
| JP2022171535A (ja) | ガラスセラミック誘電体材料、焼結体及び高周波用回路部材 | |
| JP3315233B2 (ja) | セラミック基板用組成物 | |
| JP3125500B2 (ja) | セラミックス基板 | |
| JP2003095739A (ja) | ガラスセラミック誘電体材料および焼結体 | |
| JP2005082415A (ja) | ガラスセラミック誘電体材料、焼結体及び高周波用回路部材 | |
| JP2003327450A (ja) | ガラスセラミック誘電体材料 | |
| JP2012051767A (ja) | 結晶性ガラス粉末 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240805 |